Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Epoxy resin conductive adhesive for electronic packaging

An epoxy resin, electronic packaging technology, applied in the direction of epoxy resin glue, conductive adhesive, adhesive, etc., can solve the problems of poor electrical conductivity and shear strength of conductive glue, improve the interface contact state, improve the shear strength, etc. The effect of improving shear strength and bond strength

Inactive Publication Date: 2018-02-13
常州市沃兰特电子有限公司
View PDF2 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem mainly solved by the present invention is: aiming at the problem of poor conductivity and shear strength of traditional conductive adhesives, an epoxy resin conductive adhesive for electronic packaging is provided

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0021] Add the nano-copper powder and the dopamine solution with a mass concentration of 2g / L into the No. 1 beaker at a mass ratio of 1:60, stir and mix and soak for 2 hours at a rotating speed of 500r / min to obtain the nano-copper powder soaking solution, and then The nano copper powder soaking solution is filtered to obtain the modified nano copper powder wet material, and then the modified nano copper powder wet material is placed in a vacuum freeze-drying oven for 50 minutes to obtain the modified nano copper powder; silver nanowires and dopamine solution Add it into the No. 2 beaker at a mass ratio of 1:60, stir, mix and soak for 2 hours at a rotating speed of 500r / min to obtain the silver nanowire soaking solution, and then filter the silver nanowire soaking solution to obtain the modified silver nanowire Wet material, then the modified silver nanowire wet material is placed in a vacuum freeze-drying box and dried for 50min to obtain the modified silver nanowire; Graphen...

example 2

[0023]Add the silver nanowire and dopamine solution into the No. 2 beaker at a mass ratio of 1:60, stir and mix and soak for 2 hours at a rotating speed of 500r / min to obtain the silver nanowire soaking solution, and then filter the silver nanowire soaking solution , to obtain the modified silver nanowire wet material, and then place the modified silver nanowire wet material in a vacuum freeze-drying oven to dry for 50 minutes to obtain the modified silver nanowire; add graphene oxide and graphene oxide 5 times the quality of water Stir and mix the No. 3 beaker for 30 minutes at a rotational speed of 600r / min to obtain a mixed solution. Put the beaker in a freezer and freeze it for 2 hours at a temperature of -20°C, then place the frozen mixed solution in a freezer and pulverize it. Frozen and crushed in the machine for 30 minutes to obtain frozen powder, then put the frozen powder in a No. 4 beaker, heat and stir to dissolve for 40 minutes at a temperature of 80°C and a rotati...

example 3

[0025] Add the nano-copper powder and the dopamine solution with a mass concentration of 2g / L into the No. 1 beaker at a mass ratio of 1:60, stir and mix and soak for 2 hours at a rotating speed of 500r / min to obtain the nano-copper powder soaking solution, and then Nano-copper powder soaking solution is filtered to obtain modified nano-copper powder wet material, and then the modified nano-copper powder wet material is placed in a vacuum freeze-drying oven for 50 minutes to obtain modified nano-copper powder; graphene oxide and graphite oxide Add water 5 times the mass of alkene into No. 3 beaker, and stir and mix for 30 minutes at a speed of 600 r / min to obtain a mixed solution. Put the beaker in a freezer and freeze for 2 hours at a temperature of -20°C, and then freeze The mixed solution was frozen and pulverized for 30 minutes in a frozen pulverizer to obtain a frozen powder, and then the frozen powder was placed in a No. 4 beaker, and heated and stirred for 40 minutes at ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses epoxy resin conductive adhesive for electronic packaging, and belongs to the technical field of adhesive. The epoxy resin conductive adhesive for electronic packaging is prepared from the following steps: stirring and mixing graphene oxide and water in an amount which is 10 to 20 times of the weight of the graphene oxide, cryogenic grinding, dissolving, filtering and dryingto obtain pretreated graphene oxide; and performing heating, stirring and refluxing reaction on 5 to 6 parts of graphene oxide, 8 to 10 parts of polyamine curing agent and 15 to 20 parts of diluent,adding 50 to 60 parts of epoxy resin, 5 to 6 parts of modified nano-copper powder, 5 to 6 parts of modified silver nanowire and 1 to 2 parts of coupling agent, stirring and mixing to obtain the epoxyresin conductive adhesive for electronic packaging. The epoxy resin conductive adhesive for electronic packaging, which is provided by the technical scheme of the invention, has excellent electrical conductivity and shearing strength.

Description

technical field [0001] The invention discloses an epoxy resin conductive adhesive used for electronic packaging, which belongs to the technical field of adhesives. Background technique [0002] The traditional Pb-Sn solder commonly used in microelectronic packaging has a history of decades, and it has the characteristics of low melting point, good wettability, easy processing, and excellent electrical and mechanical properties. However, with the continuous development of microelectronics technology, the development trend of miniaturization of electronic components and high integration of printed circuit boards, the minimum pitch of Pb-Sn welding of 0.65mm can no longer meet the actual needs of electronic packaging, and Pb-Sn Sn solder also has disadvantages such as poor creep resistance, high density, poor wettability with organic materials, high soldering temperature and serious lead pollution, so its application space is greatly limited. [0003] Conductive adhesive, as a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02C08G59/50
CPCC08G59/5006C08K3/04C08K7/06C08K9/04C08K2003/085C08K2201/011C09J9/02C09J163/00
Inventor 徐啸飞殷小祥张琳
Owner 常州市沃兰特电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com