A hydrophobic conductive film (10), a preparation method therefor, and a use thereof, relating to the technical field of
semiconductor preparation. The method comprises the following steps: 1) performing a pre-zincation treatment on a surface of a substrate (20), and forming a saturated
zinc atom layer (11); 2) alternately feeding a
zinc precursor and an
oxygen precursor into a
reaction chamber and introducing an
inert gas for purging, and growing a
zinc oxide film layer (12) on a surface of the saturated
zinc atom layer (11); 3) performing a post-zincation treatment on the zinc
oxide film layer (12) to form a zincated
transition layer (13); 4) performing a fluorination post-treatment on the zincated
transition layer (13) and forming a
zinc fluoride surface layer (14). The prepared hydrophobic conductive film (10) has the characteristics of strong hydrophobicity, good adhesion to the substrate, high film reliability, good
film density, precise and controllable thickness, good film uniformity, high step coverage, and high
optical transmittance. Compared with microstructures, the hydrophobic conductive film has greater stability, is compatible with various
semiconductor packaging processes, effectively resists environmental interference, and can be applied in various hydrophobic scenarios.