Modified polyethylene-vinyl acetate hot melt adhesive applied to plastic bonding

A technology of vinyl acetate and vinyl acetate, applied in the direction of adhesives, adhesive types, grafted polymer adhesives, etc., can solve the problems of poor strength and elasticity, difficult manual operation, high melt viscosity, etc., and achieve rubber elasticity Increased, improved peel strength, low melt viscosity effect

Inactive Publication Date: 2017-12-19
安徽嘉明新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Among them, ethylene-vinyl acetate hot melt adhesive is currently the most used hot melt adhesive. It has the advantages of good flexibility and bonding strength, but its strength and elasticity are poor, it cannot withstand excessive pressure, and its melt viscosity is large, so it is not easy to operate manually. , is also subject to certain restrictions in the use of

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A modified polyethylene-vinyl acetate hot-melt adhesive applied to plastic bonding, which is made of the following components in parts by weight: 50 parts of modified polyethylene-vinyl acetate resin, 40 parts of tackifier, and 5 parts of filler , 3 parts of paraffin, 1 part of antioxidant, 0.2 part of plasticizer, the preparation method of described modified polyethylene-vinyl acetate resin is:

[0017] Add polyethylene and vinyl acetate into a four-necked flask equipped with a stirring device in a mixing ratio of 4:2, add 2 drops of phosphoric acid catalyst dropwise, raise the temperature to 140°C, add rosin resin and phenolic resin, stir evenly, and Add ethylenediamine dropwise at this temperature, the dropping rate is 40 drops / min, and keep stirring. After the dropwise addition, the temperature is raised to 230°C, and the reaction is carried out for 2 hours. 150°C, discharging, the modified polyethylene-vinyl acetate resin is obtained, and the addition ratio of rosi...

Embodiment 2

[0024] A modified polyethylene-vinyl acetate hot-melt adhesive applied to plastic bonding is made of the following components in parts by weight: 55 parts of modified polyethylene-vinyl acetate resin, 45 parts of tackifier, and 6 parts of filler , 4 parts of paraffin, 1.5 parts of antioxidant, 0.25 part of plasticizer, the preparation method of described modified polyethylene-vinyl acetate resin is:

[0025] Add polyethylene and vinyl acetate into a four-necked flask equipped with a stirring device in a mixing ratio of 5:2.5, and add 2 drops of phosphoric acid catalyst dropwise, raise the temperature to 145°C, add rosin resin and phenolic resin, stir evenly, and Add ethylenediamine dropwise at this temperature, the dropping rate is 45 drops / min, and keep stirring. After the dropping, raise the temperature to 240°C, react for 2.5h, keep the temperature constant, vacuumize to 0.15KMp, and then cool The modified polyethylene-vinyl acetate resin is obtained by discharging the mate...

Embodiment 3

[0032] A modified polyethylene-vinyl acetate hot-melt adhesive applied to plastic bonding is made of the following components in parts by weight: 60 parts of modified polyethylene-vinyl acetate resin, 50 parts of tackifier, and 8 parts of filler , 5 parts of paraffin, 2 parts of antioxidant, 0.3 part of plasticizer, the preparation method of described modified polyethylene-vinyl acetate resin is:

[0033] Add polyethylene and vinyl acetate into a four-necked flask equipped with a stirring device in a mixing ratio of 6:3, add 3 drops of phosphoric acid catalyst dropwise, heat up to 150°C, add rosin resin and phenolic resin, stir evenly, and Add ethylenediamine dropwise at this temperature, the dropping rate is 50 drops / min, and keep stirring. After the dropwise addition, the temperature is raised to 260°C and reacted for 3h. Keeping the temperature constant, vacuumize to 0.2KMp, then cool to 160°C, discharge, and the modified polyethylene-vinyl acetate resin is obtained, and th...

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PUM

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Abstract

The invention relates to the technical field of hot melt adhesive material processing and discloses a modified polyethylene-vinyl acetate hot melt adhesive applied to plastic bonding. The modified polyethylene-vinyl acetate hot melt adhesive is prepared from the following components in parts by weight: 50-60 parts of modified polyethylene-vinyl acetate resin, 40-50 parts of tackifier, 5-8 parts of filler, 3-5 parts of paraffin, 1-2 parts of antioxidant and 0.2-0.3 part of plasticizer. After resin modification, the toughness, impact resistance, softness, stress cracking resistance, viscosity, thermal airtightness and repeated bending property in a low-temperature state are enhanced; the peel strength of cementing is improved, and the rubber elasticity is boosted; moreover, the strength, hardness, melting point and thermal deformation temperature are raised along; the heat resistance and the coating uniformity are high; the modified hot melt adhesive has the characteristics of perfect flexibility and bonding strength and the like and also has the advantages of low melt viscosity and high heat resistance.

Description

technical field [0001] The invention belongs to the technical field of hot-melt adhesive material processing, and in particular relates to a modified polyethylene-vinyl acetate hot-melt adhesive applied to plastic bonding. Background technique [0002] With the continuous enhancement of people's awareness of environmental protection, low-pollution or non-pollution environmentally friendly adhesives have emerged as the times require. Solid hot melt adhesives do not contain organic solvents and are applied, solidified, and cooled in molten form. Next, through chemical crosslinking, develop and solidify at the initial bond strength, and then cool and solidify from the molten state. Subsequent curing reaction imparts ultimate bond strength and improves tight bond to the substrate. It has the characteristics of non-toxic, non-polluting, high bonding strength, etc., so it is widely used. It has a very wide range of application values ​​in textiles, electronics, and book binding...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J151/06C09J151/00C09J151/08C09J11/08C09J11/04C08F291/08C08F218/08C08F291/00
CPCC08F255/02C08F283/00C08F289/00C08K2003/222C08K2003/2241C08K2003/2296C08K2003/265C08K2003/3045C08L2201/08C08L2205/02C08L2205/035C09J11/04C09J11/08C09J151/06C08L51/00C08L51/08C08L91/06C08K3/34C08K3/26C08K3/30C08K3/36C08K3/22C08F218/08
Inventor 温同民
Owner 安徽嘉明新材料科技有限公司
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