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Preparation method of copper electronic paste for piezoelectric ceramics

A technology of copper electronic paste and piezoelectric ceramics, which is applied in the direction of cable/conductor manufacturing, circuits, electrical components, etc., can solve the problems of restricting the use of copper powder, achieve excellent high-frequency characteristics and electrical conductivity, increase vibration frequency, expand The effect of the field of application

Active Publication Date: 2015-12-16
西安创联光电新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Cu is easily oxidized in the air, especially the micron-sized copper powder. After oxidation, an insulating oxide film is formed on the surface, which changes the copper powder from a conductor to an insulator, which greatly limits the use of copper powder in the field of electronic paste.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Step 1, prepare the organic vehicle:

[0047] Weigh the following raw materials according to mass percentage: terpineol 63%, ethyl cellulose 7%, dibutyl carbitol 8%, diethylene glycol ethyl ether acetate 16%, polyether defoamer 4%, silane The coupling agent is 2%, and the sum of the mass percentages of the above components is 100%. Add the weighed raw materials into a vacuum power stirring tank and stir at a stirring temperature of 70°C for 120 minutes to completely dissolve the raw materials. During the stirring process, increase the speed once per hour, increase the speed from 50 rpm to 80 rpm, and increase the dispersion rate from 1000 rpm to 2000 rpm; After the stirring is completed, vacuum defoaming at -1KPa completes the preparation of the organic carrier.

[0048] Step 2, prepare copper electronic paste:

[0049] 2.1 Weigh respectively according to mass percentage: 1 μm copper powder 65%, glass powder 13%, thixotropic agent 4%, surfactant 0.5%, organic carrier ...

Embodiment 2

[0056] Step 1, prepare the organic vehicle:

[0057] Weigh the following raw materials according to mass percentage: terpineol 50%, ethyl cellulose 15%, dibutyl carbitol 20%, diethylene glycol ethyl ether acetate 6%, polyether defoamer 6%, silane The coupling agent is 3%, and the sum of the mass percentages of the above components is 100%. Add the weighed raw materials into a vacuum power stirring tank and stir at a stirring temperature of 60°C for 120 minutes to completely dissolve the raw materials. During the stirring process, increase the speed once per hour, increase the speed from 30 rpm to 50 rpm, and increase the dispersion rate from 500 rpm to 1000 rpm; After the stirring is completed, vacuum defoaming at -3KPa completes the preparation of the organic carrier.

[0058] After the stirring is finished, if the ethyl cellulose is not completely dissolved, the mixture can be added to a small disperser and continue to stir until it dissolves.

[0059] Step 2, prepare copp...

Embodiment 3

[0067] Step 1, prepare the organic vehicle:

[0068] Weigh the following raw materials according to mass percentage: terpineol 80%, ethyl cellulose 3%, dibutyl carbitol 12%, diethylene glycol ethyl ether acetate 3%, polyether defoamer 1, silane Joint agent 1%, the sum of the mass percentages of the above components is 100%. Add the weighed raw materials into a vacuum power stirring tank and stir at a stirring temperature of 90°C for 120 minutes to completely dissolve the raw materials. During the stirring process, increase the speed once per hour, increase the speed from 80 rpm to 100 rpm, and increase the dispersion rate from 3000 rpm to 4000 rpm; After the stirring is completed, vacuum defoaming at 1KPa completes the preparation of the organic carrier.

[0069] Step 2, prepare copper electronic paste:

[0070] 2.1 Weigh respectively according to mass percentage: 1 μm copper powder 80%, glass powder 4%, thixotropic agent 2%, surfactant 4%, organic carrier 10% prepared in st...

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Abstract

The invention discloses a preparation method of copper electronic paste for piezoelectric ceramics. The method comprises steps of: preparing an organic carrier by using terpilenol, ethyl cellulose, dibutyl carbitol, ethylene glycol monoethyl ether acetate, polyether antifoaming agent, and silane coupling agent; mixing and dispersing copper powder, glass powder, thixotropic agent, and surfactant with the organic carrier so as to obtain the copper electronic paste for piezoelectric ceramics. The method is easy to operate and may achieve production without complex equipment. The copper powder is low in price so as to greatly reduce the production cost of the electronic paste. The prepared copper electronic paste is used for preparing piezoelectric ceramic material. Compared with a method for preparing a piezoelectric ceramic by using conventional silver paste, aluminum paste or the like, the method solves a problem of metal ionic migration and a defect of low adhesion strength and improves the vibration frequency and the conductive performance of the piezoelectric ceramic. The copper electronic paste can be sintered in the air and stored for a long time, and has excellent high-temperature stability performance and oxidation resistance.

Description

technical field [0001] The invention belongs to the field of electronic packaging materials, and relates to a preparation method of copper electronic paste for piezoelectric ceramics. Background technique [0002] Piezoelectric ceramics are functional ceramic materials that can convert mechanical energy and electrical energy into each other. Widely used in ultrasonic transducers, underwater acoustic transducers, electroacoustic transducers, ceramic filters / transformers / frequency discriminators, high voltage generators, infrared detectors, surface acoustic wave devices, electro-optic devices, ignition and detonation devices And piezoelectric gyroscope and other technical fields. [0003] With the development of manufacturing technology of electronic ceramic components, in the 1990s, electronic products required miniaturization, thinning and high efficiency. Single-layer ceramic devices are increasingly transformed into multi-layer ceramic devices, and the vibration frequenc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00
Inventor 刘晓琴王保德公立张淑鸿刘晓莉郗小欢
Owner 西安创联光电新材料有限公司
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