Multi-grade magnetic field electric arc ion plating method of lining positive-biased tapered pipe
A technology of arc ion plating and positive bias, which is applied in the field of material surface treatment, can solve the problems of low arc plasma transmission efficiency and large particle defects, so as to avoid large particle defects, improve crystal structure and stress state, and improve transmission efficiency Effect
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specific Embodiment approach 1
[0015] Specific implementation mode one: the following combination figure 1 and 2 Describe the present embodiment, the device used in the multistage magnetic field arc ion plating method of lining positive bias conical tube in this embodiment includes bias power supply 1, arc power supply 2, arc ion plating target source 3, multistage magnetic field device 4, Multi-stage magnetic field power supply 5, lined positive bias conical tube device 6, positive bias power supply 7, sample stage 8, bias power supply waveform oscilloscope 9 and vacuum chamber 10;
[0016] The method includes the following steps:
[0017] Step 1. Place the substrate workpiece to be processed on the sample stage 8 in the vacuum chamber 10, and insulate the lining positive bias conical tube device 6 from the vacuum chamber 10 and the multi-stage magnetic field device 4. The workpiece and the sample stage 8 are connected to each other. The negative output end of the bias power supply 1, the arc ion plating...
specific Embodiment approach 2
[0026] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the method also includes:
[0027] Step 3: Thin films can be deposited by combining traditional DC magnetron sputtering, pulsed magnetron sputtering, traditional arc ion plating and pulsed cathodic arc with DC bias, pulse bias or DC pulse composite bias to prepare pure metal films , compound ceramic films with different element ratios, functional films and high-quality films with nano-multilayer or gradient structures.
specific Embodiment approach 3
[0028] Embodiment 3: The difference between this embodiment and Embodiment 2 is that Steps 1 to 3 are repeated to prepare multi-layered thin films with different stress states, microstructures and element ratios, and the others are the same as Embodiment 2.
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