Organic silicon resin package material for LED and preparing method thereof

A technology of resin encapsulation and silicone, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as the decrease of light transmittance, the reduction of LED device brightness, the rise of chip junction temperature, etc., and achieve high strength and long-lasting light transmittance high light transmittance, durability, and low curing temperature

Inactive Publication Date: 2016-01-06
三友(天津)高分子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After long-term use of epoxy resin, yellowing will inevitably occur under the irradiation of ultraviolet light emitted by the LED chip, resulting in a decrease in its light transmittance and reducing the brightness of the LED device
In addition, the thermal resistance of epoxy resin is as high as 250-300°C / w. Poor heat dissipation will cause the temperature of the chip junction to rise rapidly, thereby accelerating the light decay of the device, and even causing open circuit failure due to the stress generated by rapid thermal expansion.
Therefore, with the rapid development of LED research and development, the requirements for packaging materials are getting higher and higher, and epoxy resin can no longer fully meet the packaging requirements of LEDs.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Embodiment 1 (by weight percentage)

[0034] A silicone resin encapsulant for LEDs includes the following raw materials: 7 kg of vinyl-terminated silicone oil with a viscosity of 500 mPa.s, 1 kg of vinyl hydrogen-containing silicone resin with a viscosity of 7600 mPa.s, and methyl alcohol with a viscosity of 500 mPa.s. 0.4 kg of hydrogen-containing silicone oil crosslinking agent, 0.5 kg of diluent hexanediol diglycidyl ether, 0.588 kg of nano-scale silicon dioxide, 0.15 kg of tackifier γ-aminopropyl triethoxysilane, and toughening agent o-phenyl 0.25 kg of dibutyl diformate, 0.02 kg of Airex 450 defoamer from Digo Company, 0.05 kg of low decomposition temperature organic peroxide 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane , high decomposition temperature organic peroxide inhibitor 1,1-di(tert-butylperoxy)-3,3,5-trimethylcyclohexane 0.04 kg, catalyst platinum-1,3-divinyl tetra Methyldisiloxane 0.002 kg.

[0035] Its preparation method is:

[0036] (1) Using a high-...

Embodiment 2

[0040] Embodiment 2 (by weight percentage):

[0041] A kind of LED silicone resin encapsulant comprises the following raw materials: 5 kg of vinyl-terminated silicone oil with a viscosity of 300 mPa.s, 2 kg of vinyl hydrogen-containing silicone resin with a viscosity of 1500 mPa.s, and methyl hydrogen-containing silicone resin with a viscosity of 800 mPa.s. 0.6 kg of silicone oil crosslinking agent, 0.545 kg of diluent phenyl glycidyl ether, 1 kg of nano-scale aluminum oxide, 0.22 kg of tackifier γ-methacryloxypropyl trimethoxysilane, toughening agent hexyl Dioctyl dioic acid 0.4 kg, France SYNTHRON company 388SL defoamer 0.12 kg, low decomposition temperature organic peroxide tert-butyl hydroperoxide 0.06 kg, high decomposition temperature organic peroxide inhibitor tert-butyl peroxybenzoate 0.05 kg, 0.005 kg of microcapsule platinum catalyst encapsulated in diethyl phthalate.

[0042] Its preparation method is:

[0043] (1) Using a high-duty planetary mixer, add 5 kg of vi...

Embodiment 3

[0047] Embodiment 3 (by weight percentage):

[0048] A kind of LED silicone resin encapsulant includes the following raw materials: 5.467 kg of vinyl-terminated silicone oil with a viscosity of 400mPa.s, 1.5 kg of vinyl hydrogen-containing silicone resin with a viscosity of 4500mPa.s, and methyl hydrogen-containing silicone resin with a viscosity of 650mPa.s. 0.5 kg of silicone oil crosslinking agent, 1 kg of diluent ethylene glycol diglycidyl ether, 0.5 kg of nano-sized zinc oxide, 0.25 kg of tackifier γ-(2,3-glycidyloxy)propyltrimethoxysilane, Toughening agent dioctyl sebacate 0.5 kg, American KEPER 800 defoamer 0.15 kg, low decomposition temperature organic peroxide tert-butyl hydroperoxide 0.07 kg, high decomposition temperature organic peroxide inhibitor benzene peroxide 0.06 kg of tert-amyl formate and 0.003 kg of platinum-tetrahydrofuryl catalyst.

[0049] Its preparation method is:

[0050] (1) Using a high-duty planetary mixer, add 5.467 kg of terminal vinyl silicon...

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Abstract

The invention discloses an organic silicon resin package material for an LED and a preparing method thereof. The organic silicon resin package material is prepared by mixing vinyl-terminated silicone fluid, vinyl hydrogen-containing silicon resin, methyl hydrogen silicone oil cross-linking agent, diluent, tackifier, flexibilizer, defoamer, low-decomposition-temperature organic peroxide, high-decomposition-temperature organic peroxide inhibitor, catalyst and inorganic filler and then conducting grinding, vacuum defoamation, and filtration during extrusion. The organic silicon resin package material can be used for LED packaging and encapsulation for other optical purposes. The prepared package material is high in liquidity, transparency, strength and light transmittance, and the heat resistance, yellowing resistance, light transmittance and durability of LED products are also improved.

Description

technical field [0001] The invention relates to an adhesive, in particular to an organic silicon resin encapsulation compound for LED and a preparation method thereof. It can be used for potting of LED packaging or other optical applications. Background technique [0002] The packaging materials used in LED devices require a refractive index higher than 1.5 (25°C), and a light transmittance of not less than 98% (wavelength 400-800nm, sample thickness 1mm). At present, the packaging material of ordinary LEDs is mainly bisphenol A transparent epoxy resin. With the development of white LEDs, especially the development of white LEDs based on ultraviolet light, it is necessary for the outer packaging material to have a high absorption rate for ultraviolet light while maintaining high transparency in the visible light region, so as to prevent the leakage of ultraviolet light; In addition, the packaging material also needs to have strong anti-ultraviolet aging ability. After the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/02C08K3/36C08K5/544C08K5/12C08K5/14H01L33/56
Inventor 邵凯高之香李程吴子刚李建武闫静王晓彤
Owner 三友(天津)高分子技术有限公司
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