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Method for preparing environment-friendly electronic substrate solder

A technology for electronic substrates and fluxes, applied in welding equipment, welding media, welding/cutting media/materials, etc., can solve problems such as poor welding performance, air pollution, short circuit, etc., to achieve superior solderability and board surface residues The effect of less material and low ionic contamination

Inactive Publication Date: 2016-11-16
雷春生
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem mainly solved by the present invention is to provide an environment-friendly electronic substrate in view of the poor welding efficiency of the traditional electronic substrate soldering agent, which leads to short circuits and open circuits, and the defects that the residues after solder welding cause serious pollution to the air. Solder preparation method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0018] Collect 100g seedling green tree surface shellac, remove shellac surface impurity through artificial selection, wash 3 times with deionized water, then it is spread evenly on graphite disc, grind 10min, mix 100mL deionized water in grinding process, pass 100-mesh sieve to get shellac slurry, add it to a beaker, then add 200mL hydrogen peroxide with a mass concentration of 28%, stir and mix with a glass rod for 3 minutes, let stand for 3 hours, filter to obtain a filter residue; add the above filter residue to a beaker Add 100mL deionized water and 5g sodium carbonate in sequence, stir for 20min, then transfer to a constant temperature oscillator, shake at 70°C for 3h, then add to a centrifuge, centrifuge at 3000r / min for 10min, discard the lower layer Impurities, get the supernatant, set aside; sequentially weigh 5g peptone, 1g dipotassium hydrogen phosphate, 0.5g magnesium sulfate, 2g yeast powder, 20g glucose, 10g agar and 800mL deionized water and stir to make culture...

example 2

[0021] Collect 150g seedling green tree surface shellac, remove shellac surface impurity through manual selection, wash 4 times with deionized water, then it is spread evenly on graphite disc, grind 13min, mix 150mL deionized water in grinding process, pass 150-mesh sieve to obtain shellac slurry, which was added to a beaker, and then 250 mL of hydrogen peroxide with a mass concentration of 29% was added, stirred and mixed with a glass rod for 4 minutes, left to stand for 3.5 hours, and filtered to obtain a filter residue; the above filter residue was added to In the beaker, add 150mL deionized water and 7g sodium carbonate in turn, stir for 25min, then transfer to a constant temperature oscillator, shake at 75°C for 3.5h, then add to a centrifuge, centrifuge at 3500r / min for 15min, discard Remove the impurities in the lower layer, get the supernatant, and set aside; Weigh 6g of peptone, 2g of dipotassium hydrogen phosphate, 0.6g of magnesium sulfate, 3g of yeast powder, 25g of...

example 3

[0024] Collect 200g seedling green tree surface shellac, remove shellac surface impurity through artificial selection, wash 5 times with deionized water, then it is spread evenly on graphite disc, grind 15min, mix 200mL deionized water in grinding process, pass 200 mesh sieve to get shellac slurry, put it into a beaker, then add 300mL hydrogen peroxide with a mass concentration of 30%, stir and mix with a glass rod for 5min, let stand for 4h, filter to get a filter residue; add the above filter residue into a beaker Add 200mL deionized water and 10g sodium carbonate in sequence, stir for 30min, then transfer to a constant temperature shaker, shake at 80°C for 4h, then add to a centrifuge, centrifuge at 4000r / min for 20min, discard the lower layer Impurities, get the supernatant, set aside; successively weigh 7g peptone, 3g dipotassium hydrogen phosphate, 0.8g magnesium sulfate, 4g yeast powder, 30g glucose, 15g agar and 1000mL deionized water and stir to make culture medium, an...

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Abstract

The invention discloses a method for preparing an environment-friendly electronic substrate solder, and belongs to the technical field of solders. According to the method, lac is adopted as a raw material, hydrogen peroxide is added to be mixed, impurities are removed, then water and sodium carbonate are added for oscillation, and then centrifugation is carried out; supernate is collected, peptone, dipotassium phosphate and the like are added for stirring, a culture medium is prepared, inoculated culture is carried out through mould, and then auxiliary materials are added for fermentation to obtain mixed acid; and the mixed acid is mixed with the supernate, finally ascorbic acid, sodium dodecyl benzene sulfonate and the like are added for constant-temperature oscillation, and the environment-friendly electronic substrate solder is obtained after cooling. The lac is adopted as the raw material, compatibility and cohesiveness are good, the defect that a traditional solder is poor in welding performance is overcome, the raw material is easy to obtain, environment friendliness is achieved, and wide application prospects are achieved.

Description

technical field [0001] The invention discloses a preparation method of an environment-friendly soldering agent for electronic substrates, belonging to the technical field of soldering agents. Background technique [0002] Solder flux is a complex system, a creamy mixture formed by mixing solder powder, flux and other additives. Solder has a certain degree of viscosity at room temperature, which can initially stick electronic components to a predetermined position. At the soldering temperature, with the volatilization of solvents and some additives, the components to be soldered and the printed circuit pads will be welded together. Form a permanent connection. Flux is usually a mixture of rosin as the main component, which is an auxiliary material to ensure the smooth progress of the soldering process. Welding is the main process in electronic assembly. Flux is an auxiliary material used in welding. The main function of flux is to remove the oxides on the surface of the sol...

Claims

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Application Information

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IPC IPC(8): B23K35/362B23K35/36
CPCB23K35/362B23K35/3612B23K2101/36
Inventor 雷春生孟浩影陆娜
Owner 雷春生
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