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Housing material for electronic equipment and preparation method thereof

A technology for shell materials and electronic equipment, applied in the field of shell materials and preparations for electronic equipment, can solve the problems of small electromagnetic radiation shielding effect, low linear expansion coefficient, and large shrinkage, so as to improve environmental adaptability and reduce thermal expansion coefficient , The effect of improving the radiation resistance

Inactive Publication Date: 2017-09-15
HEFEI SIBOT SOFTWARE DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The increase in heat generation and the temperature rise of the shell will cause the shell to deform, reduce the user's appearance experience, and seriously cause safety regulations; on the other hand, the ultra-thin and ultra-narrow design concept requires that the assembly gap between the shell and related components need to be further compressed ( Compression from 0.8mm or even greater to within 0.4mm), the traditional non-fiber-reinforced material back shell shrinks more with temperature changes, and the strength is further reduced after thinning. The dual factors lead to frequent cracking and other defects in the shell after undergoing environmental tests Phenomenon
In order to solve the cost problem caused by cracking, audio and video electronic equipment generally adopts the back shell of PC+ABS+GF scheme, PC+ABS+GF (is made of polycarbonate and acrylonitrile-butadiene-styrene copolymer The composite material with glass fiber added to the mixed plastic) is a material with high rigidity and low linear expansion coefficient, which can effectively solve the problem of shell cracking, which makes the cost about 18.95 yuan / kg, but the flame retardant grade can only reach UL94V0, which cannot Meet the flame retardant requirements of information technology electronic equipment enclosures
However, the cost of the metal shell used is high and cannot meet the needs of the public; and in the prior art, the shielding effect of the electronic equipment shell on electromagnetic radiation is very small, so it needs to be improved.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A shell material for electronic equipment, first weigh the following raw materials: polyvinyl chloride 25kg with a polymerization degree of 600, thermoplastic polyurethane 15kg, modified chopped carbon fiber 5kg, polycarbonate 8kg, maleic anhydride grafted polypropylene 5kg, poly 4kg of methacrylimide, 2kg of nano-silica, 3kg of polyamide wax, 5kg of diphenylamine, 1kg of calcium-zinc composite stabilizer, 1kg of antioxidant, 1kg of anti-ultraviolet agent, 1kg of foaming agent and 1kg of foam stabilizer;

[0023] The above-mentioned modified chopped carbon fiber is prepared by the following steps: take the chopped carbon fiber with a length of 50-100 μm and place it in a grinder for grinding for 2 hours, so that the length of the chopped carbon fiber is less than or equal to 0.5 μm, and the aspect ratio is less than 10; Use acrylic acid copolymer to infiltrate the ground chopped carbon fiber; then use low-carbon polyhydric alcohol to coat the infiltrated chopped carbon f...

Embodiment 2

[0031] A shell material for electronic equipment, first weigh the following raw materials: 30kg of polyvinyl chloride with a degree of polymerization of 600, 20kg of thermoplastic polyurethane, 10kg of modified chopped carbon fiber, 10kg of polycarbonate, 10kg of maleic anhydride grafted polypropylene, 7kg of methacrylimide, 4kg of nano-silica, 5kg of polyamide wax, 7kg of diphenylamine, 3kg of calcium-zinc composite stabilizer, 3kg of antioxidant, 3kg of anti-ultraviolet agent, 2kg of foaming agent and 2kg of foam stabilizer;

[0032] The above-mentioned modified chopped carbon fiber is prepared by the following steps: take the chopped carbon fiber with a length of 50-100 μm and place it in a grinder for grinding for 3 hours, so that the length of the chopped carbon fiber is less than or equal to 0.5 μm, and the aspect ratio is less than 10; Use acrylic acid copolymer to infiltrate the ground chopped carbon fiber; then use low-carbon polyhydric alcohol to coat the infiltrated ...

Embodiment 3

[0040]A shell material for electronic equipment, the following raw materials are first weighed: 35kg of polyvinyl chloride with a degree of polymerization of 600, 25kg of thermoplastic polyurethane, 15kg of modified chopped carbon fiber, 12kg of polycarbonate, 15kg of maleic anhydride grafted polypropylene, 10kg of methacrylimide, 6kg of nano-silica, 7kg of polyamide wax, 9kg of diphenylamine, 5kg of calcium-zinc composite stabilizer, 5kg of antioxidant, 5kg of anti-ultraviolet agent, 3kg of foaming agent and 3kg of foam stabilizer;

[0041] The above-mentioned modified chopped carbon fiber is prepared by the following steps: take the chopped carbon fiber with a length of 50-100 μm and place it in a grinder for grinding for 4 hours, so that the length of the chopped carbon fiber is less than or equal to 0.5 μm, and the aspect ratio is less than 10; Use acrylic acid copolymer to infiltrate the ground chopped carbon fiber; then use low-carbon polyhydric alcohol to coat the infilt...

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PUM

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Abstract

The invention discloses a housing material for electronic equipment and a preparation method thereof and relates to the field of electronic equipment materials. The housing material comprises polyvinyl chloride having polymerization degree of 600, thermoplastic polyurethane, modified chopped carbon fiber, polycarbonate, maleic anhydride grafted polypropylene, polymethacrylimide, nano silica, polyamide wax, diphenylamine, calcium-zinc composite stabilizer, an antioxidant, an anti-ultraviolet agent, a foaming agent, and a foam stabilizer. The preparation method of the housing material comprises: drying the materials; conveying part of the materials into an injection molding machine for melting; adding the rest materials after melting; pouring through the injection molding machine, cooling, opening a mold to take a product. The housing material is simple and convenient to prepare and low in cost; the finished housing material has high flame-retardant level and high mechanical strength, can have certain weakening and shielding functions for electromagnetic irradiation generated by electronic equipment, and is suitable for popularization and application.

Description

technical field [0001] The invention relates to the field of electronic equipment materials, in particular to an electronic equipment shell material and a preparation method thereof. Background technique [0002] Today's electronic equipment, taking smart TV as an example, smart TV is moving towards a trend of thinner thickness and larger screen, so the heat generated by smart TV during use is increasing, and the rigidity and heat resistance of the shell material are required also gradually increased. The increase in heat generation and the temperature rise of the shell will cause the shell to deform, reduce the user's appearance experience, and seriously cause safety regulations; on the other hand, the ultra-thin and ultra-narrow design concept requires that the assembly gap between the shell and related components need to be further compressed ( Compression from 0.8mm or even greater to within 0.4mm), the traditional non-fiber-reinforced material back shell shrinks more w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/06C08L75/04C08L69/00C08L51/06C08L33/24C08L77/00C08K13/06C08K9/04C08K7/06C08K3/36C08K5/18C08K5/134C08J9/30B29C45/73B29C45/76
CPCC08L27/06B29C45/73B29C45/76B29C2945/76498B29C2945/76531C08J9/30C08J2327/06C08J2433/24C08J2451/06C08J2469/00C08J2475/04C08J2477/00C08K2201/004C08K2201/011C08K2201/016C08L2201/02C08L2201/08C08L2203/20C08L2205/035C08L75/04C08L69/00C08L51/06C08L33/24C08L77/00C08K13/06C08K9/08C08K9/04C08K7/06C08K3/36C08K5/18C08K5/1345
Inventor 吴青明
Owner HEFEI SIBOT SOFTWARE DEV CO LTD
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