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A kind of two-layer double-sided flexible copper clad laminate and its manufacturing method

A technology of flexible copper clad laminates and manufacturing methods, applied in chemical instruments and methods, lamination, layered products, etc., can solve problems such as increased production costs, poor heat resistance, gaps in heat resistance, and water absorption, and achieve enhanced Adhesive effect, improvement of peel strength, and improvement of production efficiency

Active Publication Date: 2018-05-29
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The two-layer double-sided flexible copper-clad laminate of the former structure has both high glass strength and good dimensional stability, but the problem is that the TPI in the outer layer has poor heat resistance, and when it encounters burning , the TPI layer is easy to decompose, resulting in poor flame retardancy of the two-layer double-sided flexible copper clad laminate; at the same time, because TPI itself contains more flexible groups and has a larger free volume, it is easy to absorb water. Under the repeated heat and humidity impact of the subsequent processing of the PCB board, it is easy to cause the board to explode
Although the latter structure avoids the impact of the lack of TPI to a certain extent, it is difficult to completely avoid the problems caused by the lack of TPI performance, and this structure has higher requirements on the formulation of TPI and PI, as well as the production process , increasing the difficulty of production
[0005] In addition, in the double-sided flexible copper clad laminates of the above two structures, the insulating layer contains a thermoplastic polyimide layer (PI layer) and a non-thermoplastic polyimide layer (TPI layer), wherein the TPI layer is used as an adhesive layer, the PI layer is used as a functional layer, and the two interact to ensure that the product has good dimensional stability; however, due to the difference in heat resistance and water absorption between the two, there will be some delamination in the product, and The preparation of multi-layer structure will inevitably increase the difficulty of production and increase the production cost

Method used

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  • A kind of two-layer double-sided flexible copper clad laminate and its manufacturing method
  • A kind of two-layer double-sided flexible copper clad laminate and its manufacturing method

Examples

Experimental program
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preparation example Construction

[0054] 1. Preparation of thermoplastic polyamic acid resin glue

[0055] In the present invention, the raw material and brief expression of the thermoplastic polyimide resin containing acetylene group are recorded as follows:

[0056] NMP: organic solvent, N-methylpyrrolidone

[0057] PDA: p-phenylenediamine (molecular weight: 108.14, CAS No: 106-50-3)

[0058] ODA: 4,4'-diaminodiphenyl ether (molecular weight: 200.24, CAS No: 101-80-4)

[0059] BAPS: 4,4'-bis(4-aminophenoxy)diphenylsulfone (molecular weight 432.49, CAS No: 13080-89-2)

[0060] BPDA: 3,3',4,4'-biphenyltetraacid dianhydride (molecular weight: 294.22, CAS No: 2420-87-3)

[0061] PMDA: pyromellitic dianhydride (molecular weight: 218.12, CAS No: 89-32-7)

[0062] PEPA: 4-phenylethynyl phthalic anhydride (molecular weight: 248.24, CAS: 119389-05-8)

[0063] 4-Ethynylaniline: (molecular weight: 117.15, CAS: 14235-81-5)

[0064] 4-ethynylphthalic anhydride: (molecular weight: 172.14, CAS: 73819-76-8)

Synthetic example 1

[0066] Add solvent NMP 850g in a 1L three-necked flask, weigh 86.5g of BAPS, 30.0g of ODA and 16.2g of PDA, dissolve them all in the above-mentioned NMP to form a solution, cool the solution in a water bath, Add 133.9g of BPDA, control the reaction temperature at 15-20°C, react for half an hour, add 22.3g of PEPA, and continue stirring for 8 hours to prepare a polyamic acid resin glue containing acetylene groups, with a solid content of 25% , The molecular weight of the polyamic acid resin containing ethynyl group is 5000g / mol.

Synthetic example 2

[0068] Add 850g of solvent NMP to a 2L three-necked flask, weigh 86.5g of BAPS, 30.0g of ODA, and 16.2g of PDA, dissolve them all in the above-mentioned NMP to form a solution, cool the solution in a water bath, and Add 122.1g of BPDA, control the reaction temperature at 15-20°C, react for half an hour, add 42.2g of PEPA, and continue stirring for 8 hours to prepare a thermoplastic polyamic acid resin glue containing acetylene groups;

[0069] Take 80ml of acetic anhydride and 40ml of pyridine, mix them and add them to the polyamic acid resin glue containing ethynyl groups, stir and react at room temperature for 24 hours, then pour the resulting solution into a sufficient amount of deionized water to obtain polyimide precipitation , filtered, rinsed with ethanol, and dried at 80° C. for 24 hours to obtain acetylene-containing thermoplastic polyimide powder;

[0070] The powder was formulated into a solution with a solid content of 25% by using NMP, wherein the designed molecul...

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Abstract

The invention relates to the technical field of printed circuit boards and particularly relates to a two-layer-process double-faced flexible copper-clad plate. The two-layer-process double-faced flexible copper-clad plate comprises an upper copper foil layer, a lower copper foil layer and polyimide insulating layers, wherein the polyimide insulating layers are sequentially clamped between the upper copper foil layer and the lower copper foil layer; the polyimide insulating layers are non-thermoplastic polyimide insulating layers prepared by the steps of carrying out thermal imidization and chemical imidization on acetenyl-containing thermoplastic polyamide acid resin glue liquid, and carrying out thermal treatment, so as to promote the crosslinking of acetenyl in thermoplastic polyimide. By utilizing acetenyl, the binding effect between non-thermoplastic polyimide and copper foils is enhanced, the peel strength is improved, meanwhile, the Tg, peel strength and size stability of the thermally cured non-thermoplastic polyimide are further improved, and the moisture rate is relatively low. Besides, the invention further relates to a preparation method of the two-layer-process double-faced flexible copper-clad plate.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a two-layer double-sided flexible copper clad laminate and a manufacturing method thereof. Background technique [0002] Flexible printed circuit boards have been widely used in consumer electronics products such as notebook computers, mobile phones, and digital cameras. With the continuous development of electronics industry technology, the requirements for electronic products continue to increase. More and more electronic Products tend to be thinner and more highly integrated, so the corresponding flexible copper clad laminates are required to be lighter and thinner, and at the same time, because the functions of electronic products are getting stronger and the integration is getting better and better, the resistance to flexible copper clad laminates Thermal performance, stability, and reliability all put forward higher requirements. Compared with glued sheets, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/088B32B15/20B32B37/10C08G73/12
CPCB32B15/088B32B15/20B32B37/10B32B2307/306B32B2307/73B32B2457/08C08G73/126
Inventor 胡启彬伍宏奎茹敬宏梁立戴仁杰周笃官
Owner GUANGDONG SHENGYI SCI TECH