A special solder paste for patch diode welding

A technology of solder paste and diodes, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of poor solderability, many residues, residues, etc., achieve good foaming performance, and improve wettability , The effect of strong soldering ability

Active Publication Date: 2016-06-01
RUGAO DACHANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because of its soft effect, the corrosiveness it brings is extremely small, and generally does not cause major harm. However, the prepared solder paste has weak activity and poor solderability, which is easy to cause virtual soldering.
2. There are many residues after welding
As a result, when the printed board assembly heats up rapidly during soldering and heating, the solvent in the solder paste cannot be completely evaporated and a large amount of residue is formed after soldering. Not only the appearance is not good, but also sticky
3. Poor thixotropy

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A special solder paste for patch diode welding, which is mixed with 8% flux, 20% tin-bismuth alloy solder powder and 72% Sn-Ag-Cu series solder powder based on the weight of the solder paste.

[0018] Specifically, the content of tin in the tin-bismuth alloy solder powder is 30%, and the content of bismuth is 70%.

[0019] Specifically, the Sn-Ag-Cu series solder powder includes 80% Sn powder, 7% Ag powder, and 13% Cu powder.

[0020] The flux includes the mass percentage of the following components: 5% phenolic resin, 1% malonic acid, 1.4% 2,3-pyridine-dicarboxylic acid, 0.3% lactic acid, 0.3% benzoic acid, 6-% n-butyl lactate, ethyl Glycol 5%, alcohol polyoxyethylene ether 1.1%, nitromethane 1.2%, and the balance is ethanol.

Embodiment 2

[0022] A special solder paste for patch diode welding, which is mixed with 10% flux, 10% tin-bismuth alloy solder powder and 80% Sn-Ag-Cu series solder powder based on the weight of the solder paste.

[0023] Specifically, the tin-bismuth alloy solder powder contains 50% tin and 50% bismuth.

[0024] Specifically, the Sn-Ag-Cu series solder powder includes 92% Sn powder, 5% Ag powder, and 3% Cu powder.

[0025] The flux includes the mass percentage of the following components: 10% phenolic resin, 3% malonic acid, 1.8% 2,3-pyridine-dicarboxylic acid, 1.5% lactic acid, 1.1% benzoic acid, 12% n-butyl lactate, ethylene glycol Alcohol 15%, alcohol polyoxyethylene ether 2.1%, nitromethane 1.8%, and the balance is ethanol.

Embodiment 3

[0027] A special solder paste for SMD diode welding, based on the weight of the solder paste, it is mixed with 9% flux, 16% tin-bismuth alloy solder powder and 75% Sn-Ag-Cu series solder powder.

[0028] Specifically, the content of tin in the tin-bismuth alloy solder powder is 40%, and the content of bismuth is 60%.

[0029] Specifically, the Sn-Ag-Cu series solder powder includes 88% Sn powder, 6% Ag powder, and 6% Cu powder.

[0030] The flux includes the mass percentages of the following components: 8% phenolic resin, 2% malonic acid, 1.6% 2,3-pyridine-dicarboxylic acid, 1.2% lactic acid, 0.8% benzoic acid, 10% n-butyl lactate, ethylene glycol Alcohol 8%, alcohol polyoxyethylene ether 1.7%, nitromethane 1.5%, and the balance is ethanol.

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PUM

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Abstract

The invention discloses special soldering paste for welding a chip diode. The special soldering paste is characterized in that the soldering paste comprises, by weight, 8-10% of soldering flux, 10-20% of tin-bismuth alloy soldering powder and 72-80% of Sn-Ag-Cu series soldering powder which are mixed. Experiments prove that the soldering paste with components and a proper ratio can effectively ensure welding quality and can further be effectively applied to electronic components. High activity of the soldering flux in the whole welding process can be effectively kept. Besides, the activation temperature of the soldering flux adapts to the melting point of lead-free solder, and the wetting property, the oxidization resistance and the welding performance of the lead-free solder are greatly improved.

Description

technical field [0001] The invention relates to a solder paste, in particular to a special solder paste for patch diode welding. Background technique [0002] Solder paste is a new type of soldering material that accompanies SMT. Solder paste is a complex system, which is a paste mixed with solder powder, flux and other additives. Solder paste has a certain viscosity at room temperature, which can initially stick electronic components to a predetermined position. At the soldering temperature, with the volatilization of solvents and some additives, the soldered components and printed circuit pads are welded together to form Permanent connection. [0003] Solder paste is widely used in high-precision electronic components. On the one hand, solder paste can isolate electronic components from the air, thereby achieving isolation and preventing oxidation; on the other hand, solder paste can ensure strong soldering performance of electronic components. , so as to achieve high r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363
CPCB23K35/362
Inventor 黄丽凤王志敏张龙
Owner RUGAO DACHANG ELECTRONICS
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