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Gallium plating electroplating liquid and gallium film pulse electroplating method

A pulse electroplating and electroplating solution technology, applied in the field of electroplating, can solve the problems of high temperature operation, high cost consumption, high energy consumption, etc., and achieve the effects of good conductivity, wide use temperature and waste reduction

Inactive Publication Date: 2016-03-16
无锡杨市表面处理科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional smelting, refining and alloy preparation methods can no longer fully meet the needs of today's production of scattered metals and their alloys, and traditional methods also have shortcomings of varying degrees, such as high temperature operation, high energy consumption, serious environmental pollution, etc., so it is necessary to seek A new method, the emergence of an environmentally friendly electroplating solution for gallium plating provides a new possibility
In the electroplating industry, the electroplating solution is discarded as electroplating waste, so additional environmental pollution and disposal costs are generated
When electroplating with a new plating solution, the purchase of the plating solution consumes a lot of costs

Method used

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  • Gallium plating electroplating liquid and gallium film pulse electroplating method
  • Gallium plating electroplating liquid and gallium film pulse electroplating method
  • Gallium plating electroplating liquid and gallium film pulse electroplating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The gallium plating electroplating solution of the present embodiment is made up of the component of following concentration:

[0021]

[0022] The pulse electroplating method for preparing a gallium thin film using the gallium plating electroplating solution of this embodiment comprises the following steps:

[0023] a. Prepare the electroplating solution according to the proportion;

[0024] b. Pulse electroplating, the electroplating solution is injected into the electroplating equipment, and the copper sheet is used as the cathode and the pure gold plate is used as the anode for electroplating. The film deposited on the surface of the cathode copper sheet is a gallium film. The electroplating process conditions are, and the current density is 0.6A / dm 2 , The frequency is 500Hz, the duty ratio is 1:7, the temperature of the plating solution is 25°C, and the pH value is 7.5-11.5.

[0025] Wherein, the distance between the cathode and the anode is 5 cm, the power s...

Embodiment 2

[0027] The gallium plating electroplating solution of the present embodiment is made up of the component of following concentration:

[0028]

[0029] The pulse electroplating method for preparing a gallium thin film using the gallium plating electroplating solution of this embodiment comprises the following steps:

[0030] a. Prepare the electroplating solution according to the proportion;

[0031] b. Pulse electroplating, the electroplating solution is injected into the electroplating equipment, and the copper sheet is used as the cathode and the pure gold plate is used as the anode for electroplating. The film deposited on the surface of the cathode copper sheet is a gallium film. The electroplating process conditions are, and the current density is 0.7A / dm 2 , The frequency is 600Hz, the duty ratio is 1:9, the temperature of the plating solution is 35°C, and the pH value is 7.5-11.5.

[0032] Wherein, the distance between the cathode and the anode is 6.5 cm, the power...

Embodiment 3

[0034]

[0035] The pulse electroplating method for preparing a gallium thin film using the gallium plating electroplating solution of this embodiment comprises the following steps:

[0036] a. Prepare the electroplating solution according to the proportion;

[0037] b. Pulse electroplating, the electroplating solution is injected into the electroplating equipment, and the copper sheet is used as the cathode and the pure gold plate is used as the anode for electroplating. The film deposited on the surface of the cathode copper sheet is a gallium film. The electroplating process conditions are, and the current density is 0.8A / dm 2 , The frequency is 700Hz, the duty ratio is 1:11, the temperature of the plating solution is 50°C, and the pH value is 7.5-11.5.

[0038] Wherein, the distance between the cathode and the anode is 8cm, the power supply for electroplating is a single-pulse electroplating power supply, and the mass percentage of gold in the anode is ≥99.99%.

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Abstract

The present invention discloses a gallium plating electroplating liquid, which comprises 800-900 g.kg<-1> of n-propyl pyridine chloride, 60-90 g.kg<-1> of gallium chloride, 0.5-2.5 g.kg<-1> of N-methyl pyrolidone, 2.5-4.5 g.kg<-1> of ethylene glycol, 2.5-4 g.kg<-1> of gelatin, 2.5-4.5 g.kg<-1> of sodium tetrafluoroborate, and the balance of propanol. The gallium plating electroplating liquid of the present invention has a lot of unique properties such as low melting point, good electrical conductivity, negligible vapor pressure, wide use temperature, special solubility, and the like.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to an electroplating solution for gallium plating, and also relates to a pulse electroplating method for preparing a gallium thin film by using the electroplating solution. Background technique [0002] Scattered metals refer to a series of rare metal elements, including gallium (Ga), indium (In), thallium (Tl), germanium (Ge), selenium (Se), tellurium (Te) and rhenium (Re). Scattered metals are my country's superior resources. From the perspective of the use of gallium, its elemental metal and alloy have many special properties. Indispensable emerging materials in cutting-edge technology fields such as energy and energy. Traditional smelting, refining and alloy preparation methods can no longer fully meet the needs of today's production of scattered metals and their alloys, and traditional methods also have shortcomings of varying degrees, such as high temperature operation, high ene...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/54C25D5/18
Inventor 潘增炎
Owner 无锡杨市表面处理科技有限公司
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