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Conductive ceramic powder-based polyimide conductive rubber and preparation method thereof

A polyimide type, conductive ceramic technology, applied in the direction of conductive adhesives, adhesives, non-polymer adhesive additives, etc., can solve the problems of poor mechanical properties and heat resistance of epoxy conductive adhesives, and achieve the goal of overcoming Low temperature resistance, overcoming poor stability, excellent stability and heat resistance

Inactive Publication Date: 2015-02-25
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems of poor mechanical properties and heat resistance of epoxy conductive adhesive, the present invention provides a conductive adhesive with polyimide as the matrix and conductive ceramic powder as the conductive filler that is more suitable for use in high temperature environments and its preparation method

Method used

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  • Conductive ceramic powder-based polyimide conductive rubber and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1: Conductive adhesive is configured according to the following formula in parts by mass:

[0026] Polymer matrix (polyimide): 100;

[0027] Conductive filler (rare earth modified calcium manganate powder): 40;

[0028] Thinner (styrene): 30;

[0029] Thermal curing agent (triethanolamine): 10;

[0030] Thermal Initiator (BPO): 4;

[0031] Photoinitiator (TPO): 2;

[0032] Curing accelerator (2-ethyl-4-methylimidazole): 2

[0033] Conductivity enhancer (polyethylene glycol 400): 2;

[0034] Silane coupling agent (KH-550): 2.

[0035] Weigh the amount of diluent styrene according to the designed amount, and then add the resin matrix polyimide, coupling agent KH550, photoinitiator BPO and thermal initiator TPO according to the designed amount. Oscillation is performed with an ultrasonic oscillator, and after ultrasonic oscillation for 5 minutes, a resin mixture with a viscosity much lower than that of the polyimide resin is obtained. Then add conductive...

Embodiment 2

[0036] Embodiment 2: configure the conductive adhesive according to the following formula in parts by mass:

[0037] Polymer matrix (polyimide): 100;

[0038] Conductive filler (rare earth modified calcium manganate powder): 50;

[0039] Thinner (styrene): 40;

[0040] Thermal curing agent (triethanolamine): 10;

[0041] Thermal Initiator (BPO): 4;

[0042] Photoinitiator (TPO): 2;

[0043] Curing accelerator (2-ethyl-4-methylimidazole): 2;

[0044] Conductivity accelerator (polyethylene glycol 400): 1;

[0045] Silane coupling agent (KH-550): 2.

[0046] Weigh the amount of diluent styrene according to the designed amount, and then add the resin matrix polyimide, coupling agent KH550, photoinitiator BPO and thermal initiator TPO according to the designed amount. Oscillation is performed with an ultrasonic oscillator, and after ultrasonic oscillation for 5 minutes, a resin mixture with a viscosity much lower than that of the polyimide resin is obtained. Then add conduc...

Embodiment 3

[0047] Embodiment 3: configure the conductive adhesive according to the following formula in parts by mass:

[0048] Polymer matrix (polyimide): 100;

[0049] Conductive filler (rare earth modified calcium manganate powder): 40;

[0050] Thinner (styrene): 40;

[0051] Thermal curing agent (triethanolamine): 10;

[0052] Thermal Initiator (BPO): 4;

[0053] Photoinitiator (TPO): 2;

[0054] Curing accelerator (2-ethyl-4-methylimidazole): 2;

[0055] Conductivity accelerator (polyethylene glycol 400): 1;

[0056] Silane coupling agent (KH-550): 2.

[0057] Weigh the amount of diluent styrene according to the designed amount, and then add the resin matrix polyimide, coupling agent KH550, photoinitiator BPO and thermal initiator TPO according to the designed amount. Oscillation is performed with an ultrasonic oscillator, and after ultrasonic oscillation for 5 minutes, a resin mixture with a viscosity much lower than that of the polyimide resin is obtained. Then add conducti...

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Abstract

The invention discloses conductive ceramic powder-based polyimide conductive rubber and a preparation method thereof. The conductive rubber comprises the following components in parts by weight: 100 parts of polyimide as resin matrix, 40-50 parts of conductive ceramic powder as conductive packing, 30-40 parts of styrene as a diluent, 2-5 parts of a silane coupling agent KH550 as a coupling agent, 8-10 parts of triethanolamine as a heat curing agent, 2-4 parts of TPO (theroplastic polyolefin) as a photoinitiator, 2-4 parts of BPO (benzoyl peroxide) as a thermal initiator, 2-4 parts of 2-ethyl-4-methylimidazole as a curing accelerator, and 1-2 parts of polyethylene glycol 400 as a conductive promoter; and the solidifying mode is heat solidification at a medium temperature. The polyimide conductive rubber obtained by the method is excellent in stability and heat resistance; and the defects that epoxy resin conductive rubber is poor in stability and high-temperature resistance can be overcome.

Description

technical field [0001] The invention relates to a novel conductive adhesive and a preparation method thereof, in particular to a conductive adhesive with polyimide as a matrix and conductive ceramic powder as a conductive filler and a preparation method thereof. Background technique [0002] Conductive adhesive has replaced the application of lead-tin solder on tiny components with its advantages of low carbon, environmental protection and refinement. Epoxy resin conductive adhesive, which has been studied more at present, has the characteristics of environmental protection, low bonding temperature, good controllability and high resolution, but also has disadvantages such as brittleness and poor mechanical properties. Using polyimide instead of epoxy resin as the resin matrix can overcome these shortcomings and obtain better application performance. [0003] Polyimide (PI) refers to a class of polymers with imide rings on the main chain. It is known as one of the organic p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J4/06C09J11/04C09J11/06
Inventor 郝素娥吴邕尤胜杰孙田成华可黄兴脉张加静
Owner HARBIN INST OF TECH
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