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Flexible Copper Clad Laminates

A copper-clad, flexible technology, applied in the field of flexible copper-clad laminates, can solve the problems of increased equipment costs and achieve high bending resistance

Active Publication Date: 2019-10-08
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method can ensure sufficient time for lamination by increasing the number of rollers, etc., but there are problems such as increased equipment costs.

Method used

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  • Flexible Copper Clad Laminates
  • Flexible Copper Clad Laminates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0047] Hereinafter, the present invention will be further described in detail based on examples. In addition, each characteristic evaluation in the following Examples was performed by the following method.

[0048] [Measurement of crystal orientation I / Io by XRD]

[0049] Regarding the crystal orientation of the (200) crystal plane of the copper foil, the (200) crystal plane diffraction intensity (I) of the sample was calculated by the XRD method using Mo as the cathode (200) relative to the X-ray diffraction of the fine powder copper. ) value of crystal plane diffraction intensity (Io), and defined as I / Io value.

[0050] [Measurement of Bending Properties]

[0051] A commercially available photoresist film is bonded to a double-sided flexible copper-clad laminate composed of copper foil / polyimide / copper foil, and after exposure with a predetermined mask for pattern formation, the bonded The copper foil on one side of the photoresist film is etched to remove the entire cop...

Synthetic example 1

[0073] In a reaction vessel equipped with a thermocouple and a stirrer and capable of introducing nitrogen, add N,N-dimethylacetamide, and put 2,2-bis[4-(4-aminophenoxy)phenyl into the reaction vessel ] Propane (BAPP) and dissolve it while stirring in the container. Next, pyromellitic dianhydride (PMDA) was charged so that the total amount of monomers charged would be 12% by weight. After that, the stirring was continued for 3 hours to carry out the polymerization reaction to obtain a resin solution of polyamic acid a. The glass transition temperature of the polyimide obtained from this polyamic acid a was 310 degreeC, and the linear thermal expansion coefficient was 45 ppm / K.

Synthetic example 2

[0075] Add N,N-dimethylacetamide to a reaction vessel equipped with a thermocouple and a stirrer and capable of introducing nitrogen, and put 2,2'-dimethyl-4,4'-diaminobiphenyl ( m-TB), and dissolve it while stirring in the container. Next, 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) was charged so that the total amount of monomers charged was 15 wt%, and the molar ratio of each acid anhydride (BPDA:PMDA) was 20:80. and pyromellitic dianhydride (PMDA). After that, the stirring was continued for 3 hours to carry out the polymerization reaction to obtain a resin solution of polyamic acid b. The glass transition temperature of the polyimide obtained from this polyamic acid b was 380 degreeC, and the linear thermal expansion coefficient was 8 ppm / K.

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Abstract

The present invention provides a flexible copper-clad laminate excellent in bendability by a simple method using a pair of hot press rolls. A method for manufacturing a flexible copper-clad laminate, comprising a heat-compression bonding step and a reheating step of heat-compression bonding a copper foil (A) and a laminate (B) such as a polyimide film using a heat press roll, the laminate The polyimide layer in (B) is composed of a multi-layer polyimide layer having a thermoplastic polyimide layer (ii) as an adhesive layer, and the lamination temperature T1 of the thermocompression bonding process is a thermoplastic polyimide The glass transition temperature of the layer (ii) is higher than the glass transition temperature, and by setting the heat treatment temperature T2 in the reheating step to T1 or higher, the copper foil (A) after the thermocompression bonding step is determined by X-ray diffraction in the thickness direction. The relationship between the diffraction intensity (I) of the (200) crystal plane and the diffraction intensity (Io) of the (200) crystal plane of fine powder copper obtained by X-ray diffraction is I / Io>100.

Description

[0001] The patent application of the present invention is a divisional application for the application dated March 27, 2014, the application number is 201410119210.2, and the invention name is "Manufacturing method of flexible copper-clad laminate". technical field [0002] The present invention relates to a method of manufacturing a flexible copper-clad laminate used in a flexible circuit board that is suitable for being folded into a beaded shape for storage in a narrow space of a casing of a mobile phone, a smartphone, a tablet computer, etc. Or uses such as read and write cables for hard disk drives that are continuously and repeatedly bent with a small radius of curvature. It should be noted that curling refers to a form that is bent with a fold line in order to be accommodated in a thin case. Hereinafter, in this specification, the upper side of the FPC is reversed by approximately 180° to become the lower side. The case of bending in this way is called "curling". Back...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08B32B15/20B32B27/28H05K1/03H05K1/09H05K3/02
CPCB32B15/08B32B15/20B32B27/281H05K1/036H05K1/09H05K3/022B32B27/08B32B2311/12B32B2457/08C08G73/1082
Inventor 松下祐之井伊正一
Owner NIPPON STEEL CHEM &MATERIAL CO LTD