Phenyl vinyl silicon resin for adhering base as well as preparation method and application thereof

A technology based on phenylvinyl silicon and vinyl, applied in the direction of adhesives, etc., can solve the problems of light transmittance decrease, mechanical strength decrease, surface stickiness and other problems of LED packaging composition, and achieve good impurity ion content and adhesive strength The effect of improving the bonding strength

Inactive Publication Date: 2015-06-17
SHENZHEN CAPCHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, HCl, water glass, KOH and other substances are used in the synthesis process of silicone resin for LED packaging in China, and a large amount of Na, K, Cl and other elements that are harmful to the LED chip, or additional tackifiers are required, resulting in a decrease in the light transmittance of the LED packaging composition, and the surface is sticky after curing. The publication number is CN102690416A, and the name is "A High Refractive In the two patents whose publication number is CN103232601A and titled "Phenyl MDT Silicone Resin and Its Preparation Method", due to the use of raw materials such as water glass and HCl, and without any deionization

Method used

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  • Phenyl vinyl silicon resin for adhering base as well as preparation method and application thereof
  • Phenyl vinyl silicon resin for adhering base as well as preparation method and application thereof

Examples

Experimental program
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Example Embodiment

[0134] Example 1

[0135] Combine 3.3583g tetramethyldisiloxane (molecular weight 134.33), 6.7658g hexamethyldisiloxane (molecular weight 162.38), 13.98g divinyltetramethyldisiloxane (molecular weight 186.4), 60g ethanol, 50g Deionized water and 3g sulfuric acid were added to the reaction kettle. At 40°C, 128.7g phenyltrimethoxysilane (molecular weight 198) was added dropwise to the reaction kettle. After the addition was completed, the temperature was raised to 80°C and the reaction continued for 6 hours; Add an equal volume of toluene to the finished mixture for extraction, and wash it with deionized water for 5 times until the pH is close to neutral, and then add anhydrous CaCl 2 Put it into the toluene solution of the silicone resin to remove the water in the solution; add 5.5 g of the cation exchange resin Amberlyst 15Dry to the toluene solution of the silicone resin, react at 90°C for 8 hours, filter to remove the cation exchange resin, and then The solvent and low boilers ...

Example Embodiment

[0137] Example 2

[0138] 2.6866g tetramethyldisiloxane (molecular weight 134.33), 9.4721g hexamethyldisiloxane (molecular weight 162.38), 5.592g divinyltetramethyldisiloxane (molecular weight 186.4), 60g ethanol, 50g Deionized water and 20g of acetic acid were added to the reaction kettle. At 40°C, 108.9g of phenyltrimethoxysilane (molecular weight 198) was added dropwise to the reaction kettle. After the addition was completed, the temperature was raised to 50°C and the reaction was continued for 8 hours; Add an equal volume of toluene to the finished mixture for extraction, and wash with deionized water 4 times until the pH is close to neutral, and then add anhydrous CaCl 2 Put it into the toluene solution of the silicone resin to remove the moisture in the solution; add 5.5 g of phosphazene chloride to the toluene solution of the silicone resin, react at 80°C for 1 hour, and then remove the solvent under reduced pressure at 170°C And low boilers to obtain a solid silicone res...

Example Embodiment

[0140] Example 3

[0141] Combine 4.0299g tetramethyldisiloxane (molecular weight 134.33), 12.9904g hexamethyldisiloxane (molecular weight 162.38), 12.42g dimethyldivinyldiphenyldisiloxane (molecular weight 310.54), 60g Ethanol, 50g deionized water, and 3g trifluoromethanesulfonic acid were added to the reaction kettle. At 40°C, 99g phenyltrimethoxysilane (molecular weight 198) was added dropwise to the reaction kettle. After the addition, the temperature was raised to 70°C. Continue the reaction for 10 hours; add an equal volume of p-xylene to the mixture at the end of the reaction for extraction, and wash with deionized water three times until the pH is close to neutral, and then add anhydrous CaCl 2 Put it into the toluene solution of the silicone resin to remove the water in the solution; add 5.5HZSM-5 molecular sieve to the p-xylene solution of the silicone resin, react at 70℃ for 6h, filter to remove the molecular sieve, and then at 170℃ The solvent and low boilers are remo...

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Abstract

The invention discloses phenyl vinyl silicon resin for adhering a base as well as a preparation method and an application thereof. The phenyl vinyl silicon resin consists of solid silicon resin containing Si-H, methyl, phenyl and vinyl as well as an organic compound containing a tackifying radical and vinyl; under the effect of a hydrosilyation catalyst, the phenyl vinyl silicon resin is generated through a hydrosilyation reaction, wherein the tackifying radical is an organic radical capable of enhancing the adhesive capacity of the base. When the phenyl vinyl silicon resin provided by the invention is used as a reinforcing tackifying material in an LED, and can provide high hardness, high tenacity, high refractive index and higher lighting effect of LED packaging glue water; moreover, the phenyl vinyl silicon resin has good adhesive capacity for various bases, the material has excellent reliability in the using process, and the phenyl vinyl silicon resin has extremely high practicability.

Description

technical field [0001] The invention relates to the technical field of substrate encapsulation adhesives, in particular to the technical field of LED encapsulation adhesives, in particular to a phenyl vinyl silicone resin for substrate bonding with good adhesion to the substrate, a preparation method and application thereof. Background technique [0002] In recent years, LED (Light Emitting Diode, light-emitting diode), as a semiconductor light-emitting device, has been widely used in lighting, backlight, display and other fields due to its advantages of energy saving, long life, environmental protection, and high light efficiency. It is only 1 / 10 of the traditional light source. If the LED light source can be used instead of the traditional light source, it will greatly reduce the world's energy consumption rate. [0003] At present, polysiloxane has replaced traditional epoxy resin and has become the mainstream material for LED packaging. Polysiloxane has excellent propert...

Claims

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Application Information

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IPC IPC(8): C08G77/38C09J183/07C09J183/05C09J183/04
Inventor 赵大成马子淇
Owner SHENZHEN CAPCHEM TECH
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