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High-flame-retardance epoxy resin adhesive

A technology of epoxy resin glue and epoxy resin, which is applied in the direction of epoxy resin glue, adhesives, adhesive additives, etc., and can solve problems such as flammability, low curing shrinkage, adhesive wear resistance, electrical insulation, etc. , to achieve the effects of reducing water absorption, increasing curing speed, and improving heat and humidity resistance

Inactive Publication Date: 2017-12-12
安徽大松树脂有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing epoxy resin adhesives are widely used because of their excellent low curing shrinkage, cohesiveness, abrasion resistance, electrical insulation, and chemical resistance, but they are limited because of their flammability. Used in some fields with harsh construction conditions

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] A high flame-retardant epoxy resin adhesive proposed by the present invention, its raw materials include by weight: 85 parts of epoxy resin containing fluorene structure, 1 part of polytetrahydrofuran diol, 15 parts of phenyl glycidyl ether, bis-o-methyl 15 parts of ammonium fluorene, 8 parts of pentamethyldiethylenetriamine, 2 parts of curing accelerator, 5 parts of 1,4-butanediol, 4 parts of nano silicon dioxide, 10 parts of nano calcium carbonate, 1 part of magnesium oxide, 5 parts of expanded graphite, 5 parts of phosphorus nitrogen flame retardant, 8 parts of ammonium borate, 1 part of diammonium hydrogen phosphate, 1 part of amino silicone oil, 1 part of polyether ether ketone, 8 parts of carbon fiber, 1 part of chlorite, aluminum silicate 4 parts, 1 part of carboxymethyl cellulose, 12 parts of solvent, 0.1 part of coupling agent.

Embodiment 2

[0017] A high flame-retardant epoxy resin adhesive proposed by the present invention, its raw materials include by weight: 50 parts of epoxy resin containing fluorene structure, 5 parts of polytetrahydrofuran glycol, 5 parts of phenyl glycidyl ether, bis-o-methyl 30 parts of amine fluorene, 3 parts of pentamethyldiethylenetriamine, 5 parts of curing accelerator, 1 part of 1,4-butanediol, 15 parts of nano-silica, 2 parts of nano-calcium carbonate, 2 parts of magnesium oxide, 2 parts of expanded graphite, 20 parts of phosphorus nitrogen flame retardant, 2 parts of ammonium borate, 5 parts of diammonium hydrogen phosphate, 0.1 part of amino silicone oil, 5 parts of polyether ether ketone, 2 parts of carbon fiber, 5 parts of chlorite, aluminum silicate 1 part, 3 parts of carboxymethyl cellulose, 3 parts of solvent, 1 part of coupling agent.

Embodiment 3

[0019] A high flame-retardant epoxy resin adhesive proposed by the present invention, its raw materials include by weight: 80 parts of epoxy resin containing fluorene structure, 1.3 parts of polytetrahydrofuran diol, 13 parts of phenyl glycidyl ether, bis-o-methyl 20 parts of amine fluorene, 7.3 parts of pentamethyldiethylenetriamine, 2.9 parts of curing accelerator, 4 parts of 1,4-butanediol, 8 parts of nano silicon dioxide, 8.8 parts of nano calcium carbonate, 1.2 parts of magnesium oxide, 4.2 parts of expanded graphite, 9 parts of phosphorus nitrogen flame retardant, 7.2 parts of ammonium borate, 1.3 parts of diammonium hydrogen phosphate, 0.8 parts of amino silicone oil, 2 parts of polyether ether ketone, 7.4 parts of carbon fiber, 1.9 parts of chlorite, aluminum silicate 3.6 parts, 1.7 parts of carboxymethyl cellulose, 10 parts of cyclohexanone, 0.1 parts of N-aminoethyl-γ-aminopropyltrimethoxysilane, 0.2 parts of 3-glycidyl ether propyltrimethoxysilane;

[0020] Wherein,...

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PUM

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Abstract

The invention discloses a high-flame-retardance epoxy resin adhesive, which comprises the following raw materials: fluorene structure-containing epoxy resin, polytetrahydrofuran, dio-diphthalene, PMDETA, curing accelerator, 1,4-butanediol, nano-silica, nano calcium carbonate, magnesium oxide, expansible graphite, Phosphorous nitrogen flame retardant, boric acid, diammonium hydrogen phosphate, amino silicon oil, PEEK, carbon fiber, chlorite, aluminum silicate, carboxymethylcellulose, a solvent and coupling reagent. The high-flame-retardance epoxy resin adhesive is excellent in flame retardance performance, good in heat insulating property and high in adhesion strength.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a highly flame-retardant epoxy resin adhesive. Background technique [0002] Epoxy resin refers to an organic compound containing two or more epoxy groups in its molecule. Its molecular chain contains active epoxy groups, which can cross-link with various types of curing agents to form insoluble resins. A polymer with a three-way network structure. The cured epoxy resin has good physical and chemical properties, and it has excellent bonding strength to the surface of metal and non-metal materials, and has become an important matrix material for adhesives. Existing epoxy resin adhesives are widely used because of their excellent low curing shrinkage, cohesiveness, abrasion resistance, electrical insulation, and chemical resistance, but they are limited because of their flammability. It is used in some fields with harsh construction conditions. Contents of the invention [0...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC09J163/00C08K2003/222C08K2003/265C08K2003/387C08K2201/011C08L2201/02C08L2201/08C08L2205/035C09J11/04C09J11/06C09J11/08C08L71/02C08L61/16C08L1/286C08K13/04C08K7/06C08K3/36C08K3/26C08K3/22C08K3/38
Inventor 朱立芳
Owner 安徽大松树脂有限公司
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