A kind of room temperature curing epoxy curing agent microcapsule based on water-insoluble amine and preparation method thereof
An epoxy curing agent and room temperature curing technology, which is applied in the direction of microcapsule preparation, microsphere preparation, etc., can solve the problems of adverse effects on material properties, failure to meet basic requirements, unstable storage of curing agent, etc., and achieve a simple and easy preparation method , short reaction time, good stability
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Embodiment 1
[0042] Add 16g of urea and 32.43g of 37wt% formaldehyde into a 250ml three-necked \reaction flask equipped with mechanical stirring. After the urea is completely dissolved, slowly adjust the pH value of the solution to 8 with sodium hydroxide solution, and then rapidly raise the temperature to 50°C , and stirred and refluxed for 0.5h to obtain a viscous and transparent prepolymer of urea formaldehyde, which was naturally cooled to room temperature. Mix 240g of 4,4'-diaminobicyclohexylmethane, 2g of toluene and 0.6g of n-hexanol evenly, slowly add to the above solution, stir and emulsify at 300r / min for 20-30min, then slowly drop in hydrochloric acid solution to adjust the reaction system When the pH value reaches 2, after the microcapsules are completely formed, raise the temperature to 50° C., cure for 2 hours, and the reaction ends. After filtering, washing and drying, white curing agent microcapsules are obtained. The average particle size of the synthesized curing agent m...
Embodiment 2- Embodiment 7
[0044] The preparation method of the microcapsules is basically the same as that in Example 1. The formula table and reaction conditions are shown in Table 1, and the coating ratio and other parameters of the prepared microcapsules are shown in Table 3.
Embodiment 8
[0046] Take 100 parts of epoxy resin E51 and 22 parts of IPDA, add the theoretical ratio of epoxy resin microcapsules and the curing agent microcapsules prepared in Example 1, mix evenly, remove air bubbles under reduced pressure, pour into a silicone mold and cure at room temperature for 24 hours , placed in an oven at a constant temperature of 80°C for 1.5 hours to cure. After natural cooling, the silicone mold was removed to obtain the fracture toughness test piece, and the INSTRON 3344 universal tensile testing machine was used for the fracture toughness test. Under room temperature, the tensile speed was set at 1mm / min, and the initial sample was stretched to failure. The fracture toughness is K 0 , remove the load, slowly close the crack surface, place it at room temperature for 3 hours, repeat the test, and obtain the repaired fracture toughness K 1 , η=K 0 / K 1 =70% is the repair efficiency under the conditions of the epoxy resin agent microcapsules and curing agent...
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