Low-residue high-storage stability low-temperature tin paste for aluminium and preparation method thereof

A technology with storage stability and low residue, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of severe corrosion, complicated process, and poor storage stability of solder paste, and achieve low corrosion , less residue after welding, and good storage stability at room temperature

Active Publication Date: 2017-08-04
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this patent, the flux has high soldering activity to aluminum and aluminum alloys. Although the storage stability of the solder paste has been improved to a certain extent, the preparation process of the solder paste is still the reaction of hydrofluoric acid and hydroxylamine in an ethanol solvent. Hydroxylamine fluoride is obtained, the process is complex and the corrosion of the active salt on the solder alloy powder is still relatively severe, and the problem of the storage stability of the solder paste cannot be well resolved

Method used

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  • Low-residue high-storage stability low-temperature tin paste for aluminium and preparation method thereof
  • Low-residue high-storage stability low-temperature tin paste for aluminium and preparation method thereof
  • Low-residue high-storage stability low-temperature tin paste for aluminium and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0037] A solder paste for low-temperature aluminum with low residue and high storage stability, in terms of mass percentage, the composition of each raw material in the solder paste is as follows:

[0038]

[0039]

[0040] The preparation method is as follows:

[0041] 1) Weigh 80.0g triethanolamine, 4.0g zinc sulfate, 1.0g zinc oxide, 2.0g ferrous sulfate, 1.0g stannous oxide, 7.5g ethylene glycol phenyl ether and 5.0g propylene glycol phenyl ether into the reaction kettle, heat To 150°C, dissolve it completely into a uniform transparent solution, then cool the solution to 90°C, add 2.0g of 6500 thixotropic agent and 24.0g of zinc fluoride for homogeneous emulsification, then cool to room temperature and stand for 48h to obtain solder paste;

[0042] 2) Weigh 2.0g of PVPK15, 7.5g of ethylene glycol phenyl ether and 5.0g of propylene glycol phenyl ether into a stainless steel container and stir to completely dissolve PVPK15, then add 859.0g of Sn0.3Ag0.7Cu (Sn content is...

Embodiment 2

[0045] A low-temperature aluminum solder paste with low residue and high storage stability. The components in the solder paste are as follows according to mass percentage:

[0046]

[0047]

[0048] The preparation method is as follows:

[0049] 1) Weigh 30.0g of tetrahydroxypropylethylenediamine, 10.0g of hydroxyethylethylenediamine, 4.0g of zinc oxide, 20.0g of ethylene glycol phenyl ether and 10.0g of propylene glycol phenyl ether into the reaction kettle, and heat to 160°C , to make it all dissolve into a homogeneous transparent solution, then cool the solution to 70°C, add 5.0g of ethylene bisoleic acid amide, 10.0g of lithium fluoride and 2.0g of stannous bromide for homogeneous emulsification, and then cool to room temperature And after standing for 72 hours, solder paste was obtained;

[0050] 2) Weigh 20.0g of PVPK30, 10.0g of PVPK60, 20.0g of ethylene glycol phenyl ether and 10.0g of propylene glycol phenyl ether into a stainless steel container and stir to co...

Embodiment 3

[0053] A low-temperature aluminum solder paste with low residue and high storage stability. The components in the solder paste are as follows according to mass percentage:

[0054]

[0055] The preparation method is as follows:

[0056] 1) Weigh 100.0g dihydroxyethylethylenediamine, 3.0g ferrous sulfate, 3.0g ferrous oxide, 4.0g stannous oxide and 10.0g ethylene glycol phenyl ether into the reaction kettle, heat to 180 °C, make All of them were dissolved into a homogeneous transparent solution, then the solution was cooled to 60°C, 10.0g of calcium-based bentonite, 15.0g of stannous chloride and 15.0g of stannous fluoride were added for homogeneous emulsification, and then cooled to room temperature and allowed to stand for 72 hours After obtaining the solder paste;

[0057] 2) Weigh 10.0g of PVPK15, 5.0g of PVPK90, 10.0g of ethylene glycol phenyl ether into a stainless steel container and stir to completely dissolve PVPK15 and PVPK90, then add 815.0g of Sn9Zn (the content...

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Abstract

The invention discloses low-residue high-storage stability low-temperature tin paste for aluminium and a preparation method thereof. The tin paste for the aluminium consists of paste flux and tin-based brazing material alloy powder. The tin paste is prepared from the following raw materials in percentage by mass: 8.0 to 24.0 percent of the paste flux and the balance of the tin-based brazing material alloy powder, wherein the paste flux comprises the following components in percentage by mass: 4.0 to 10.0 percent of hydroxyl amine, 0.4 to 1.0 percent of metal active salt, 2.0 to 6.0 percent of a co-solvent, 1.2 to 3.0 percent of metal halate, 0.2 to 1.0 percent of a thixotropic agent, and 0.2 to 3.0 percent of a brazing material coating agent. When the paste flux is prepared, the metal halate is dispersed into the paste flux in a low-temperature solid form through high-speed shearing. The prepared paste flux has the advantages of low residue, high storage stability and the like after soldering, and can be applied to the situation of low-temperature soft brazing of the aluminium and an aluminium alloy, and is particularly suitable for reflow soldering of electronic assembly aluminium and aluminium alloy materials.

Description

technical field [0001] The invention relates to a solder paste for low-temperature reflow soldering of aluminum and aluminum alloys, in particular to a solder paste flux for aluminum that improves the storage stability of the solder paste and has low residue after soldering by purely physically dispersing and adding metal halide salts and a corresponding solder paste preparation method thereof. The solder paste is widely applicable to the low-temperature soldering process of aluminum and aluminum alloys, and is especially suitable for reflow soldering of aluminum and aluminum alloy materials for electronic assembly. Background technique [0002] Aluminum alloy has the advantages of low density, excellent corrosion resistance, high strength after heat treatment, etc., especially has excellent thermal conductivity and electrical conductivity. increasingly important role. Due to the advantages of high specific strength, wide sources and low price, aluminum and aluminum alloys...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40B23K35/363
CPCB23K35/262B23K35/3615B23K35/40
Inventor 张新平周敏波林源江
Owner SOUTH CHINA UNIV OF TECH
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