An easy-to-process thermal insulation composite material and its preparation method
A composite material and easy-to-process technology, applied in the field of thermal insulation materials, can solve the problems of difficult to solve the problem of heat resistance of materials, can not meet the requirements of design and use, can not achieve thermal insulation effect, etc., to avoid the interference of hot pressing reaction, the method design is ingenious and efficient. Reasonable and improve the effect of corrosion resistance
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Embodiment 1
[0038] (1) adding graphene oxide to N,N-dimethyldodecylamine, adding diphenoxyphosphine and strontium titanate after stirring at 100 ° C for 1 hour, stirring for 0.5 hour, then adding ammonium hexachloroiridate, stirring for 10 After the polyester resin, graphene composite metal system, naphthol phenolic resin, maleic anhydride, and aluminum nitride were dry-milled uniformly, they were added to the extruder and extruded at 190 °C. Then use a film making machine to prepare the outer layer material; graphene oxide, N,N-dimethyldodecylamine, diphenoxyphosphine, strontium titanate, ammonium hexachloroiridate, polyester resin, naphthol The mass ratio of phenolic resin, maleic anhydride and aluminum nitride is 8:18:20:5:3:60:100:20:5;
[0039] (2) Mix the silanol compound with tetraglycidyl-4,4'-diaminodiphenyl ether, stir at 90°C for 25 minutes, add phosphorus-containing phenolic resin, stir for 10 minutes, add bisphenol A epoxy resin, poly Urea formaldehyde, after stirring for 40...
Embodiment 2
[0043] (1) adding graphene oxide to N,N-dimethyldodecylamine, adding diphenoxyphosphine and strontium titanate after stirring at 100 ° C for 1 hour, stirring for 0.5 hour, then adding ammonium hexachloroiridate, stirring for 10 After the polyester resin, graphene composite metal system, naphthol phenolic resin, maleic anhydride, and aluminum nitride were dry-milled uniformly, they were added to the extruder and extruded at 190 °C. Then use a film making machine to prepare the outer layer material; graphene oxide, N,N-dimethyldodecylamine, diphenoxyphosphine, strontium titanate, ammonium hexachloroiridate, polyester resin, naphthol The mass ratio of phenolic resin, maleic anhydride and aluminum nitride is 8:18:20:5:3:60:100:20:5;
[0044] (2) Mix the silanol compound with tetraglycidyl-4,4'-diaminodiphenyl ether, stir at 90°C for 25 minutes, add phosphorus-containing phenolic resin, stir for 10 minutes, add bisphenol A epoxy resin, poly Urea formaldehyde, after stirring for 40...
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