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Copper material pickling polishing solution and preparation method and application method thereof

A technology of polishing liquid and copper acid, which is applied in the field of metal polishing, can solve the problems of difficult size correction processing technology, hard surface texture, unfavorable processing operation, and damage to the health of operators, so as to achieve fast polishing speed, smooth surface, and high production efficiency. low cost effect

Active Publication Date: 2016-11-09
Dongguan Kaimeng Chemical Co Ltd
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantages of the pickling and polishing process of the chromate system are fast polishing speed, high efficiency, good brightness, and small surface hardness, which is conducive to subsequent processing, simple maintenance, and long service life; the disadvantage is that it contains heavy metal chromium and is highly carcinogenic. Valence chromium, damage the health of workers
The advantages of the pickling and polishing process of nitric acid and nitrate system are that it does not contain heavy metal chromium, the polishing speed is fast, the brightness is high, and the maintenance is relatively simple; the disadvantage is that it will emit toxic "yellow smoke" (NO 2 ), resulting in a bad production environment that damages the health of operators, and the hard surface texture after polishing is not conducive to subsequent processing operations
The advantages of the pickling and polishing process of the hydrogen peroxide system are that it does not contain heavy metal chromium, has very high brightness, and has no "yellow smoke" (NO 2 ) produced; the disadvantage is that the hydrogen peroxide is extremely unstable and easy to decompose, which leads to the short service life of the potion. It is difficult to carry out the processing technology of size correction and other processes

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] A copper pickling and polishing solution, the copper pickling and polishing solution comprises the following raw materials in weight percentage:

[0056] Ferric salt 15%

[0057] Sulfuric acid 10%

[0058] Compound additive 0.9%

[0059] water balance.

[0060] The ferric salt is ferric sulfate.

[0061] The complex auxiliary agent is composed of 0.3% complexing agent and 0.6% nonionic surfactant.

[0062] The complexing agent consists of 0.1% EDTA and 0.2% potassium sodium tartrate.

[0063] The nonionic surfactant is composed of 0.5% fatty amine polyoxyethylene ether and 0.1% alkylphenol polyoxyethylene ether.

[0064] The invention discloses a method for preparing a copper pickling polishing solution, which comprises weighing the above-mentioned raw materials according to weight percentage and mixing them uniformly to prepare the copper pickling polishing solution.

[0065] A method for using a copper pickling polishing solution, comprising the steps of:

[00...

Embodiment 2

[0072] The difference between this embodiment and the above-mentioned embodiment 1 is:

[0073] A copper pickling and polishing solution, the copper pickling and polishing solution comprises the following raw materials in weight percentage:

[0074] Ferric salt 19%

[0075] Sulfuric acid 12%

[0076] Chlorate 3%

[0077] Persulfate 5%

[0078] Hypochlorite 0.3%

[0079] Compound additive 1.3%

[0080] water balance.

[0081] The ferric salt is ferric chloride; the chlorate is potassium chlorate or sodium chlorate.

[0082] The persulfate is potassium persulfate or sodium persulfate; the hypochlorite is potassium hypochlorite or sodium hypochlorite.

[0083] The complex auxiliary agent is composed of 0.5% complexing agent and 0.8% nonionic surfactant.

[0084] The complexing agent consists of 0.2% EDTA and 0.3% potassium sodium tartrate.

[0085] The nonionic surfactant is composed of 0.5% fatty amine polyoxyethylene ether and 0.3% alkylphenol polyoxyethylene ether.

...

Embodiment 3

[0093] The difference between this embodiment and the above-mentioned embodiment 1 is:

[0094] A copper pickling and polishing solution, the copper pickling and polishing solution comprises the following raw materials in weight percentage:

[0095] Ferric salt 15%

[0096] Sulfuric acid 10%

[0097] Chlorate 1%

[0098] Persulfate 5%

[0099] Hypochlorite 0.1%

[0100] Compound additive 1.6%

[0101] water balance.

[0102] The ferric salt is ferric citrate; the chlorate is calcium chlorate.

[0103] The persulfate is ammonium persulfate; the hypochlorite is calcium hypochlorite.

[0104] The complex auxiliary agent is composed of 0.7% complexing agent and 0.9% nonionic surfactant.

[0105] The complexing agent consists of 0.2% EDTA and 0.5% potassium sodium tartrate.

[0106] The nonionic surfactant is composed of 0.6% fatty amine polyoxyethylene ether and 0.3% alkylphenol polyoxyethylene ether.

[0107] A method for using a copper pickling polishing solution, comp...

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PUM

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Abstract

The invention relates to the technical field of metal polishing, in particular to a copper material pickling polishing solution and a preparation method and application method thereof. The copper material pickling polishing solution is prepared from, by weight percent, 15%-28% of tervalent ferric salt, 10%-15% of sulfuric acid, 0%-5% of chlorate, 0%-7% of peroxysulphate, 0%-0.5% of pypocholoride, 0.9%-2.1% of compound additive and the balance water. The copper material pickling polishing solution is environmentally friendly, free of chromium, yellow fume and nitrogen and phosphorus ingredients, stable in performance, high in polishing speed, capable of being recycled, long in service life and easy to maintain, the brightness is equivalent to the polishing effect of a chromate system process, and use cost is equivalent to that of the chromate system process.

Description

technical field [0001] The invention relates to the technical field of metal polishing, in particular to a copper pickling polishing solution and a preparation method and use method thereof. Background technique [0002] At present, the copper pickling and polishing process is mainly divided into three systems according to the composition system: chromate system, nitric acid and nitrate system, and hydrogen peroxide system. The advantages of the pickling and polishing process of the chromate system are fast polishing speed, high efficiency, good brightness, and small surface hardness, which is conducive to subsequent processing, simple maintenance, and long service life; the disadvantage is that it contains heavy metal chromium and is highly carcinogenic. Valence of chromium, damage to the health of workers. The advantages of the pickling and polishing process of nitric acid and nitrate system are that it does not contain heavy metal chromium, the polishing speed is fast, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23G1/10C23F3/06
CPCC23F3/06C23G1/103
Inventor 刘子灿刘锋
Owner Dongguan Kaimeng Chemical Co Ltd
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