Preparation method for surface-wettability-controllable super-hydrophobic copper and alloy thereof
A technology of surface infiltration and copper alloy, which is applied to the surface coating liquid device, special surface, surface reaction electrolytic coating, etc., can solve the problems of potential safety hazards, high cost, and limited promotion, etc., to shorten the preparation cycle, The effect of controllable wettability
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[0031] Example 1
[0032] A 50×30 red copper sheet, after surface pretreatment, electrodeposition and self-assembly with myristic acid to obtain a super-hydrophobic surface with outstanding structural characteristics, specifically includes the following steps and process conditions:
[0033] (1) Copper sheet pretreatment: The red copper sheet was ultrasonically cleaned with acetone, alcohol, and deionized water for 5 minutes at room temperature, and dried with a hair dryer to remove oil and impurities on the surface;
[0034] (2) Electroplating solution configuration: dissolve thiourea and disodium edetate in deionized water, where the concentration of thiourea is 0.05 mol / L, and the concentration of disodium edetate is 0.01 mol / L;
[0035] (3) Electrodeposition: Two pretreated copper sheets are used as alternating current poles respectively, and 100ml of the electroplating solution prepared in step (2) is electroplated for 5 minutes under the condition of alternating voltage 5V, and t...
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[0039] Example 2
[0040] A brass sheet with a size of 50×30, after surface pretreatment, electrodeposition and self-assembly with myristic acid to obtain a super-hydrophobic surface with outstanding structural features, the specific steps and process conditions are as follows:
[0041] (1) Copper sheet pretreatment: The brass sheet is ultrasonically cleaned with acetone, alcohol, and deionized water for 10 minutes at room temperature, and dried with a hair dryer to remove oil and impurities on the surface;
[0042] (2) Electroplating solution configuration: Dissolve thiourea and disodium edetate in deionized water, where the concentration of thiourea is 0.3mol / L, and the concentration of disodium edetate is 0.2mol / L;
[0043] (3) Electrodeposition: Two pretreated copper sheets are used as alternating current poles respectively, and 100ml of the electroplating solution prepared in step (2) is electrodeposited for 10 minutes under the condition of alternating voltage 20V, and the temper...
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[0047] Example 3
[0048] Phosphor copper sheet with a size of 50×30, after surface pretreatment, electrodeposition and self-assembly with myristic acid to obtain a super-hydrophobic surface with outstanding structural features, specifically including the following steps and process conditions:
[0049] (1) Copper sheet pretreatment: The phosphorous copper sheet is ultrasonically cleaned with acetone, alcohol, and deionized water for 2 minutes at room temperature, and dried with a hair dryer to remove oil and impurities on the surface;
[0050] (2) Electroplating solution configuration: dissolve thiourea and disodium edetate in deionized water, where the concentration of thiourea is 0.2mol / L, and the concentration of disodium edetate is 0.5mol / L;
[0051] (3) Electrodeposition: Two pretreated copper sheets are used as alternating current poles respectively, and 100ml of the electroplating solution prepared in step (2) is electroplated for 2 minutes at an alternating voltage of 40V, and...
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