High-detectivity gallium-nitride-based Schottky ultraviolet detector using graphene
An ultraviolet detector, GaN-based technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of unsatisfactory metal materials, fixed work function, and decreased light transmittance, so as to enhance the built-in electric potential field, Effect of increasing responsivity and increasing quantum efficiency
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Embodiment 1
[0029] Step 1. Use metal-organic chemical vapor deposition (or molecular beam epitaxy system, liquid phase epitaxy technology, etc.) to sequentially fabricate heavily doped n-type gallium nitride 101, lightly doped hetero n-type gallium nitride 102 .
[0030] Step 2, cleaning the epitaxial wafer, photolithography, and etching to form a mesa structure, such as heavily doped n-type GaN 101 and lightly doped n-type GaN 102 .
[0031] Step 3, growing a layer of silicon dioxide, and performing photolithography and etching to form a silicon dioxide insulating layer 103 .
[0032] Step 4, photoetching the electrode pattern, sputtering or evaporating to make the metal electrode 104 .
[0033] Step 5, transfer the graphene to the surface of the device, photolithographically etch the graphene pattern, and plasma etch the graphene to form a graphene film 105 . The plasma etching gas is oxygen, the flow rate is 10-70L / min, the power is 50-100W, and the etching time is 30s-600s. The con...
Embodiment 2
[0038] Step 1. Use metal-organic chemical vapor deposition (or molecular beam epitaxy system, liquid phase epitaxy technology, etc.) to sequentially fabricate heavily doped n-type GaN 101 on sapphire (or silicon wafer, silicon carbide, etc. substrates), lightly doped hetero n-type gallium nitride 102 .
[0039] Step 2, using inductively coupled plasma etching to etch the surface of the epitaxial wafer, the etching depth is 10-50 nm, and increasing the defect density on the surface of the epitaxial wafer.
[0040] Step 3: Clean the epitaxial wafer, perform photolithography, and etch to form a mesa structure, such as heavily doped n-type GaN 101 and lightly doped n-type GaN 102 .
[0041] Step 4, growing a layer of silicon dioxide, and performing photolithography and etching to form a silicon dioxide insulating layer 103 .
[0042] Step 5, photoetching the electrode pattern, sputtering or evaporating to make the metal electrode 104 .
[0043]Step 6, transfer the graphene to th...
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