Mono-crystalline gallium-doped back passivation solar cell and preparation method thereof
A solar cell and back passivation technology, applied in the field of solar cells, can solve the problems of solar cell efficiency reduction, reduction of minority carrier diffusion length, and reduction of minority carrier lifetime
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0042] A method for preparing a solar cell of the present invention comprises the following steps:
[0043] 1) Texturing and cleaning the surface of the gallium-doped silicon substrate;
[0044] 2) Prepare the emitter;
[0045] 3) Perform edge insulation treatment; the insulation treatment method is a wet etching method, and the wet etching method includes the use of HNO-containing 3 , HF mixed acidic solution or chemical etching method using alkaline solution containing potassium hydroxide, sodium hydroxide, tetramethylammonium hydroxide, etc.
[0046] 4) Preparation of passivation anti-reflection film on the front side and preparation of passivation film on the back side;
[0047] 5) Perform local film opening on the back passivation film; the local film opening process of the passivation film can use chemical etching slurry to form local contact patterns, and can also use laser film opening method to form local contact patterns.
[0048] 6) patterning and forming an electr...
Embodiment 1
[0052] The first step is to carry out surface texturing on the monocrystalline gallium-doped silicon wafer; this gallium-doped silicon wafer has a side-to-side distance of 156.75mm, a square shape, does not contain boron in the silicon wafer, and contains gallium at a concentration of 2×10 16 atoms / cubic centimeter. In this regard, the monocrystalline gallium-doped silicon wafer is textured by using NaOH solution in a tank cleaning machine to form a pyramid structure on the surface. The temperature of the solution is 80°C, and the duration is 10 minutes. And after HF pickling, water washing, drying and other steps, the surface metal ions are removed.
[0053] The second step is to prepare the emitter. The preparation of the pn junction is completed in the tubular heating diffusion furnace tube, using N 2 Carry POCl 3 source. The diffusion peak temperature was 850°C, and the diffusion time was 110 minutes.
[0054] The third step is to carry out insulation treatment. The...
Embodiment 2
[0060] The first step is to perform surface texturing on the single-crystal gallium-doped silicon wafer; this gallium-doped silicon wafer has a distance between sides of 156.75 mm, a square shape, boron in the silicon wafer, and a boron concentration of 5×10 16 atoms / cubic centimeter, containing gallium at a concentration of 1×10 14 atoms / cubic centimeter. In this regard, the monocrystalline gallium-doped silicon wafer is textured by using NaOH solution in a tank cleaning machine to form a pyramid structure on the surface. The temperature of the solution is 80°C, and the duration is 10 minutes. And after HF pickling, water washing, drying and other steps, the surface metal ions are removed.
[0061] The second step is to prepare the emitter. The preparation of the pn junction is completed in the tubular heating diffusion furnace tube, using N 2 Carry POCl 3 source. The diffusion peak temperature was 850°C, and the diffusion time was 110 minutes.
[0062] The third step ...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com