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Nanometer carbon fiber copper powder-loaded composite paste

A technology of nano-carbon fiber and composite slurry, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, parts of fixed capacitors, electrical components, etc., and can solve problems such as unsuitable for industrial production, limited adhesion, and high cost , to achieve the effect of not easy copper ion diffusion, strong anti-aging ability and strong adhesion

Active Publication Date: 2018-01-23
WUXI HOUFA AUTOMATIC EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high cost of this type of slurry and the cumbersome preparation process, the slurry contains more harmful substances and is not suitable for industrial utilization
[0003] CN101136261B discloses a copper electrode slurry and a preparation method thereof. Although the slurry has low cost, it has poor electrical conductivity and is not suitable for industrialized production
When the slurry has limited adhesion, it is not easy to perfectly bond with the substrate

Method used

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  • Nanometer carbon fiber copper powder-loaded composite paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A composite slurry of nano-carbon fiber loaded copper powder, comprising the following components by weight: 30 parts of nano-copper powder, 12 parts of nano-carbon fiber, 20 parts of glass powder, 20 parts of organic solvent, 2 parts of xylene, hydrophilic 22 parts of high-molecular compounds, 8 parts of additives; the particle size of the carbon nanofiber is 20 μm, and the porosity is 65%; the organic solvent is formed by mixing dopamine solution, chitosan and isopropanol, and The weight ratio with isopropanol is 2:1:1.

[0017] Wherein, the hydrophilic polymer compound is a condensation product of polyvinyl alcohol, ethylene oxide, and glycerol, with an average molecular weight of 4000 and a molar ratio of 3:2:1.

[0018] The specific surface area of ​​the nano copper powder is 25m 2 / g.

[0019] The auxiliary agent is formed by mixing silane coupling agent KH792, leveling agent and hydrogenated castor oil.

[0020] The concentration of the dopamine solution is 1m...

Embodiment 2

[0023] A composite slurry of nano-carbon fiber loaded copper powder, comprising the following components by weight: 45 parts of nano-copper powder, 22 parts of nano-carbon fiber, 25 parts of glass powder, 26 parts of organic solvent, 6 parts of xylene, hydrophilic 25 parts of permanent high molecular compound, 10 parts of additives.

[0024] The hydrophilic macromolecular compound is a condensation product of polyvinyl alcohol, ethylene oxide, and glycerin, with an average molecular weight of 5000 and a molar ratio of 3:2:1.

[0025] The specific surface area of ​​the nano copper powder is 32m 2 / g.

[0026] The auxiliary agent is formed by mixing silane coupling agent KH792, leveling agent and hydrogenated castor oil.

[0027] The concentration of the dopamine solution is 1.5mol / L.

[0028] Specifically, after dissolving carbon nanofibers in an organic solvent and immersing them at low temperature for 20-40 hours, adding nanometer copper powder, stirring evenly, and then s...

Embodiment 3

[0030] A composite slurry of nano-carbon fiber loaded copper powder, comprising the following components by weight: 50 parts of nano-copper powder, 24 parts of nano-carbon fiber, 28 parts of glass powder, 30 parts of organic solvent, 8 parts of xylene, hydrophilic 28 parts of high-molecular compounds, 12 parts of additives; the particle size of the carbon nanofibers is 30 μm, and the porosity is ≥ 65%; the organic solvent is formed by mixing dopamine solution, chitosan and isopropanol The weight ratio of sugar and isopropanol is 5:2:1.

[0031] The hydrophilic macromolecular compound is a condensation product of polyvinyl alcohol, ethylene oxide, and glycerol, with an average molecular weight of 6000 and a molar ratio of 3:2:1.

[0032] The specific surface area of ​​the nano copper powder is 40m 2 / g.

[0033] The auxiliary agent is formed by mixing silane coupling agent KH792, leveling agent and hydrogenated castor oil.

[0034] The concentration of the dopamine solution ...

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Abstract

The invention discloses nanometer carbon fiber copper powder-loaded composite paste. The composite paste comprises the following constituents based on parts by weight: 30-50 parts of nanometer copperpowder, 12-24 parts of nanometer carbon fiber, 20-28 parts of glass powder, 20-30 parts of organic solvent, 2-8 parts of xylene, 22-28 parts of hydrophilic macromolecular compound and 8-12 parts of additive, the grain size of the nanometer carbon fiber is 20-30 micrometers, the porosity is larger than or equal to 65%, the organic solvent is formed by mixing a dopamine solution, chitosan and isopropyl alcohol, and the weight ratio of the dopamine solution, the chitosan and the isopropyl alcohol is (2-5):(1-2):1. Compared with the prior art, the nanometer carbon fiber copper powder-loaded composite paste has high adhesive force, good conductivity and high aging resistant capability, and a copper electrode prepared from the paste is difficult to generate copper ion diffusion.

Description

technical field [0001] The invention belongs to the field of conductive paste, and in particular relates to a composite paste containing copper powder supported by nano-carbon fibers. Background technique [0002] Electrode paste is suitable for electronic components such as resistors and capacitors. Most of the existing electrode pastes are noble metal silver pastes and ohmic pastes. Due to the high cost of this type of slurry and the cumbersome preparation process, the slurry contains more harmful substances and is not suitable for industrialized utilization. [0003] CN101136261B discloses a copper electrode slurry and a preparation method thereof. Although the slurry has low cost, it has poor electrical conductivity and is not suitable for industrial production. [0004] Application number 201510706257.3, titled a copper conductive paste and its preparation method, the copper conductive paste includes 70-90% by weight of copper phosphide powder, 1-10% of glass powder, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/24H01G9/042H01G4/008
Inventor 钱国东
Owner WUXI HOUFA AUTOMATIC EQUIP CO LTD
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