Anisotropic heat conduction material, and preparation method thereof

A thermally conductive material and anisotropic technology, applied in the field of anisotropic thermally conductive materials and their preparation, can solve the problem of low practicability and applicability of high thermal conductivity resins, it is difficult to ensure the directionality of thermal conductivity of materials, and thin carbon fibers are prone to occur. Coagulation and other problems, to achieve the effect of controlling heat transfer, easy control, and good fluidity

Active Publication Date: 2015-11-11
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of adding high thermal conductivity materials to polymer materials, there are many problems, such as agglomeration of additives, uneven dispersion, etc.
The thermal conductivity of the new material obtained by this production method is not strictly anisotropic, and it is even difficult to guarantee the directionality of the thermal conductivity of the obtained material
Taking the addition of carbon fiber into the resin as an example, the fine carbon fiber used as a filler is extremely prone to agglomeration, so it is difficult to disper

Method used

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  • Anisotropic heat conduction material, and preparation method thereof
  • Anisotropic heat conduction material, and preparation method thereof
  • Anisotropic heat conduction material, and preparation method thereof

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0045] Example 1:

[0046] Use drawing software to design several parallel flow channels in a square frame, the flow channels are arranged like figure 1 . The designed flow channel will be used to fill liquid metal materials with high thermal conductivity. Print the film according to the above design graphics. Then, using the photolithography method, using the film obtained in the above steps as a mask, a silicon wafer with the aforementioned designed flow channel is produced, which is equivalent to copying the aforementioned designed flow channel onto the silicon wafer. Place the manufactured silicon wafer with flow channels in a petri dish of appropriate size, with the side of the silicon wafer with flow channels facing upward. The liquid high molecular polymer polydimethylsiloxane prepared in advance is poured on the silicon wafer. After the liquid polydimethylsiloxane is cured, remove it from the silicon wafer and punch holes at the entrance and exit of the flow channel, t...

Example Embodiment

[0050] Example 2:

[0051] According to different applications, change the shape and layout of the runner. When it is necessary to control heat transfer in the axial direction and heat insulation in the radial direction, different arrangements of liquid metal flow channels are required. Such as Figure 4 As shown, the liquid metal flow channel adopts a concentric annular arrangement, and the axial and tangential thermal conductivity of the film is higher than the radial thermal conductivity. Therefore, the axial and radial anisotropic thermal conductivity film is obtained, which can satisfy the heat Fast transmission in the axial and tangential directions, and the heat insulation effect in the radial direction. The runner is 5mm high and 5mm wide, filled with Ga 67 In 20.5 Sn 12.5 , The liquid alloy is prepared at a heating temperature of 240 ℃.

Example Embodiment

[0052] Example 3

[0053] Prepared as in Example 1. According to different applications, change the shape and layout of the runner. Such as Figure 5 As shown, the liquid metal flow channel is arranged in a manner of radiating multiple straight lines from a point, and the thermal conductivity in the radial direction shown in the figure is higher than the thermal conductivity in other directions, and the purpose of heat transfer in the radial direction can be achieved.

[0054] In this embodiment, the flow channel is 3mm high and 3mm wide, filled with GaIn 24.5 , The liquid alloy is prepared at a heating temperature of 80°C and poured at room temperature.

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Abstract

The invention discloses an anisotropic heat conduction material. The anisotropic heat conduction material is a composite material of liquid metal materials and a high-molecular polymer, wherein the high-molecular polymer possesses embedded runners, and the runners are filled with the liquid metal materials. According to the preparation method, the anisotropic heat conduction material is obtained via injecting and sealing room temperature liquid metals, including gallium, indium, mercury, sodium, potassium, caesium, or binary alloys and multicomponent alloys thereof, into the high-molecular polymer; anisotropism of heat conductivity of a composite material prepared via adding high thermal conductivity materials into a base material is increased greatly; and heat energy transmission direction can be controlled artificially based on practical requirements. Preparation is convenient; mixing process and mixing results of the high thermal conductivity additives with the high-molecular polymer can be controlled easily; material heat conductivity anisotropy rate range can be adjusted in a relatively range artificially; and the anisotropic heat conduction material possesses significant importance in the fields of micro-fluidic chips, biological medical testing equipment, cryogenic engineering, and electronic integration equipment.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and in particular relates to an anisotropic heat-conducting material and a preparation method thereof. Background technique [0002] With the high integration of devices in the field of electronic appliances and the miniaturization and multi-functionalization of products in recent years, the heat generation density has also increased, and the heat release of electronic equipment and electronic components has become a serious problem. Materials with higher thermal conductivity With the rapid development of integrated circuits, it becomes more and more important. In particular, a problem has arisen in rapidly developing mobile information terminals that the heat generated by components is sufficient to cause low-temperature combustion. Therefore, materials are required not only to directly transfer heat to the chassis, but also to control electronic equipment and electronic components. In ...

Claims

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Application Information

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IPC IPC(8): C09K5/08C08L83/04C08L69/00C08L33/12C08K3/08
Inventor 桂林牛波
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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