Scaling powder for integrated circuit board patch and preparation method thereof

Abstract

The invention discloses scaling powder for an integrated circuit board patch. The scaling powder is prepared from, by weight, 60-80 parts of modified rosin, 30-40 parts of glycerol ester of rosin, 20-30 parts of butyl acetate, 10-30 parts of texanol, 10-20 parts of pentaerythritol oleate, 5-15 parts of dimethyl imidazole, 3-8 parts of benzimidazole, 5-10 parts of salicylic acid, 2-8 parts of succinic acid, 5-10 parts of tartaric acid, 8-15 parts of adipic acid, 3-8 parts of triethanolamine, 2-6 parts of triisopropanolamine, 4-10 parts of nanometer titania, 20-40 parts of solvents, 1-5 parts of thixotropic agent, 0.3-0.8 part of surface active agent and 0.5-3 parts of coalescing agent. The scaling powder has the high solder wetting capability, can enhance the solder weldability, can adapt to various solder welding temperatures, generates few resides after welding is performed, and is high in insulation resistance, environmentally friendly and free of pollution.

Description

technical field [0001] The invention relates to the technical field of integrated circuit boards, in particular to a soldering flux for patching integrated circuit boards and a preparation method thereof. Background technique [0002] With the continuous development of electronic technology and the increasing popularity of integrated circuit applications, flux plays an increasingly important role in the electronics industry and related industries. In modern industrial production, flux is used more and more widely. Flux It is a substance with chemical and physical activation properties, which can remove oxides on the surface of the metal to be welded or other formed surface films and oxides formed on the outer surface of the solder itself, so that the surface to be welded can be stained with tin and For the purpose of soldering, the function of flux can also protect the metal surface, so that it will not be re-oxidized in the high-temperature environment of welding, and at th...

AI Technical Summary

Problems solved by technology

[0003] However, the traditional flux is lead-containing flux, which will be scattered in the environment with discarded electronic products in the future. After long-term corrosion by acid rain, lead will seep into the ground and dissolve into the groundwater system, and accumulate in the body of humans or animals for a long time after drinking. It will cause heavy lead poisoning and endanger the health of people and animals. Just because people realize the importance of protecting the environment, environmental protection regulations are becoming more and more perfect and strict.

Therefore, the application of lead-free soldering flux in the field of IC board patch technology is unavoidable. There are few types of lead-free soldering flux, some are easy to dry, and some have unsatisfactory soldering performance.