Preparation method of high-performance repair adhesive tape for photovoltaic module backboard
A photovoltaic module and repair tape technology, which is applied in photovoltaic modules, photovoltaic power generation, adhesive products, etc., can solve the problem of UV resistance, fogging and high temperature resistance and inconvenience of use, etc., to improve the anti-aging performance, the tape is easy to fit, and the weather resistance is improved.
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Example Embodiment
[0025] Example 1
[0026] The preparation of the high-performance repair tape for the backsheet of the photovoltaic module in this embodiment includes the following steps:
[0027] S1: coating the fluorine coating on a substrate layer with a thickness of 25 μm, and the coating thickness is 2 μm;
[0028] S2: Add 20 parts of methyl acrylate, 25.5 parts of isooctyl acrylate, 4 parts of acrylic acid, 0.5 parts of hydroxyethyl acrylate, 50 parts of butyl acrylate to a reaction device equipped with a stirrer, reflux condenser and nitrogen introduction tube, and add 100 parts Ethyl acetate, introduce nitrogen and stir for half an hour, slowly heat to 70°C, add 0.2 part of AIBN, react for 5 hours under nitrogen protection, and finally adjust it to a synthetic glue with a solid content of 40% with ethyl acetate;
[0029] S3: Take 100 parts of synthetic glue prepared in step S2, add 0.2 parts of isocyanate curing agent L-75 (Bayer), add 20 parts of rosin resin PR-12603 (Sumitomo), add 0.03 pa...
Example Embodiment
[0035] Example 2
[0036] The preparation of the high-performance repair tape for the backsheet of the photovoltaic module in this embodiment includes the following steps:
[0037] S1: coating the fluorine coating on a substrate layer with a thickness of 50 μm, and the coating thickness is 5 μm;
[0038] S2: Add 20 parts of methyl acrylate, 25.5 parts of isooctyl acrylate, 4 parts of acrylic acid, 0.5 parts of hydroxyethyl acrylate, 50 parts of butyl acrylate to a reaction device equipped with a stirrer, reflux condenser and nitrogen introduction tube, and add 100 parts Ethyl acetate, introduce nitrogen and stir for half an hour, slowly heat to 70°C, add 0.2 part of AIBN, react for 5 hours under nitrogen protection, and finally adjust it to a synthetic glue with a solid content of 40% with ethyl acetate;
[0039] S3: Take 100 parts of synthetic glue prepared in step S2, add 0.2 part of epoxy curing agent NX-100E (Japan Soken), add 20 parts of rosin resin PR-12603 (Sumitomo), add 0.03...
Example Embodiment
[0045] Example 3
[0046] The preparation of the high-performance repair tape for the backsheet of the photovoltaic module in this embodiment includes the following steps:
[0047] S1: coating the fluorine coating on a substrate layer with a thickness of 100 μm, and the coating thickness is 10 μm;
[0048] S2: Add 20 parts of methyl acrylate, 25.5 parts of isooctyl acrylate, 4 parts of acrylic acid, 0.5 parts of hydroxyethyl acrylate, 50 parts of butyl acrylate to a reaction device equipped with a stirrer, reflux condenser and nitrogen introduction tube, and add 100 parts Ethyl acetate, introduce nitrogen and stir for half an hour, slowly heat to 70°C, add 0.2 part of AIBN, react for 5 hours under nitrogen protection, and finally adjust it to a synthetic glue with a solid content of 40% with ethyl acetate;
[0049] S3: Take 100 parts of synthetic glue prepared in step S2, add 0.2 parts of isocyanate curing agent L-75 (Bayer), add 20 parts of petroleum resin FTR-6100 (Mitsui), add 0.0...
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