Preparation method of insulating high-thermal radiation coating suitable for various base materials

Abstract

The invention relates to a preparation method of an insulating high-thermal radiation coating suitable for various base materials. The paint of the coating comprises the following ingredients by mass: 40 to 60 parts of a film-forming material, 30 to 50 parts of an insulating heat conducting filler, 40 to 70 parts of solvents, 0.3 to 2.0 parts of a wetting dispersant, 0.2 to 1.0 part of a foam killer, 0.1 to 0.8 part of a leveling agent, 0.02 to 0.1 part of a drier, 5 to 15 parts of a cross-linked curing agent adopting isocyanate. The preparation method comprises the following steps: uniformly spraying the paint on the surface of a device in such a manner that the sprayed layer is 0.01 to 0.03 mm in thickness each time and the total thickness is 0.13 to 0.18 mm. The coating prepared according to the method is high in hemispherical emissivity, thermal conductivity and volume resistivity, and has excellent salt spray resistance, moisture and heat resistance and aging resistance.

Description

Technical field [0001] The invention relates to a method for preparing an insulating high-radiation heat dissipation coating suitable for a variety of substrates, and belongs to the technical field of functional coatings. Background technique [0002] With the advancement of technology and the rapid development of the electronics industry, LED lighting equipment, CPU circuit boards and high-power electronic equipment heat sinks have proposed high thermal conductivity, high radiation heat dissipation and high insulation properties compatible with the surface coating of electronic device heating devices. demand. Traditional heat dissipation coatings mainly rely on the addition of various fillers with high thermal conductivity to achieve high thermal conductivity, and generally use metals (such as Au, Ag, Cu, Al, Mg, etc.) or non-metallic materials (such as graphite, carbon black, etc.) As a filler, although this type of coating has a high thermal conductivity, it also has some dis...

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Problems solved by technology

Traditional heat dissipation coatings mainly rely on the addition of various high thermal conductivity fillers to achieve high thermal conductivity, generally using metals (such as Au, Ag, Cu, Al, Mg, etc.), or non-metallic materials (such as graphite, carbon black, etc.) As a filler, although this type of coating has high thermal conductivity, it also has some disadvantages: low emissivity, poor radiation heat dissipation effect, poor electrical insulation and chemical resistance, and high cost

[0003] At present, thermally conductive materials have been widely used in microelectronics, high-power heat generating appliances, automobiles and other fields. The United States, Japan and other countries have also applied thermally conductive materials to aircrafts, space capsules, etc. At the same time, there are not many studies on the characteristics of radiation heat dissipation, and there are few reports on coating materials with both insulation and high radiation heat dissipation functions.

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