Pretreatment method before molybdenum copper carrier electroplating

Abstract

The invention relates to a metal surface treatment method, particularly a pretreatment method of a molybdenum copper carrier before electroplating. The invention aims to provide a pretreatment method of a molybdenum copper carrier before electroplating. The method can be used for obtaining a high-binding-force non-scale non-blistering coating on the molybdenum copper surface. Meanwhile, the method has small influence on the environment. The method comprises the following steps: oil removal, alkali washing and acid washing, stripping and activation, and sputtering for depositing a prime coat.

Description

technical field [0001] The invention relates to a metal surface treatment method, in particular to a pretreatment method before electroplating. Background technique [0002] The molybdenum-copper carrier is a pseudo-alloy material composed of molybdenum with a body-centered cubic structure and copper with a face-centered cubic structure that are insoluble in each other and each maintains a relatively independent composition. It has high electrical and thermal conductivity, adjustable thermal expansion coefficient, good high temperature characteristics, and excellent processing performance and is widely used in various fields of industrial production, such as electronic packaging, heat sink materials, large-scale integrated circuit devices . In addition, Mo / Cu composite materials are essential key materials in microwave, communication, radio frequency, aerospace, power electronics, high-power laser and other industries, and are the basis for the development and production of...

AI Technical Summary

Problems solved by technology

However, there are the following problems in electroplating: (1) the surface of molybdenum copper is easily oxidized to form a complex oxide film, and the existence of this oxide film will lead to poor bonding between the coating and the carrier

However, the electroplating process of chromium has a great impact on the environment, and the small carrier process is not easy to control

(3) The molybdenum-copper carrier is a pseudo-alloy. There is no eutectic between molybdenum and copper. In fact, they are still two substances. Poor strength, easy to foam and peel

However, the sand blasting method is only suitable for workpieces with simple shapes and large volumes; the anodic etching method is likely to cause over-corrosion of copper; the chromic acid treatment method uses high concentrations of chromic acid, which has a great impact on the environment

(2) Use nickel instead of chromium as the base layer of other coatings (such as Chinese patent CN102345145B), but the binding force between nickel and molybdenum-copper carrier is low

However, the main component of the molybdenum-copper carrier is molybdenum. The molybdenum-copper carrier itself is a pseudo-alloy, and the bonding force between molybdenum and copper is poor.

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