Adhesive and preparation method thereof

A technology of adhesives and curing agents, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problem of low dielectric constant, achieve high relative dielectric constant, easy assembly, adhesion strong relay effect

Inactive Publication Date: 2015-05-13
CHAOZHOU THREE CIRCLE GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide an adhesive. The adhesive provided by the present invention solves the problem that the relative dielectric constant of the electronic packaging adhesive is low in the past, and maintains the The characteristics of high adhesion of the electronic packaging adhesive, its bonding object can be sapphire, glass, pottery, molding compound, silicon chip, etc., the present invention also provides the preparation method of described adhesive, described preparation method is by The ceramic powder added to the adhesive is dispersed and modified, and the obtained adhesive also has good dispersion characteristics, and its fineness can reach below 2 μm. At the same time, the adhesive also has light-shielding and toning effect, simplifying the packaging process

Method used

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  • Adhesive and preparation method thereof
  • Adhesive and preparation method thereof

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Embodiment 1

[0045] An embodiment of the adhesive of the present invention, the adhesive includes the following components in parts by weight: 100 parts of matrix resin, 10 parts of curing agent, 6 parts of accelerator, 350 parts of filler with high dielectric constant, 5 parts of dispersant, 5 parts of coupling agent, and 15 parts of toner; the adhesive also includes anti-settling agent and diluent, and its addition amount is 9.9 parts.

[0046] The base resin is epoxy resin, the diluent is diluent 692, the curing agent is dicyandiamide, the accelerator is an organic urea accelerator, the dispersant is lecithin, and the coupling The agent is silane coupling agent KH550, the high dielectric constant filler is sodium potassium niobate, the anti-sedimentation agent is polyamide wax, and the toner is carbon black.

[0047] A kind of embodiment of the preparation method of above-mentioned adhesive, described preparation method comprises the following steps:

[0048] Under vacuum conditions, a...

Embodiment 2

[0050] An embodiment of the adhesive of the present invention, the adhesive includes the following components by weight: 100 parts of matrix resin, 8 parts of curing agent, 6 parts of accelerator, 350 parts of filler with high dielectric constant, 5 parts of dispersant, 5 parts of coupling agent, and 15 parts of toner; the adhesive also includes anti-sedimentation agent and diluent, the addition amount of which is 8 parts.

[0051] The base resin is epoxy resin, the diluent is diluent 692, the curing agent is dicyandiamide, the accelerator is an organic urea accelerator, the dispersant is lecithin, and the coupling The agent is silane coupling agent KH550, the high dielectric constant filler is sodium niobate, the anti-sedimentation agent is polyamide wax, and the toner is carbon black.

[0052] A kind of embodiment of the preparation method of above-mentioned adhesive, described preparation method comprises the following steps:

[0053] Under the condition of vacuum and no m...

Embodiment 3

[0055] An embodiment of the adhesive of the present invention, the adhesive includes the following components in parts by weight: 100 parts of matrix resin, 4.3 parts of curing agent, 140 parts of filler with high dielectric constant, 1.5 parts of dispersant, 1.2 parts of coupling agent, 10 parts of toner; said adhesive also includes anti-settling agent and diluent, the addition amount of which is 11 parts.

[0056] The matrix resin is a blocked polyurethane prepolymer (containing 9%-NCO), the diluent is diluent 692, the curing agent is 1,4-butanediol, and the dispersant is dispersant 9400, The coupling agent is silane coupling agent KH-550, the high dielectric constant filler is barium titanate, the anti-sedimentation agent is polyamide wax, and the toner is carbon black.

[0057] A kind of embodiment of the preparation method of above-mentioned adhesive, described preparation method comprises the following steps:

[0058] Under vacuum conditions, add 140 parts by weight of ...

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Abstract

The invention provides an adhesive. The adhesive comprises the following components in parts by weight: 100 parts of matrix resin, 4.3-70 parts of a curing agent, 0-6 parts of an accelerant, 5-350 parts of a high-dielectric-constant filler, 0.01-5 parts of a dispersant, 0.1-5 parts of a coupling agent and 8-25 parts of a toner. The adhesive further has the characteristics of relatively high dielectric constant being greater than 6, high light shading property, adjustable colors and strong adhesive strength, and can be applied to adhesion of encapsulation of a capacitive fingerprint identification chip module; capacitive signals can be transmitted and cannot be shielded or reflected after the capacitive fingerprint identification chip module is encapsulated. An electronic encapsulation adhesive further has the advantage of being liable to assemble; the assembly manner is a glue-dispensing manner, a blade coating manner, a roller coating manner or a silk-screen printing manner; then the adhesion is carried out through a thermal curing manner; the adhesive is especially suitable for mass production. The invention further provides a preparation method of the adhesive; by virtue of the method, the encapsulation process is simplified.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof, in particular to an adhesive with high relative dielectric constant and a preparation method thereof. Background technique [0002] In recent years, with the development of electronic packaging technology, more and more attention has been paid to adhesives for electronic packaging with special properties, such as conductive glue that conducts electricity, and thermally conductive glue that conducts heat, etc. In some applications, special electronic packaging glue (or electronic packaging adhesive) with high dielectric constant is required. For example, in the packaging process of semiconductor capacitive signal acquisition chips, the packaging glue that needs to be bonded It has high dielectric properties to prevent capacitive signals from being shielded or reflected, affecting the accuracy of signal acquisition. However, the relative dielectric constant of traditional electronic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J175/04C09J179/08C09J133/00C09J163/10C09J11/04C09J11/06C09J11/08
Inventor 马艳红徐苏龙林莅蒙
Owner CHAOZHOU THREE CIRCLE GRP
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