Nano-diamond-containing high-power LED heat dissipation ceramic substrate

Abstract

The invention discloses a nano-diamond-containing high-power LED heat dissipation ceramic substrate. According to the ceramic substrate, ionic liquid and deionized water are mixed to prepare a solvent medium which replaces a toxic organic solvent in a conventional tape casting process; each raw material is high in wettability, and particularly, the dispersity of a nano raw material is improved, and the adding amount of the nano material is increased, so that a more satisfactory modification effect is achieved; furthermore, ceramic slurry contains an aluminum-silicon compound, so that the oxygen content can be reduced to prevent the aluminum-silicon compound from being dispersed into an aluminum nitride crystal lattice in a sintering process; therefore, the defect that the conventional aluminum nitride ceramic is low in heat conduction coefficient; meanwhile, the aluminum-silicon compound generates a liquid phase together with materials such as nano diamond and nano aluminum nitride, so that sintering is further promoted, the compactness of the materials is improved, and finally the prepared aluminum nitride ceramic substrate has the advantages of high strength, heat conduction, compactness and the like; compared with the conventional production method, the nano-diamond-containing high-power LED heat dissipation ceramic substrate is more environmentally friendly and efficient, and the product performance is higher.

Description

technical field [0001] The invention relates to the technical field of aluminum nitride ceramics, in particular to a high-power LED heat dissipation ceramic substrate containing nano-diamond. Background technique [0002] The heat generated by high-power LED chips cannot be dissipated in a timely and effective manner, which will seriously affect the LED emission spectrum, luminous intensity, performance of packaging materials, and chip life. Therefore, the heat dissipation problem of high-power LEDs has always been a major technology in the solid-state lighting industry. Bottleneck, in LEDs produced by traditional packaging technology, substrate heat dissipation has become a key research object at home and abroad because of its direct and effective heat dissipation advantages. At present, aluminum-based heat dissipation substrates are widely used in research and application. However, with the improvement of LED heat dissipation requirements, the defects of aluminum substrate...

AI Technical Summary

Problems solved by technology

At present, aluminum-based heat dissipation substrates are widely used in research and application. However, with the improvement of LED heat dissipation requirements, the defects of aluminum substrates are gradually manifested. The internal insulating layer leads to poor overall heat dissipation and easy junction temperature, thereby reducing the use of lamps. life

Compared with the aluminum substrate heat dissipation kit, the ceramic heat dissipation substrate has the advantages of high insulation, high thermal radiation, high thermal conductivity, and good electromagnetic compatibility, and has become an alternative material that has attracted much attention. Among them, aluminum nitride ceramics are packages with relatively ideal comprehensive performance. However, in practical applications, aluminum nitride ceramics have defects such as high sintering temperature and poor thermal conductivity, which restrict the popularization and application of products

[0003] "Y 2 o 3 The effect of the synergistic effect of AlN and nano-AlN on the sintering performance and heat conduction of aluminum nitride ceramics" introduces the use of Y 2 o 3 As a sintering aid and nano-aluminum nitride, aluminum nitride ceramics with high thermal conductivity are produced at low sintering temperatures. Although this method improves the density of aluminum nitride ceramics to a certain extent, its thermal conductivity It still needs to be improved, and the addition of nano-powder must be strictly controlled, and the performance of aluminum nitride ceramics needs to be improved at a higher sintering temperature