Special adhesive used for high-temperature resistant electronic circuit pad board and added with organic modified montmorillonite

Abstract

The invention discloses a special adhesive used for a high-temperature resistant electronic circuit pad board and added with organic modified montmorillonite, wherein the special adhesive is prepared from the following raw materials by weight: 100-110 parts of corn protein, 8-9 parts of acrylamide, 2-2.5 parts of maleic anhydride, 8-9 parts of ammonium persulfate, a proper amount of sodium hydroxide with the concentration of 40 wt%, a proper amount of distilled water, 50-55 parts of water glass with the modulus of 2.8, 9-10.5 parts of polyvinyl alcohol, 2-3 parts of ethyl silicate, 1.7-2 parts of amino sulfonic acid, 1-1.2 parts of a silane coupling agent kh550, 1-1.4 parts of trisodium phosphate, 5-6 parts of montmorillonite, 0.3-0.4 part of cetyltrimethyl bromide ammonium, a proper amount of anhydrous ethanol, 3-4 parts of magnesium oxide, 2-3 parts of sodium alginate, and a proper amount of dilute hydrochloric acid. According to the present invention, the prepared adhesive has advantages of high strength, improved curing speed, good thermal stability, good high-temperature resistance and good insulating property, and is suitable for the adhesion of the electronic circuit pas board.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to an adhesive special for high-temperature-resistant electronic circuit backing plates added with organically modified montmorillonite. Background technique [0002] Zein is a kind of renewable and biodegradable natural plant protein, which has the characteristics of low cost, convenient processing and no irritating smell. Because corn protein is insoluble in water and lacks essential amino acids such as lysine and tryptophan, it has low nutritional value and is rarely used in food raw materials. At present, except for a few used as low-quality feed protein for sale, many factories have not Direct discharge for any use has caused a great waste of resources and also caused harm to the environment. Now, people use zein in tissue engineering and medicine, but the application of zein in adhesives is less, so the market potential of developing zein, an environmentally friendly adhesi...

AI Technical Summary

Problems solved by technology

Because corn protein is insoluble in water and lacks essential amino acids such as lysine and tryptophan, it has low nutritional value and is rarely used in food raw materials. At present, except for a few used as low-quality feed protein for sale, many factories have not Directly discharged for any use, resulting in a great waste of resources, but also caused harm to the environment

Now, people use zein in tissue engineering and medicine, but zein is less used in adhesives, so the development of zein, an environmentally friendly adhesive, has a huge market potential