A method of preparing a gan-based laser and a gan-based laser
A laser and confinement layer technology, applied in lasers, laser parts, semiconductor lasers, etc., can solve the difficulty of GaN laser chip preparation, the inability to purchase epitaxial wafers of GaN-based lasers from abroad, and development constraints and other problems to achieve the effect of improving the light confinement effect, increasing the recombination efficiency, and increasing the confinement factor
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[0032] Use Aixtron company, tightly coupled vertical reaction chamber MOCVD growth system. During the growth process, at least one of trimethylgallium (TMGa), trimethylindium (TMIn), trimethylaluminum (TMAl) was used as a group III source, ammonia gas (NH 3 ) as the Group V source, silane (SiH 4 ) as an n-type dopant source, magnesiumocene (Cp 2 Mg) as a p-type dopant source, firstly heat the GaN substrate 101 to 1050 degrees Celsius in the MOCVD reaction chamber, hydrogen (H 2 ) atmosphere, using TMGa as the III source, NH 3 As a Group V source, SiH 4 4 micron thick n-GaN 102 grown as an n-type dopant source with an electron concentration of 5×10 18 cm -3 ; in hydrogen (H 2 ) atmosphere, at 850 ° C ~ 1050 ° C, using TMGa, TMAl and TMIn as the group III source, NH 3 As a group V source, SiH4 is used as an n-type dopant source to grow 150 cycles of modulation-doped Al composition and n-Al with In composition and asymmetric structure 0.15 Ga 0.85 N / GaN / Al 0.15 In 0.05...
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