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A kind of epoxy adhesive that can be disassembled quickly and its preparation and disassembly method

A technology of epoxy adhesive and epoxy diluent, which is applied in the direction of adhesive, epoxy glue, adhesive type, etc., can solve the problems of energy consumption, serious environmental pollution, difficult disassembly, etc., and achieve excellent bonding performance, The effect of simple preparation process and convenient use

Active Publication Date: 2018-06-29
MATERIAL INST OF CHINA ACADEMY OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of poor adhesion between ordinary epoxy adhesives and metal substrates, difficulty in dismantling, huge energy consumption, serious environmental pollution, and easy damage to parts during the dismantling process. Quickly disassembled epoxy adhesive and its preparation and disassembly method

Method used

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  • A kind of epoxy adhesive that can be disassembled quickly and its preparation and disassembly method
  • A kind of epoxy adhesive that can be disassembled quickly and its preparation and disassembly method
  • A kind of epoxy adhesive that can be disassembled quickly and its preparation and disassembly method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Embodiment 1 contains the preparation of the mixture of furan-maleimide adduct

[0051] Dissolve 7.14g (0.02mol) of N,N'-dimethyltetraphenylbismaleimide in 20mL of tetrahydrofuran, then pour it into a 100mL three-necked flask, stir it magnetically, and blow nitrogen. Then slowly add 12.32g (0.08 mole) of furan glycidyl ether into the N,N'-dimethyltetraphenylbismaleimide-tetrahydrofuran solution, reflux at 66°C for 24 hours, and then distill off the tetrahydrofuran solvent under reduced pressure , That is, a mixture containing furan-maleimide adduct. During the preparation process, the infrared spectrum and 1 H NMR spectrum as Figure 2-3 shown.

Embodiment 2

[0052] The preparation of the carbon nanotube of embodiment 2 polyethyleneimine modification

[0053] a. Weigh 2 g of multi-walled carbon nanotubes (Nanjing Jicang Nano Model JCMT-99-11-50) and add 30 ml of concentrated sulfuric acid and 10 ml of concentrated nitric acid (volume ratio 3:1) into the mixed solution, magnetic stirring, stirring speed 600 revolutions per minute, heat up to 65°C, and keep warm for 90 minutes; then use an organic filter membrane with a pore size of 0.45 microns to filter; redisperse the filter cake in deionized water and wash, filter until it is neutral, and finally filter the cake Vacuum drying in an oven at 110°C for 6 hours, and the resulting product is carbon oxide nanotubes;

[0054] b. Weigh 1 g of oxidized carbon nanotubes, add 20 ml of N,N-dimethylformamide solvent, and then ultrasonically disperse at 80°C for 30 minutes, with an ultrasonic power of 100W, until the oxidized carbon nanotubes are completely dispersed in N,N - In dimethylfor...

Embodiment 3

[0055] Embodiment 3 The preparation method of the epoxy adhesive that can be disassembled quickly

[0056] a. Take a certain amount of amino-modified carbon nanotubes (or the polyethyleneimine-modified carbon nanotubes obtained in Example 2) and epoxy curing agent according to the formula, mix and defoam in the revolution and rotation of RN-500 Stir in the machine at a speed of 1000 rpm for 20 minutes, and then ultrasonically disperse for 30 minutes in an ultrasonic cleaner with a power of 100W and a temperature of 60°C to obtain the curing agent premix 1;

[0057] b. Weigh a certain amount of epoxy resin, epoxy diluent and the mixture containing furan-maleimide adduct according to the formula, slowly heat to 70°C, stir at high speed for 20 minutes, and then use a three-roll mill to coarsely Mix 3 times and finely mix 3 times; add heat-expandable microspheres, then stir for 10 minutes at a speed of 1000 rpm in the RN-500 revolution / rotation mixing defoamer produced by Japan ...

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Abstract

The invention provides an epoxy adhesive capable of being removed quickly. The epoxy adhesive is prepared from, by weight, 20-50 parts of epoxy resin, 10-20 parts of epoxy diluent, 50-80 parts of mixture containing a furan-maleimide addition product, 40-70 parts of curing agent, 0.5-2 parts of amido modified carbon nano tube and 5-20 parts of thermal expansion microsphere, wherein the mixture containing the furan-maleimide addition product is the diglycidyl ether and furan glycidyl ether mixture containing the furan-maleimide addition product. The epoxy adhesive is high in bonding strength at room temperature and is easy to remove at medium temperature.

Description

technical field [0001] The invention relates to an adhesive material, in particular to a two-component room-temperature-curing epoxy adhesive used for bonding metal to metal, especially metal thin layer materials containing radioactive elements, and its preparation and disassembly methods. Background technique [0002] Epoxy adhesives have the advantages of excellent adhesion, chemical stability, high and low temperature resistance, low shrinkage rate, and low cost. They are widely used in the bonding of various metals and have become a and other indispensable basic materials. The annual consumption exceeds 2 million tons. Certain products bonded with epoxy adhesives require recycling of metal substrates containing radioactive elements when the bonded components are decommissioned. [0003] However, since epoxy adhesives form a three-dimensional network structure after curing, they are insoluble and infusible, so it is very difficult to disassemble them. At present, pyrol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04C09J11/08
CPCC08K2201/011C09J11/04C09J11/06C09J163/00C08L33/14C08K13/06C08K9/04C08K7/24C08K5/3415
Inventor 帅茂兵郭亚昆赵鹏翔仲敬荣徐对功杨晓娇常凤雯岳国宗陈林
Owner MATERIAL INST OF CHINA ACADEMY OF ENG PHYSICS