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A kind of silver-substituting copper-phosphorus-tin solder ring and preparation method thereof

A solder ring and coating technology, which is applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems that cannot be used in the production of coating solder, etc., achieve good wetting and spreading properties, and speed up heat conduction , huge social benefits

Active Publication Date: 2017-03-08
ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN202804495 U discloses "a kind of solder coated with coating", which press-coats the coating onto the solder rod. This method can only produce solder rods with thicker coating, and cannot be used to produce non-strip , Rod-shaped brazing filler metal

Method used

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  • A kind of silver-substituting copper-phosphorus-tin solder ring and preparation method thereof
  • A kind of silver-substituting copper-phosphorus-tin solder ring and preparation method thereof
  • A kind of silver-substituting copper-phosphorus-tin solder ring and preparation method thereof

Examples

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preparation example Construction

[0028] Preparation method of the present invention is to adopt following steps to realize:

[0029] a) Melting of copper-phosphorus-tin solder ingot;

[0030] b) Preparation of filamentous copper-phosphorus-tin solder;

[0031] c) Copper-phosphorus-tin solder wire is wound into a ring shape;

[0032] d) Make a flux liquid with a weight ratio of 50% to 70% of flux, 1% to 5% of adhesive, 1% to 4% of toughening agent, and 20% to 50% of solvent, and then put the flux The liquid is sprayed onto the outside of the ring-shaped copper-phosphorus-tin solder core, and after drying, the coated copper-phosphorus-tin solder ring is made.

[0033] The copper-phosphorus-tin solder ingot in the present invention is prepared from the following raw materials in weight ratio, wherein: P6.8%~7.2%, Sn0.4%~3%, Zr0.02%~0.5%, Si0.01%~0.4%, rare earth 0.01%~0.025%, and the rest is Cu.

[0034] When using the silver-substituting copper-phosphorus-tin-coated solder ring of the present invention to b...

Embodiment 1

[0038]The steps of the preparation method of this example are as follows: a) Prepare Cu, Cu-P master alloy, Sn, Cu-Si master alloy, Zr and rare earth in proportion, melt and cast it into a Φ50 mm rod-shaped BCu90P7Sn2.5ZrSi solder alloy Ingot (alloy composition: 6.8% to 7.2% of P, 0.4% to 3% of Sn, 0.02% to 0.5% of Zr, 0.01% to 0.4% of Si, 0.01% to 0.025% of rare earth, and the rest is Cu ), cut off the riser and then turn the ingot to remove the scale, and set it aside; b) raise the temperature of the solder extrusion equipment system to 460 ℃, place the ingot after turning and remove the scale in the muffle furnace to preheat, The preheating temperature is 470 °C, put the preheated ingot into the mold barrel of the extrusion equipment, extrude it into a Φ1.1 mm brazing wire, and draw it to a Φ0.8 mm silver brazing wire; c ) Clean the drawn copper-phosphorus-tin solder wire with dilute acid and passivate it. After cleaning, put it into the material tray of the ring-making equ...

Embodiment 2

[0040] The difference from Example 1 is that the flux composition is 10% sodium fluorosilicate or potassium fluoroaluminate, 35% potassium fluoride or lithium fluoride, 20% potassium fluoroborate, and 35% boric anhydride. The copper-phosphorus-tin-coated solder described in Example 1 can be used to braze common copper alloys, and this embodiment can be used to braze copper alloys containing aluminum.

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Abstract

Disclosed are a silver substitute copper phosphorus tin coating brazing alloy ring and a preparation method thereof. The silver substitute copper phosphorus tin coating brazing alloy ring is composed of an annular copper phosphorus tin brazing alloy core and a coating, the annular copper phosphorus tin brazing alloy core is formed by winding copper phosphorus tin brazing alloy wires, the coating accounts for 0.5 percent to 16.0 percent of the total weight of the silver brazing alloy ring, and the thickness of the coating ranges from 0.05 mm to 0.60 mm. The preparation method comprises the steps that a, a copper phosphorus tin brazing alloy cast ingot is molten; b, wire-shaped copper phosphorus tin brazing alloy is prepared; c, the copper phosphorus tin brazing alloy wires are wound to be in a ring shape; d, brazing flux, a certain low-carbon residual adhesive, flexibilizer and other coating materials are prepared to form brazing flux liquid according to a certain proportion, and then the brazing flux liquid is sprayed to the outer portion of the annular copper phosphorus tin brazing alloy core; e, drying is carried out to manufacture the coating copper phosphorus tin brazing alloy ring. The coating copper phosphorus tin brazing alloy can substitute for silver-containing brazing alloy, the brazing flux can be pre-added conveniently, fast, quantitatively and efficiently, the advantages that assembling is convenient, automatic production is achieved easily, and cost is low are achieved, and the silver substitute copper phosphorus tin coating brazing alloy ring and the preparation method can be used for brazing red copper, brass and copper alloy including tin, aluminum, manganese, silicon and other elements.

Description

technical field [0001] The invention relates to a coated solder, in particular to a silver-free copper-phosphorus-tin coated annular solder, which belongs to the field of new welding materials. Background technique [0002] Silver-based solder has moderate melting point, good manufacturability, good strength, toughness, electrical conductivity and corrosion resistance, and has been widely used in various fields of modern industry. Cu-P solder is widely used in the brazing of copper and copper alloys due to its low melting point, good brazing process performance, unique self-brazing effect (for copper brazing) and low price. Ideal solder in the temperature range of 800°C. Cu-P solder mainly includes two types of Cu-P binary solder and Ag-Cu-P ternary solder. Cu-P-Ag ternary solder is made by adding Ag to Cu-P binary solder. It can lower the melting point of the solder, improve the plasticity and wettability of the solder, reduce the resistivity of the brazing joint, and imp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/14B23K35/30B23K35/40B23K35/365B23K35/363
CPCB23K35/0222B23K35/302B23K35/3605B23K35/3606B23K35/365B23K35/40
Inventor 龙伟民吕登峰董显钟素绢鲍丽于新泉张冠星纠永涛
Owner ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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