This invention discloses an
electrode laser fabrication mechanism, comprising a
cutting device, a loading device, a
laser fabrication device, a CCD waste removal device, and an unloading device. The loading device includes a multi-
station rotary platform
assembly, a CCD positioning platform
assembly, a CCD imaging
assembly, a positioning defect waste removal assembly, and an
electrode suction cup gripping assembly. The
laser fabrication device includes a multi-
station rotary platform assembly, a laser
slicing assembly, a
slicing defect waste removal assembly, and an
electrode vacuum adsorption assembly. The CCD waste removal device includes a multi-
station rotary platform assembly, an electrode under-tabneck imaging assembly, an external CCD imaging assembly, an external shape defect waste removal assembly, a tabneck defect waste removal assembly, and an electrode suction cup gripping assembly. The unloading device includes a multi-station rotary platform assembly, an electrode on-tabneck imaging assembly, and an electrode vacuum adsorption assembly. This invention combines slitting and
laser cutting, offering advantages such as high precision, high efficiency, low cost, and high yield.