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MDI-base polyurethane electronic pouring sealant as well as preparation method and application method thereof

A potting and polyurethane technology, applied in the direction of polyurea/polyurethane adhesives, adhesives, non-polymer adhesive additives, etc., can solve the problems of difficult to guarantee performance and stability, high prepolymer viscosity and high activity , to achieve the effect of adjustable curing speed, low fogging flame retardant performance and good adhesion

Active Publication Date: 2016-08-24
MIANYANG WELLS ELECTRONICS MATERIAIS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with TDI, MDI has higher activity and higher viscosity of prepolymer, so the polyurethane potting adhesive of MDI system is usually prepared by one-step method, which makes it difficult to guarantee the performance and stability of the product

Method used

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  • MDI-base polyurethane electronic pouring sealant as well as preparation method and application method thereof
  • MDI-base polyurethane electronic pouring sealant as well as preparation method and application method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] (1) Preparation of component A: Add 20kg polypropylene glycol (MN=2000) and 30kg hydroxyl-terminated polyphosphate (hydroxyl value 170mgKOH / g) into the reactor and vacuum dehydrate at 110°C for 3h, then cool down to At 65°C, add 20kg of 4,4-diphenylmethane diisocyanate and 30kg of polymethylene polyphenyl polyisocyanate, and gradually raise the temperature to 80°C within 30 minutes to react. During the reaction, pass nitrogen protection and test the NCO% value. When the NCO% value reaches 11%, the reaction is stopped, and the A component is obtained.

[0024] (2) Preparation of component B: Add 75kg of polypropylene glycol (MN=3000), 22kg of castor oil (hydroxyl value 170mgKOH / g), 3kg of 1,4-butanediol, and 119kg of alumina into the reactor and heat at 115°C Stir under vacuum for 2 hours, then lower the temperature to 75°C, add 0.5kg of defoamer, 0.01kg of catalyst, and 0.5kg of antioxidant and stir evenly to obtain component B.

[0025] (3) After weighing, stirring an...

Embodiment 2

[0027] (1) Preparation of component A: Add 20kg polypropylene glycol (MN=2000), 9kg tris(dipropylene glycol) phosphite (hydroxyl value 395mgKOH / g) into the reactor and vacuum dehydrate at 115°C 2h, then lower the temperature to 70°C, add 50kg of liquefied 4,4-diphenylmethane diisocyanate, and gradually raise the temperature to 85°C within 30min to react, protect with nitrogen during the reaction, and test the NCO% value, in the NCO% When the value reaches 15%, the reaction is stopped, and the A component is obtained.

[0028] (2) Preparation of component B: 72kg polypropylene glycol (MN=2000), 17kg castor oil (hydroxyl value 170mgKOH / g), 1kg propylene glycol, 50kg alumina, 59kg aluminum hydroxide were added to the reactor and heated at 120°C Stir under vacuum for 2 hours, then lower the temperature to 80°C, add 0.5kg of defoamer, 0.01kg of catalyst, and 0.5kg of antioxidant and stir evenly to obtain component B.

[0029] (3) After weighing, stirring and defoaming components A...

Embodiment 3

[0031] (1) Preparation of component A: 15g polypropylene glycol (MN=2000), 12.5g N, N-di(2-hydroxyethyl)aminomethylphosphonic acid diethyl ester (hydroxyl value 450mgKOH / g) was added to In the reactor, vacuum dehydrate at 120°C for 2 hours, then lower the temperature to 60°C, add 35g of 4,4-diphenylmethane diisocyanate, 15g of polymethylene polyphenyl polyisocyanate and gradually heat up to 75°C within 30min for reaction , Nitrogen protection during the reaction, and the NCO% value is tested, and the reaction is stopped when the NCO% value reaches 15%, that is, the A component is obtained.

[0032] (2) Preparation of component B: Add 39kg hydroxyl-terminated polybutadiene (hydroxyl value 60mgKOH / g), 29kg castor oil (hydroxyl value 170mgKOH / g), 2kg1,4-butanediol and 129kg aluminum hydroxide In the reaction kettle, stir under vacuum at 110°C for 2 hours, then lower the temperature to 60°C, add 0.5kg of defoamer, 0.01kg of catalyst, and 0.5kg of antioxidant and stir evenly to obt...

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Abstract

The invention discloses an MDI-base polyurethane electronic pouring sealant as well as a preparation method and an application method thereof. The electronic pouring sealant comprises two components of A and B, wherein the component A is prepared from 50-60 parts of isocyanate, 15-20 parts of low-polymer polyalcohol and 9-30 parts of reaction type liquid flame retardant according to parts by weight; the component B is prepared from low-polymer polyalcohol, a crosslinking chain extender, a catalyst, a filler, a defoamer and an anti-oxygen according to certain proportion. The component A and the component B are mixed and cured according to certain proportion to prepare the pouring sealant. The MDI-base polyurethane electronic pouring sealant is prepared with a half-pre-polymerization method, the toxicity caused by volatilization of NCO is avoided, and synergistic flame retarding of the halogen-free reaction type liquid flame retardant and the filler avoids the influences of an addition type liquid flame retardant on the stability and performance of the polyurethane pouring sealant. A prepared polyurethane elastomer is suitable for pouring and sealing of small and medium electronic elements.

Description

technical field [0001] Embodiments of the present invention relate to electronic device potting adhesives, which belong to the field of chemistry. More specifically, embodiments of the present invention relate to MDI-based halogen-free environmentally friendly polyurethane potting adhesives for packaging small electronic components and their preparation methods and application methods. Background technique [0002] Potting glue mainly includes epoxy potting glue, silicone potting glue, polyurethane potting glue and so on. Epoxy potting adhesive has excellent bonding performance and good insulation performance, but it is brittle after curing, has poor elasticity and poor impact resistance; silicone potting adhesive has excellent insulation performance, high and low temperature resistance and impact resistance, but its oil resistance and adhesion Power is poor. Polyurethane potting adhesive has good insulation performance, water resistance and oil resistance, and its mechanic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/08C09J11/04C08G18/76C08G18/66C08G18/48C08G18/38C08G18/67C08G18/32C08G18/69
CPCC08G18/3206C08G18/36C08G18/3885C08G18/3887C08G18/3889C08G18/4845C08G18/6666C08G18/69C08G18/721C08G18/7664C08G18/7671C08K3/22C08K3/36C08K2003/2227C08K2201/003C08K2201/014C09J11/04C09J175/08
Inventor 黄金陆南平
Owner MIANYANG WELLS ELECTRONICS MATERIAIS
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