Anisotropic heat conduction material, and preparation method thereof

Abstract

The invention discloses an anisotropic heat conduction material. The anisotropic heat conduction material is a composite material of liquid metal materials and a high-molecular polymer, wherein the high-molecular polymer possesses embedded runners, and the runners are filled with the liquid metal materials. According to the preparation method, the anisotropic heat conduction material is obtained via injecting and sealing room temperature liquid metals, including gallium, indium, mercury, sodium, potassium, caesium, or binary alloys and multicomponent alloys thereof, into the high-molecular polymer; anisotropism of heat conductivity of a composite material prepared via adding high thermal conductivity materials into a base material is increased greatly; and heat energy transmission direction can be controlled artificially based on practical requirements. Preparation is convenient; mixing process and mixing results of the high thermal conductivity additives with the high-molecular polymer can be controlled easily; material heat conductivity anisotropy rate range can be adjusted in a relatively range artificially; and the anisotropic heat conduction material possesses significant importance in the fields of micro-fluidic chips, biological medical testing equipment, cryogenic engineering, and electronic integration equipment.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and in particular relates to an anisotropic heat-conducting material and a preparation method thereof. Background technique [0002] With the high integration of devices in the field of electronic appliances and the miniaturization and multi-functionalization of products in recent years, the heat generation density has also increased, and the heat release of electronic equipment and electronic components has become a serious problem. Materials with higher thermal conductivity With the rapid development of integrated circuits, it becomes more and more important. In particular, a problem has arisen in rapidly developing mobile information terminals that the heat generated by components is sufficient to cause low-temperature combustion. Therefore, materials are required not only to directly transfer heat to the chassis, but also to control electronic equipment and electronic components. In ...

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Problems solved by technology

However, in the process of adding high thermal conductivity materials to polymer materials, there are many problems, such as agglomeration of additives, uneven dispersion, etc.

The thermal conductivity of the new material obtained by this production method is not strictly anisotropic, and it is even difficult to guarantee the directionality of the thermal conductivity of the obtained material

Taking the addition of carbon fiber into the resin as an example, the fine carbon fiber used as a filler is extremely prone to agglomeration, so it is difficult to disperse the carbon fiber into the resin, resulting in the problem that heat conduction can only be obtained when a large amount of fiber is added. sex improvement effect

The problem caused by carbon fiber mixing as a large mixing ratio is that the melt viscosity of the resin is significantly increased, so injection molding, which is widely used in thermoplastic resins, cannot be performed

The fact that forming can only be performed with a specific forming method constitutes a factor that reduces the practicality and applicability of high thermal conductivity resins

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