Adhesive and preparation method thereof

Abstract

The invention provides an adhesive. The adhesive comprises the following components in parts by weight: 100 parts of matrix resin, 4.3-70 parts of a curing agent, 0-6 parts of an accelerant, 5-350 parts of a high-dielectric-constant filler, 0.01-5 parts of a dispersant, 0.1-5 parts of a coupling agent and 8-25 parts of a toner. The adhesive further has the characteristics of relatively high dielectric constant being greater than 6, high light shading property, adjustable colors and strong adhesive strength, and can be applied to adhesion of encapsulation of a capacitive fingerprint identification chip module; capacitive signals can be transmitted and cannot be shielded or reflected after the capacitive fingerprint identification chip module is encapsulated. An electronic encapsulation adhesive further has the advantage of being liable to assemble; the assembly manner is a glue-dispensing manner, a blade coating manner, a roller coating manner or a silk-screen printing manner; then the adhesion is carried out through a thermal curing manner; the adhesive is especially suitable for mass production. The invention further provides a preparation method of the adhesive; by virtue of the method, the encapsulation process is simplified.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof, in particular to an adhesive with high relative dielectric constant and a preparation method thereof. Background technique [0002] In recent years, with the development of electronic packaging technology, more and more attention has been paid to adhesives for electronic packaging with special properties, such as conductive glue that conducts electricity, and thermally conductive glue that conducts heat, etc. In some applications, special electronic packaging glue (or electronic packaging adhesive) with high dielectric constant is required. For example, in the packaging process of semiconductor capacitive signal acquisition chips, the packaging glue that needs to be bonded It has high dielectric properties to prevent capacitive signals from being shielded or reflected, affecting the accuracy of signal acquisition. However, the relative dielectric constant of traditional electronic ...

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Problems solved by technology

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide an adhesive. The adhesive provided by the present invention solves the problem that the relative dielectric constant of the electronic packaging adhesive is low in the past, and maintains the The characteristics of high adhesion of the electronic packaging adhesive, its bonding object can be sapphire, glass, pottery, molding compound, silicon chip, etc., the present invention also provides the preparation method of described adhesive, described preparation method is by The ceramic powder added to the adhesive is dispersed and modified, and the obtained adhesive also has good dispersion characteristics, and its fineness can reach below 2 μm. At the same time, the adhesive also has light-shielding and toning effect, simplifying the packaging process

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