Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

UV-curing ink and method for preparing masking plate by using ink

A mask plate and ink technology, applied in the direction of ink, photomechanical processing originals, applications, etc., can solve the problems of high cost, hindering the improvement and development of mask plate making process, expensive and other problems, and achieve neat and clean edges Defect, effective preparation route, simple operation effect

Inactive Publication Date: 2015-06-17
方圆环球光电技术盐城有限公司 +1
View PDF0 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with ordinary optical exposure, these two patterned generators have unique advantages, such as high resolution and high production efficiency, which greatly promote the development of the semiconductor industry and the manufacture of micro devices, and improve the performance of devices, but this equipment Very expensive, the cost is too high, which hinders the improvement and development of the mask plate making process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • UV-curing ink and method for preparing masking plate by using ink
  • UV-curing ink and method for preparing masking plate by using ink
  • UV-curing ink and method for preparing masking plate by using ink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A UV curable ink comprising:

[0032] (1) Polyurethane acrylate, accounting for 32% of the total mass percentage;

[0033] (2) α-hydroxycyclohexylbenzophenone, accounting for 8% of the total mass percentage;

[0034] (3) Tripropylene glycol diacrylate, accounting for 45% of the total mass percentage;

[0035] (4) black pigment, accounting for 13% of the total mass percentage;

[0036] (5) Additives, accounting for 2% of the total mass.

[0037] The additives include dispersants, defoamers, photosensitizers and light stabilizers, wherein the dispersant is alkylphenol polyoxyethylene ether, the defoamer is polydimethylsiloxane, and the photosensitizer is 2-hydroxy-2-methyl Base-1-propyl-1-acetone and light stabilizer are alkyl disulfides.

[0038] A method for preparing a mask:

[0039] Put the plexiglass substrate into the neutral ECB-868 cleaning agent to clean, then dry, put the UV ink into the UV flat-panel inkjet printer, turn on the UV flat-panel inkjet printer...

Embodiment 2

[0042] According to the preparation method of embodiment 1, the UV ink composition is changed to:

[0043] (1) Polyether acrylate resin, accounting for 30% of the total mass percentage;

[0044] (2) Isopropylthioxanthone, accounting for 6% of the total mass percentage;

[0045] (3) Trimethylolpropane triacrylate, accounting for 46% of the total mass percentage;

[0046] (4) black pigment, accounting for 15% of the total mass percentage;

[0047] (5) Additives, accounting for 3% of the total mass;

[0048] The dispersant is polyoxyethylene alkyl amide, the defoamer is polyoxypropylene glyceryl ether, the photosensitizer is 1-hydroxy-cyclohexyl-phenyl ketone, and the light stabilizer is silver chloride.

[0049] The plexiglass substrate in Example 1 was replaced by a polyimide film flexible substrate to prepare a mask for the flexible substrate. The micrographs of the Figure 5 As shown in the figure, it can be seen from the figure that the edges of the inkjet printed mask ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of semiconductor manufacture, and particularly relates to a UV-curing ink and a method for preparing a masking plate using the ink. The UV-curing ink is composed of a photoactive pre-polymer, a photoinitiator, an active monomer, pigment and additives. The UV-curing ink is put into a UV plate inkjet printer; a graphical masking plate is printed on a substrate through the UV plate inkjet printer; the graphical masking plate is put into an oven for baking to prepare the masking plate; and furthermore, electrodes of organic electronic devices are prepared on the masking plate through photolithography. The masking plate prepared by the method in the invention is tidy in appearance edge and smooth in surface, has no stain, is simple in operation process, requires no special technology and special equipment, is suitable for the normal masking plate for manufacturing semiconductor electrodes, and is easy for popularization and use.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and in particular relates to a UV curing ink and a method for preparing a mask using the ink. Background technique [0002] In the prior art, the mask plate is usually prepared by the method of photoresist, and a quartz master is used to expose and develop the photoresist on the glass substrate with the metal film covering the photoresist, and to process the metal film. Etching and stripping the remaining photoresist to obtain a light-shielding mask. However, this process requires the use of quartz masters. Different products need to make different masters, which increases the production process of quartz masters, and the cost of quartz masters is expensive, thus greatly increasing the production cost of light-shielding masks. and production time. [0003] At present, the more popular engraving mask technology in the world is the pattern generator of electron beam and laser ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101G03F1/68
CPCC09D11/101G03F1/68
Inventor 刘屹东张乐乐沈波涛
Owner 方圆环球光电技术盐城有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products