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Inorganic powder surface chemical plating method and thin film of inorganic powder

A technology of inorganic powder and surface chemistry, which is applied in the field of electroless plating, can solve problems such as complicated process, difficulty in completely covering the surface of powder, and improvement of inorganic powder electroless plating method, and achieves the effect of simple preparation process

Active Publication Date: 2016-11-16
HEFEI LUCKY SCI & TECH IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method uses polymer monomers to introduce active groups on the surface of the powder through polymerization, and the process is complicated. In addition, it is difficult to completely cover the surface of the powder through the condensation reaction of the polymer with the surface of the powder.
[0004] Therefore the existing inorganic powder electroless plating method needs to be improved

Method used

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  • Inorganic powder surface chemical plating method and thin film of inorganic powder
  • Inorganic powder surface chemical plating method and thin film of inorganic powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Dry the 50-micron zeolite in a drying equipment at 100°C for 10 minutes until the water content is <0.1%; then stir the dried zeolite with a metal soap dispersant accounting for 2% by weight in a high-speed mixer, and set the temperature at 100°C Activate and mix at high temperature for 20 minutes, then add 1% paraffin wax accounting for zeolite weight and stir in a high mixer, mix at 90°C for 30 minutes, continue to add 6% zeolite weight urea, stir in a high mixer, and mix at 90°C 30 minutes; the obtained surface-modified inorganic powder is immersed in a tin protochloride solution with a pH of 1 for sensitization, the sensitization temperature is 90°C, the sensitization time is 5 minutes, and washed until neutral; then the obtained The powder is activated by immersing it in a palladium chloride solution with a pH of 4. The activation temperature is 40° C. and the activation time is 50 minutes. It is taken out, washed with deionized water, and dried at 40° C. for 20 min...

Embodiment 2

[0034] Dry 10 microns of diatomite in a drying device at 180°C for 20 minutes until the water content is <0.1%; then dry the diatomite after drying with 0.5% of diatomite weight aliphatic amide dispersant at high temperature Stir in the mixer, activate and mix at 160°C for 10 minutes, then add paraffin wax accounting for 5% by weight of diatomite, stir in a high-speed mixer, mix for 30 minutes at 90°C, continue to add melamine accounting for 1% by weight of diatomite The resin was stirred in a high mixer, and mixed for 30 minutes at 90°C; the obtained surface-modified inorganic powder was immersed in a stannous chloride solution with a pH of 3 for sensitization, the sensitization temperature was 30°C, and the sensitization time was 50 minutes, washed with water until neutral; next, immerse the obtained powder in a palladium chloride solution with a pH of 1 for activation. minute.

[0035] Preparation of electroless silver plating bath, the bath composition is: AgNO 3 (29 g / L...

Embodiment 3

[0037]Dry the 85-micron calcium carbonate in the drying equipment at 145°C for 14 minutes until the water content is <0.1%; then stir the dried calcium carbonate with a fatty acid dispersant accounting for 1% of the weight of the calcium carbonate in a high mixer, Activation and mixing at 120°C for 15 minutes, then add 2% of the weight of calcium carbonate and stir in a high mixer, mix for 30 minutes at 90°C, continue to add 2.8% of the weight of calcium carbonate by silane coupling agent (KH550) Stir in a high-mixer, mix at 90°C for 30 minutes; immerse the obtained surface-modified inorganic powder in a stannous chloride solution with a pH of 2 for sensitization, the sensitization temperature is 80°C, and the sensitization time is 30 minutes , washed with water until neutral; next, the obtained powder was activated by immersing it in a palladium chloride solution with a pH of 2.8. The activation temperature was 60°C, and the activation time was 30 minutes. It was taken out wit...

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Abstract

The invention relates to an inorganic powder surface chemical plating method. The inorganic powder surface chemical plating method comprises the following steps: (a) coating the surface of an inorganic powder material with paraffin; (b) performing hydrophilic modification on the surface of the inorganic powder material; (c) performing sensitization and activation modification on the surface of the inorganic powder material; and (d) performing chemical plating on the surface of inorganic powder. The inorganic powder surface chemical plating method provided by the invention is simple in process flow and low in cost, and is not restricted by the morphology of the surface of the inorganic powder; and meanwhile, a metal coats the surface of the inorganic powder completely, so that the inorganic powder can be widely applied to the fields of conductive coating, electromagnetic shielding and the like.

Description

Technical field: [0001] The invention relates to the technical field of electroless plating, in particular to a method for electroless plating on the surface of inorganic powder. Background technique: [0002] Metal-coated inorganic powder refers to the composite powder with inorganic powder as the core and metal as the outer shell. This kind of composite powder has been widely used in the fields of electromagnetic materials, catalytic materials, and electrical conduction in recent years due to its excellent properties such as electromagnetics, optics, and chemical catalysis, as well as the ability to improve the wettability between metals and ceramics. The preparation methods of metal-coated inorganic powder composite powder include sol-gel method, mechanical mixing method, chemical plating method, heterogeneous precipitation method, etc. Among them, the chemical plating method can prepare uniform and porous powder on the surface of any substrate. Metal coatings with low y...

Claims

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Application Information

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IPC IPC(8): C23C18/40C23C18/44C23C18/36C23C18/18B22F1/02
CPCC23C18/1893C23C18/36C23C18/40C23C18/44B22F1/17
Inventor 黄俊俊王辉周守发
Owner HEFEI LUCKY SCI & TECH IND
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