PID-resistant encapsulation adhesive film used for photovoltaic cell

A technology for encapsulating adhesive films and photovoltaic cells, which is applied in photovoltaic power generation, circuits, adhesives, etc., can solve problems that are not conducive to the aging resistance of encapsulating adhesive films, a large amount of volatilization of silane coupling agents, and the decline in polyolefin insulation performance, and achieve excellent performance. Anti-PID performance, improve aging resistance, avoid the effect of PID effect

Active Publication Date: 2015-04-22
SUZHOU DUCHAMPS ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the first solution, as mentioned above, polar groups (ester groups, acid anhydride groups, epoxy groups) cannot avoid the generation of hydrolysis, and will lead to a significant decline in the insulation properties of polyolefins, which will make the package Adhesive film does not have anti-PID performance
In addition, polar groups are not conducive to the aging resistance of encapsulation film
For the second solution, unlike EVA...

Method used

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  • PID-resistant encapsulation adhesive film used for photovoltaic cell
  • PID-resistant encapsulation adhesive film used for photovoltaic cell
  • PID-resistant encapsulation adhesive film used for photovoltaic cell

Examples

Experimental program
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Embodiment

[0035] The polyolefin resins adopted in the following examples are all purchased from American Dow Company or American DuPont Company. The melt index under the conditions of 190°C and 2.16 kg load is 15 to 35 grams / 10 minutes, and the melting point measured by differential scanning calorimetry is It is 60-100°C, and the Vicat softening point is greater than 45°C.

[0036] Preparation of anti-PID packaging film for photovoltaic cells

[0037]Add clathrate polysilsesquioxane, peroxide crosslinking agent, co-crosslinking agent, light stabilizer, and ultraviolet light absorber to polyolefin resin, mix all raw materials evenly, and melt them in a single-screw extruder Extruded, then cast, cooled, coiled and other processes to finally obtain the encapsulation film.

[0038] Preparation of Photovoltaic Cell Modules

[0039] Use the encapsulation adhesive film of embodiment to prepare photovoltaic cell assembly, such as figure 1 As shown, the upper layer is tempered glass, the midd...

Embodiment 1

[0041] Add 10 parts of chlorine-based clathrate polysilsesquioxane, 2 parts of peroxide crosslinking agent bis(tert-butyl cumene peroxide) (Akzo Nobel, Perkadox 14s) in 100 parts (parts by mass) of polyolefin resin -f1), 0.5 part of co-crosslinking agent trimethylol propyl trimethacrylate (Sartomer, SR351), 0.1 part of UV absorber 2-hydroxyl-4-n-octyloxybenzophenone and 0.1 part of light stabilizer bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate, mix all raw materials evenly, put them into a single-screw extruder to melt and extrude, and then flow through Stretching, cooling, pulling, coiling and other processes to obtain packaging film A1, the weight of the film (the quality of the film whose length and width are 10cm×10cm) is 4g.

[0042] The resulting encapsulation film is prepared into a photovoltaic cell assembly, such as figure 1 As shown, the upper layer is a glass substrate 1 with a thickness of 3 mm, the middle layer is a battery sheet 3 , the lower layer is a fluori...

Embodiment 2

[0044] Add 15 parts of ethoxyl clathrate polysilsesquioxane, 1.5 parts of peroxide crosslinking agent 2,5-dimethyl-2,5-bis(tert-butyl) to 100 parts by mass of polyolefin resin Peroxide) hexane (AkzoNobel, TRIGONOX 101), 0.55 part of cross-linking agent trimethylolpropyl trimethacrylate (Sartomer, SR351), 0.15 part of ultraviolet light absorber 2-hydroxyl-4 -n-octyloxybenzophenone and 0.15 parts of light stabilizer bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate, mix all raw materials evenly, add to single screw extruder Melting and extruding in the machine, and then through casting, cooling, pulling, coiling and other processes, the encapsulation film A2 is obtained.

[0045] The resulting encapsulation film is prepared into a photovoltaic cell assembly, such as figure 1 As shown, the upper layer is a glass substrate 1 with a thickness of 3 mm, the middle layer is a battery sheet 3 , the lower layer is a fluorine-containing material back plate 4 with a thickness of 0.33 mm, a...

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Abstract

The invention discloses a PID-resistant encapsulation adhesive film used for a photovoltaic cell. The PID-resistant encapsulation adhesive film comprises, by mass, polyolefin resin 80%-95%, polyhedral oligomeric silsesquioxane 1%-20%, a peroxide crosslinking agent 0.1-2%, an auxiliary crosslinking agent 0.01-1%, a light stabilizing agent and an ultraviolet absorber, wherein the polyolefin resin is an ethylene/alpha-olefin copolymer or a composition of the ethylene/alpha olefin copolymer; the polyhedral oligomeric silsesquioxane contains a hydrolysable radical which is selected from one or more of a methoxy group, an ethoxy group, a methoxyethoxy group and an acetoxyl group. The PID-resistant encapsulation adhesive film has good adhesive performance and ageing-resistant performance while having excellent PID-resistant performance, thereby having positive practical significance.

Description

technical field [0001] The invention relates to an anti-PID packaging adhesive film for photovoltaic cells. Background technique [0002] With the depletion of petrochemical energy and the seriousness of environmental problems, renewable energy has received unprecedented attention, and photovoltaic cells are therefore becoming more and more popular. However, in recent years, it has been found that photovoltaic modules, especially large-scale photovoltaic modules, experience a large power attenuation phenomenon after a short period of use. After research, it is found that a considerable number of problematic component power attenuation is caused by potential potential induced degradation, that is, PID (Potential Induced Degradation). [0003] Currently, there is no clear mechanism for the formation of PID. According to the research, a large part of the PID problem is due to the leakage current between the solar cells of the module and the ground, and the leakage current pat...

Claims

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Application Information

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IPC IPC(8): C09J7/00C09J123/08C09J11/06H01L31/048
CPCY02E10/50
Inventor 罗吉江符书臻
Owner SUZHOU DUCHAMPS ADVANCED MATERIALS CO LTD
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