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Transition layer alloy material for laser manufacturing and remanufacturing of crystallizer copper plate

A technology for crystallizer copper plates and alloy materials, applied in the field of laser cladding alloy materials, can solve the problems of reduced interface bonding strength, low pure nickel strength, reduced production efficiency, etc. The effect of production difficulty

Inactive Publication Date: 2017-05-31
沈阳大陆激光工程技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Based on the technologies disclosed above, in order to solve the problem of low absorption rate of the laser on the copper plate during the laser preparation of the transition layer of the copper plate of the crystallizer, the technology of spraying and texturing after electroplating is mostly used to pre-prepare the alloy material, and then combine the laser cladding technology. This makes the production process complex and reduces production efficiency
And the nickel-based alloy transition layer used is the commonly used nickel-chromium boron-silicon alloy, nickel-chromium-molybdenum-niobium or Hastelloy alloy. These alloys have many components. Agglomerates are generated at the interface with the transition layer, which reduces the bonding strength of the interface and is prone to cracking when cladding the functional layer
Although the Chinese invention patent with the patent application number 201310298639.8 and the patent application number 200910038846.3 mentions spraying or electroplating pure nickel first, the strength of pure nickel is low and the comprehensive mechanical properties are poor, and the patent with the patent application number 201310298639.8 is in laser cladding. It is to melt the electroplated pure nickel and the functional layer at the same time and not form an independent transition layer

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] 1. Remove oil stains, oxides, fatigue layers and other factors that affect the quality of cladding on the surface of the mold copper plate.

[0022] 2. Using laser cladding technology, the 1.0mm transition layer is cladding by means of laser scanning and spreading preset alloy powder. The composition of the transition layer alloy material is: Al: 1%, Cu: 1%, Ni margin.

[0023] 3. Process the transition layer after cladding, leaving a thickness of 0.5mm.

Embodiment 2

[0025] 1. Remove oil stains, oxides, fatigue layers and other factors that affect the quality of cladding on the surface of the mold copper plate.

[0026] 2. Select the laser cladding technology, and use the laser scanning method to spread the preset alloy powder to cladding the 1.5mm transition layer. The composition of the transition layer alloy material is: Al: 5%, Cu: 2.5%, Ni margin.

[0027] 3. Process the transition layer after cladding to retain a thickness of 1.0mm.

Embodiment 3

[0029] 1. Remove oil stains, oxides, fatigue layers and other factors that affect the quality of cladding on the surface of the mold copper plate.

[0030] 2. Using laser cladding technology, cladding 2.0mm transition layer by means of laser scanning and spreading preset alloy powder. The composition of the transition layer alloy material is: Al: 10%, Cu: 5%, Ni margin.

[0031] 3. Process the cladding transition layer to retain the thickness of 1.5mm.

[0032] After the cladding of the crystallizer copper plate with the transition layer is tested, it shows that the interface between the transition layer and the copper plate shows a good metallurgical bond without agglomerates. At the same time, the hardness of the entire cladding layer is uniform, without pores, cracks and other defects. The cobalt-based alloy functional layer is cladding on the transition layer, and the interface of the transition layer and the cobalt-based alloy is well bonded without cracks and pore defects. Th...

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PUM

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Abstract

The invention discloses a transition layer alloy material for laser manufacturing and remanufacturing of a crystallizer copper plate. The alloy material is characterized by comprising 1%-10% of Al, 1%-5% of Cu and the balance Ni. A preparation method for a transition layer for laser manufacturing and remanufacturing of the crystallizer copper plate comprises the steps that (1), a layer of transition layer alloy powder with the thickness of 1.0-2.0 mm is prearranged on the surface of the crystallizer copper plate through a powder prearrangement manner; (2), scanning and cladding are conducted through a 6,000 W fiber laser device; and (3), machining is conducted on the clad layer, and the thickness of the transition layer is reserved in the range of 0.5-1.5 mm. The transition layer alloy material has the beneficial effects that the production process is simple, the production efficiency is high, the number of the components of the alloy material is small, no crack is generated in the cladding process, and the metallurgical bonding effect is good.

Description

Technical field [0001] The invention relates to a laser cladding alloy material, in particular to a transition layer alloy material for laser manufacturing and remanufacturing continuous casting mold copper plate cladding. Background technique [0002] The mold is the core component of continuous casting, and its function is to continuously solidify the liquid steel into a shell under the action of external cooling water. Under the action of liquid molten steel and solidified steel billet, hot cracks, wear, corrosion and other problems will occur on the surface of the crystal copper plate, which directly affects the surface quality of the cast slab, the casting speed of the continuous caster, and the continuous operation rate. Therefore, mold copper plates with good thermal conductivity, high strength, high wear resistance, and high corrosion resistance are of vital significance to the development of continuous casting technology. [0003] Due to the wide application of laser clad...

Claims

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Application Information

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IPC IPC(8): C22C19/03C23C24/10B22D11/059
CPCC22C19/03B22D11/059C23C24/106
Inventor 倪春雷董思远陈海涛
Owner 沈阳大陆激光工程技术有限公司
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