Zr2WP2O12/polyimide composite material with low thermal expansion coefficient and preparation method therefor

Abstract

The invention discloses a Zr2WP2O12 / polyimide composite material with a low thermal expansion coefficient and a preparation method therefor. The composite material is prepared from a matrix material, i.e., polyimide and Zr2WP2O12 with a negative thermal expansion property through compounding. The composite material Zr2WP2O12 / polyimide disclosed by the invention is prepared by an in-situ polymerization method, the equipment is simple, the cost is relatively low, and the industrialization is easy; and the composite material has relatively high controllability and generality. The product composite material of the preparation method has low thermal expansion coefficient and good thermal stability and dielectric property, can better meet the requirements of integrated circuit and chip packaging technology aspects on silicon-based material thermal matching, can be applied to microelectronics industry such as insulating layers in a multilayer wiring technology in the field of electronic packaging and can also be applied to insulating layers in solar cells, and the like. Thus, the composite material has a relatively broad application prospect.

Description

1. Technical field: [0001] The invention belongs to the technical field of negative thermal expansion materials, in particular to a low thermal expansion coefficient Zr 2 WP 2 o 12 / Polyimide composite material and preparation method thereof. 2. Background technology: [0002] The progress of modern society is closely related to the development of electronic technology. Mobile phones, computers, automotive electronics, and aerospace electronics are increasingly becoming smaller and lighter. In order to adapt to this development trend, flexible circuits suitable for three-dimensional electronic packaging should be used As a result, this circuit can be bent into the desired shape as needed. Flexible circuits use multi-layer wiring technology, using insulating polymers and adhesives to interconnect wires such as copper or aluminum to form a packaged circuit. The polymer materials used for encapsulation mainly include polyimide (PI) and polyester materials; it is reported th...

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Problems solved by technology

[0004] At present, the main method to reduce the thermal expansion coefficient of polyimide materials is to add inorganic particles to polyimide, such as SiO 2 , graphite, montmorillonite, AlN and TiO 2 etc., but since these substances have positive coefficients of thermal expansion; therefore, the reduction in the coefficient of thermal expansion of polyimide is very limited, and its effect is not ideal.

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