Heat-insulating fireproof material based on phenolic aldehyde hollow microspheres and preparation method thereof

Abstract

Provided are a heat-insulating fireproof material based on phenolic aldehyde hollow microspheres and a preparation method thereof. The heat-insulating fireproof material comprises, by weight ratio, 45-60 wt% of liquid thermosetting phenol resin, 5-20 wt% of phenolic aldehyde hollow microspheres, 5-20 wt% of light filling and 5-15 wt% of flame retardant. The sum of mass percents of all the ingredients is 100 wt%, wherein the phenolic aldehyde hollow microspheres are spherical blind hole phenolic aldehyde hollow microspheres with a diameter of 0.1-500 um and a stacking density of 50-200 kg/m<3>. The invention further comprises the method for preparing the heat-insulating fireproof material based on the phenolic aldehyde hollow microspheres. The product has the advantages that the material is large in foam intensity, good in toughness and low in electrical conductivity, foam holes are uniform, the residual acidity is small and even neutral, and the material is green, environmentally friendly and high in fireproof grade. The preparation forming process is simple.

Description

technical field [0001] The invention relates to a thermal insulation material and a preparation method thereof, in particular to a thermal insulation and fireproof material based on phenolic hollow microspheres and a preparation method thereof. Background technique [0002] In the 1970s, with the outbreak of the global energy crisis, external wall insulation materials began to be widely used in the field of public and civil building energy conservation. Today's commonly used wall insulation materials are mainly divided into inorganic and organic. Among them, inorganic materials such as mineral wool, glass wool, foam glass, microporous calcium silicate, hydrophobic perlite, etc., have good fire resistance, but thermal conductivity If the coefficient is large, the thermal insulation effect is not ideal, and it is difficult to meet the requirements of energy-saving standards; organic materials such as EPS, XPS and PU boards are light in weight, and although they have good therm...

AI Technical Summary

Problems solved by technology

However, the existing phenolic foam insulation materials are closed-cell rigid foams made of A-stage phenolic resins, flame retardants, smoke suppressants, curing agents, foaming agents, and other additives. Due to its own structure and process characteristics, the following problems exist in the production process of phenolic foam plastics: (1) the system has high viscosity and difficult material transfer; (2) the use of low-boiling alkanes and halogenated hydrocarbons as blowing agents is relatively harmful to the environment (3) One-time foam molding, the molding process is affected by many factors such as temperature, proportion, time, etc., the process control is complicated, the cells are difficult to distribute evenly, and the closed cell rate is low, which affects thermal conductivity; (4) foam toughness, Low strength and high slag drop rate; (5) The amount of resin produced is small, and the cost of foam is obviously higher than that of polystyrene foam. The above problems have become the bottleneck of the popularization and application of phenolic foam insulation boards

However, these technical means only improved the process and performance of phenolic microcellular foam to a certain extent, and did not fundamentally solve the problem