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Heat conduction adhesive

A technology of adhesive and thermally conductive agent

Active Publication Date: 2015-04-29
HUIZHOU KINGBALI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, COB LED has been accepted by more and more LED manufacturers, but one of the most difficult problems to overcome when using COB is the heat dissipation problem caused by the concentration of large power in a small area

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Example 1 The preparation of the thermally conductive adhesive of the present invention is achieved by the following steps: 28 parts of epoxy resin, 6 parts of acrylic resin, 22 parts of spherical alumina, 15 parts of silicon carbide, 5 parts of methacryloxy silicon, butanediol 2 parts of alkenyl triethoxysilane, 13 parts of cycloaliphatic amine epoxy resin curing agent, 2 parts of salicylic acid, 2 parts of lubricant, its preparation adopts the following steps:

[0018] (1) Dilute methacryloxysilicon with absolute ethanol to a mass fraction of 12%, dry 22 parts of spherical alumina and silicon carbide at 90°C for 5 minutes, and dilute the diluted methacryloxysilicon with The dried heat-conducting agent was mixed in a high-speed dispersion mixer to prepare mixture A; add butadienyltriethoxysilane and acrylic resin to the planetary dispersion mixer, stir for 0.5h, then add mixture A and continue stirring for 1h, add ring Oxygen resin, continue stirring for 1h to obtain m...

Embodiment 2

[0022] Embodiment 2 The preparation of the thermally conductive adhesive of the present invention is realized by using the following formula and steps: 38 parts of epoxy resin, 11 parts of acrylic resin, thermal conductive agent (aluminum nitride, aluminum oxide, silicon oxide, according to the mass ratio of 1:2:7 compound) 41 parts, 5 parts of methacryloxy silicon, 2 parts of butadienyl triethoxysilane, 21 parts of alicyclic amine epoxy resin curing agent, 1 part of triphenyl phosphite, Its preparation adopts the following steps:

[0023] (1) Dilute methacryloxy silicon with absolute ethanol to a mass fraction of 10%, dry the heat conducting agent at 80°C for 5 minutes, and mix the diluted methacryloxy silicon and the dried heat conducting agent in Mix in a telltale dispersion mixer to prepare mixture A; add butadienyltriethoxysilane and acrylic resin to the planetary dispersion mixer, stir for 0.5h, then add mixture A and continue stirring for 0.5h, add epoxy resin, and cont...

Embodiment 3

[0025] Example 3 The following formulations and steps were used to prepare the thermally conductive adhesive of the present invention: 31 parts of epoxy resin, 19 parts of acrylic resin, 12 parts of spherical alumina, 19 parts of silicon carbide, 9 parts of methacryloxy silicon, 4 parts of butadienyl triethoxysilane, 25 parts of cycloaliphatic amine epoxy resin curing agent, 3 parts of triphenyl phosphite, 2 parts of flame retardant, 3 parts of lubricant, its preparation adopts the following steps:

[0026] (1) Dilute methacryloyloxy silicon with absolute ethanol to a mass fraction of 16%, dry the heat conducting agent at 90°C for 5 minutes, and mix the diluted methacryloxy silicon and the dried heat conducting agent in Mix in a telltale dispersion mixer to prepare mixture A; add butadienyltriethoxysilane and acrylic resin to the planetary dispersion mixer, stir for 1h, then add mixture A and continue stirring for 1h, add epoxy resin, and continue stirring for 0.5h Mixture B ...

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PUM

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Abstract

The invention discloses a heat conduction adhesive. The heat conduction adhesive comprises the following raw materials in parts by weight: 10-38 parts of epoxy resin, 5-25 parts of acrylic resin, 10-41 parts of a heat conduction agent, 1-10 parts of methylacryloyloxy silicon, 1-5 parts of butadiene triethoxy silane, 8-26 parts of an alicyclic amino epoxy resin curing agent, 1-3 parts of an accelerator and 0-5 parts of other processing additives. According to the heat conduction adhesive, a high-heat-conduction agent is adopted, so that the heat conduction performance of the overall system is improved; the acrylic resin can be used for improving water resistance, weather resistance and physical and mechanical properties of the product; in the preparation process, different coupling agents are selected with pertinence and are used for mixing and preprocessing the heat conduction agent and the resin, so that the compatibility between the heat conduction agent and the resin substrate and the adhesion between the resins can be further enhanced; a manner of firstly adding additives and adding a curing agent in batches is adopted, so that the curing reaction is highly complete; andthe adhesion property of the product is improved. The heat conduction adhesive is excellent in adhesion property, high in heat conduction coefficient and high in cost performance; and the preparation method of the heat conduction adhesive is simple to operate.

Description

technical field [0001] The invention relates to a heat-conducting adhesive and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] COB is chip On board, which is to adhere the bare chip to the interconnection substrate with conductive or non-conductive adhesive, and then perform wire bonding to realize its electrical connection. COB LED is also called COB LED source, COB LED module, and has a long strip type. / square / circular three package forms. [0003] COB LED surface light source first covers the placement point of the silicon chip on the surface of the substrate with thermally conductive epoxy resin (generally epoxy resin doped with silver particles), and then directly places the silicon chip on the surface of the substrate, heat treatment until the silicon chip is firmly fixed on the substrate Until then, wire bonding is used to establish a direct electrical connection between the silicon wafer and the sub...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J4/06C09J11/04
Inventor 杨永佳张彦兵杨小义
Owner HUIZHOU KINGBALI TECH