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Lead-free environmental-protection micro electronic welding solder paste and preparation method thereof

A micro, electronic technology, applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., to achieve the effect of high welding quality, good solderability and simple steps

Inactive Publication Date: 2018-04-13
河南格瑞恩工业科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the defect that the solder paste in the prior art cannot meet the requirements of microelectronic soldering technology, and provide a lead-free environmental protection miniature electronic solder paste and its preparation method. The components have good solderability, and can meet the welding of smaller pitches, with less residue. The preparation method is simple, and the solder paste obtained after production has fewer irregular tin beads, which reduces the frequency of rework and improves Product yield

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1: A kind of lead-free environment-friendly miniature electronic soldering solder paste is made up of the following components of weight: citric acid 5Kg, dibasic carboxylic acid 2Kg, cetyl sodium sulfonate 1Kg, fatty amine polyoxyethylene ether 0.5 Kg , Cetyl Dimethyl Amine Oxide 2.5 Kg, Octadecyl Dimethyl Benzyl Ammonium Chloride 0.5 Kg, Linolenic Acid 1.0 Kg, Malic Acid 0.1 Kg, Polyethylene Glycol 5 Kg, Ethylene Glycol Monobutyl Ether 8 Kg, benzotriazole 2.5 Kg, tin powder 50 Kg.

[0029] A preparation method of lead-free environment-friendly miniature electronic solder paste, comprising the following steps:

[0030] a) Take the raw materials by the following parts by weight: citric acid 5Kg, dicarboxylic acid 2Kg, sodium cetyl sulfonate 1Kg, fatty amine polyoxyethylene ether 0.5 Kg, cetyl dimethyl amine oxide 2.5 Kg, Octadecyldimethylbenzyl ammonium chloride 0.5 Kg, linolenic acid 1.0 Kg, malic acid 0.1 Kg, polyethylene glycol 5 Kg, ethylene glycol monob...

Embodiment 2

[0034] Embodiment 2: A kind of lead-free environment-friendly miniature electronic solder paste, is made up of the following components of weight: citric acid 12Kg, dibasic carboxylic acid 7 Kg, cetyl sodium sulfonate 3.5 Kg, aliphatic amine polyoxyethylene ether 1.5 parts, cetyl dimethyl amine oxide 6.5 Kg, octadecyl dimethyl benzyl ammonium chloride 4.5 Kg, linolenic acid 6 Kg, salicylic acid 2 Kg, polyethylene glycol 20 Kg, organic solvent 11 Kg, benzotriazole 5 Kg, tin powder 80 Kg.

[0035] A preparation method of lead-free environment-friendly miniature electronic solder paste, comprising the following steps:

[0036] a) Weigh the raw materials according to the following parts by weight: 12 Kg of citric acid, 7 Kg of dicarboxylic acid, 3.5 Kg of sodium cetyl sulfonate, 1.5 parts of fatty amine polyoxyethylene ether, cetyl dimethyl amine oxide 6.5 Kg, octadecyldimethylbenzyl ammonium chloride 4.5Kg, linolenic acid 6 Kg, salicylic acid 2 Kg, polyethylene glycol 20 Kg, eth...

Embodiment 3

[0040] Embodiment 3: A kind of lead-free environmental protection miniature electronic soldering solder paste is made up of the following components of weight: 5 Kg of citric acid, 7 Kg of dibasic carboxylic acid, 1 Kg of sodium cetyl sulfonate, aliphatic amine polyoxyethylene Ether 1.5 Kg, cetyl dimethyl amine oxide 2.5 Kg, octadecyl dimethyl benzyl ammonium chloride 4.5 Kg, linolenic acid 1.0 Kg, salicylic acid 2 Kg, polyethylene glycol 5 Kg, ethylene glycol Alcohol monobutyl ether 11 Kg, benzotriazole 2.5 Kg, tin powder 80 Kg.

[0041] A preparation method of lead-free environment-friendly miniature electronic solder paste, comprising the following steps:

[0042]a) Weigh raw materials according to the following parts by weight: 5 Kg of citric acid, 7 Kg of dicarboxylic acid, 1 Kg of sodium cetyl sulfonate, 1.5 Kg of fatty amine polyoxyethylene ether, cetyl dimethyl amine oxide 2.5 Kg, octadecyldimethylbenzyl ammonium chloride 4.5 Kg, linolenic acid 1.0 Kg, salicylic acid ...

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Abstract

The invention relates to the field of welding solder paste, in particular to lead-free environmental-protection micro electronic welding solder paste and a preparation method thereof. The lead-free environmental-protection micro electronic welding solder paste consists of the following components in parts by weight: 5-12 parts of citric acid, 2-7 parts of dicarboxylic acid, 1-3.5 parts of hexadecyl sodium sulfonate, 0.5-1.5 parts of fatty amine polyoxyethylene ether, 2.5-6.5 parts of cetyl dimethyl amine oxide, 0.5-4.5 parts of octadecyl dimethyl benzyl ammonium chloride, 1.0-6 parts of linolenic acid, 0.1-2 parts of active additive, 5-20 parts of polyethylene glycol, 8-11 parts of organic solvent, 2.5-5 parts of benzotriazole, and 50-80 parts of tin powder. The process comprises the stepsof weighing, heating and stirring, grinding and mixing. The solder paste is better in weldability on various plates and devices, can meet small-gap welding, and is fewer in residue; and the preparation method is simple in step, is fewer in irregular solder bead after welding of the prepared solder paste, reduces the rework frequency, and improves the product yield.

Description

technical field [0001] The invention relates to the field of solder paste, in particular to a lead-free environment-friendly miniature electronic solder paste and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry in recent years, especially the explosive growth of consumer electronics, the miniaturization and thinning of electronic products has become the mainstream trend in the development of electronic equipment in the future. In order to comply with this trend, microelectronic welding technology Research has become one of the hot directions in many research institutions. In the modern electronics industry, the welding of electronic products by solder paste is an important production link. Solder paste is also one of the very important process materials in the field of microelectronic welding. Its quality seriously affects the final quality of electronic products. According to statistics, SMT (Surface mount ...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/363
CPCB23K35/025B23K35/262B23K35/3612B23K35/362
Inventor 王洪涛
Owner 河南格瑞恩工业科技有限公司
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