Potassium titanate whisker toughened silicon carbide-based ceramic circuit board substrate material and preparation method thereof

Abstract

The invention discloses a silicon carbide-based ceramic circuit board substrate material toughened by potassium titanate whiskers. The silicon carbide-based ceramic substrate is compounded with micron-sized silicon carbide powder, fluorite, and nanometer-sized spherical alumina micropowder. Use, the sintering temperature of the base material is reduced, the sintering density is higher, and the polyethylene glycol composite solvent containing the transparent liquid of nano-ceramic powder has strong wettability and bonding ability between the powders, which can make the materials evenly dispersed , to achieve effective melting and activation effects, and a high-density, high-gloss composite ceramic substrate can be obtained at a relatively low sintering temperature. It has good electrical insulation, high thermal conductivity, and great application potential.

Description

technical field [0001] The invention relates to the technical field of silicon carbide ceramic preparation, in particular to a silicon carbide-based ceramic circuit board substrate material toughened by potassium titanate whiskers and a preparation method thereof. Background technique [0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, alumina and beryllium oxide are mainly used as substrate materials for a long time. However, alumina ceramic sheets have low thermal conductivity and thermal expansion. The coefficient does not match with Si and other s...

AI Technical Summary

Problems solved by technology

[0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, alumina and beryllium oxide are mainly used as substrate materials for a long time. However, alumina ceramic sheets have low thermal conductivity and thermal expansion. The coefficient does not match with Si and other shortcomings. Although the comprehensive performance of beryllium oxide ceramics is relatively good, its production cost is high and toxic. Although the comprehensive performance of aluminum nitride ceramics is relatively good, the production cost is high and the application is also limited. Silicon carbide as a substrate material has obvious advantages in terms of performance

[0003] Although the application prospects of silicon carbide ceramic substrates are broad, in the actual production process, there are problems such as low sintering density, low utilization rate of raw materials, and insulation to be improved, which restrict the large-scale use of such materials. Further improvements in the production process