Wafer-level packaging method based on silicon molecular sieve and polytetrafluoroethylene composite film
A polytetrafluoroethylene, wafer-level packaging technology, applied in the process of producing decorative surface effects, decorative arts, measuring devices, etc., to achieve the effect of improving packaging efficiency and reducing packaging costs
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[0029] The method of the present invention consists of three parts: the preparation of silicon molecular sieve, the formation of the encapsulation cavity and the gold-silicon eutectic bonding. Among them, the silicon molecular sieve is prepared by deep-hole etching, and the size of the particles that can pass through is selected by controlling the pore size of the molecular sieve, which plays a role in blocking large molecules and selecting small molecules. In order to solve the problem that the surface of the silicon molecular sieve is easy to adhere to chemical substances such as dust, water vapor, oil, and so on, which causes the molecular sieve to block, the present invention modifies the surface of the silicon molecular sieve, that is, prepares a layer of hydrophobic and oleophobic polymer organic polymer film ——Polytetrafluoroethylene film (PTFE). The PTFE film not only has extremely small surface tension and excellent corrosion resistance, but also has a simple preparati...
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