Aluminum-based composite heat sink material for LEDs

A heat dissipation material and aluminum-based composite technology, which is applied in the field of aluminum-based composite heat dissipation materials for LEDs, can solve problems such as affecting the service life of lamps, affecting lighting effects, and poor insulation performance, achieving ideal sintering effects, excellent thermal conductivity, and high temperature The effect of changing stability

Inactive Publication Date: 2016-12-07
ANHUI FUN OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In actual use, the heat dissipation performance of the LED lamp itself is very important, because it not only directly affects the service life of the lamp, but also affects its lighting effect
Existing LED heat dissipation materials are mainly made of metal materials such as aluminum

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] An aluminum-based composite heat dissipation material for LEDs, the preparation method comprising the following steps:

[0017] (1) According to weight: 2000g of silicone resin, 1300g of hydantoin epoxy resin, 500g of chlorophenyl silicone oil, 300g of graphene, 300g of curing agent diethylaminopropylamine, 500g of 95% alumina ceramic fiber, 30g of magnesium isooctanoate , silicon nitride 20g, magnesium sulfate 50g, zirconia 20g, chromium trioxide 20g, vanadium diboride 50g, zirconium diboride 50g, aluminum nitride 20g, sodium zeolite 50g, organic chelated titanium 10g, aluminum 1500g, Zinc oxide 10g, calcium carbonate 10g, zinc borate 10g.

[0018] (2) Take organosilicon resin, hydantoin epoxy resin, chlorophenyl silicone oil, and graphene by weight, and dissolve the four components of organosilicon resin, hydantoin epoxy resin, chlorophenyl silicone oil, and graphene after heating, and dissolve Stir until evenly mixed;

[0019] (3) Add curing agent diethylaminopropy...

Embodiment 2

[0023] An aluminum-based composite heat dissipation material for LEDs, the preparation method comprising the following steps:

[0024] (1) According to weight: 2500g of silicone resin, 1400g of hydantoin epoxy resin, 800g of chlorophenyl silicone oil, 600g of graphene, 600g of curing agent diethylaminopropylamine, 600g of 95% alumina ceramic fiber, and 50g of magnesium isooctanoate , silicon nitride 30g, magnesium sulfate 80g, zirconia 30g, chromium trioxide 30g, vanadium diboride 80g, zirconium diboride 80g, aluminum nitride 30g, sodium zeolite 80g, organic chelated titanium 20g, aluminum 1800g, Zinc oxide 20g, calcium carbonate 20g, zinc borate 20g.

[0025] (2) Take organosilicon resin, hydantoin epoxy resin, chlorophenyl silicone oil, and graphene by weight, and dissolve the four components of organosilicon resin, hydantoin epoxy resin, chlorophenyl silicone oil, and graphene after heating, and dissolve Stir until evenly mixed;

[0026] (3) Add curing agent diethylaminop...

Embodiment 3

[0030] An aluminum-based composite heat dissipation material for LEDs, the preparation method comprising the following steps:

[0031] (1) According to the weight: 2200g of silicone resin, 1300g of hydantoin epoxy resin, 600g of chlorophenyl silicone oil, 500g of graphene, 400g of curing agent diethylaminopropylamine, 500g of 95% alumina ceramic fiber, and 40g of magnesium isooctanoate , silicon nitride 20g, magnesium sulfate 70g, zirconia 20g, chromium trioxide 20g, vanadium diboride 60g, zirconium diboride 60g, aluminum nitride 20g, sodium zeolite 60g, organic chelated titanium 20g, aluminum 1600g, Zinc oxide 10g, calcium carbonate 10g, zinc borate 10g;

[0032] (2) Take organosilicon resin, hydantoin epoxy resin, chlorophenyl silicone oil, and graphene by weight, and dissolve the four components of organosilicon resin, hydantoin epoxy resin, chlorophenyl silicone oil, and graphene after heating, and dissolve Stir until evenly mixed;

[0033] (3) Add curing agent diethylam...

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PUM

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Abstract

The invention discloses an aluminum-based composite heat sink material for LEDs. The aluminum-based composite heat sink material comprises, by mass, 20-25 parts of organic silicon resin, 13-14 parts of hydantoin epoxy resin, 5-8 parts of chlorphenyl silicone oil, 3-6 parts of graphene, 3-6 parts of curing agent diethylaminopropylamine, 5-6 parts of 95% aluminum oxide ceramic fiber, 0.3-0.5 part of magnesium isooctanoate, 0.2-0.3 part of silicon nitride, 0.5-0.8 part of magnesium sulfate, 0.2-0.3 part of zirconium oxide, 0.2-0.3 part of chromium oxide, 0.5-0.8 part of vanadium boride, 0.5-0.8 part of zirconium diboride, 0.2-0.3 part of aluminum nitride, 0.5-0.8 part of natrolite, 0.1-0.2 part of organic chelated titanium, 15-18 parts of aluminum, 0.1-0.2 part of zinc oxide, 0.1-0.2 part of calcium carbonate and 0.1-0.2 part of zinc borate. The prepared heat sink material is ideal in sintering effect, smooth and compact in surface, stable in temperature variation, durable, excellent in heat conduction coefficient and capable of effectively protecting LED lamps and greatly prolonging the service life of the lamps.

Description

technical field [0001] The invention relates to the field of LED lamp materials, in particular to an aluminum-based composite heat dissipation material for LEDs. Background technique [0002] LED is a semiconductor light-emitting diode. LED energy-saving lamps use high-brightness white light-emitting diodes as light sources. They have high luminous efficiency, low power consumption, long life, easy control, maintenance-free, safety and environmental protection; Bright, colorful, low loss, low energy consumption, green and environmental protection. [0003] At present, LED, as a new generation of light source, is widely used in people's daily life. In actual use, the heat dissipation performance of the LED lamp itself is very important, because it not only directly affects the service life of the lamp, but also affects its lighting effect. Existing LED heat dissipation materials are mainly made of metal materials such as aluminum and copper. In actual use, there are disadva...

Claims

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Application Information

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IPC IPC(8): C22C47/14C22C49/06C09K5/14C22C101/04
CPCC22C47/14C09K5/14C22C49/06
Inventor 汪卫国
Owner ANHUI FUN OPTOELECTRONICS TECH
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