A polycrystalline WC thin film with high stoichiometric ratio and its low-temperature preparation method
A stoichiometric ratio, thin film technology, applied in metal material coating process, vacuum evaporation plating, coating and other directions, can solve the problems of no reports, feasibility can not meet the requirements, etc., to improve the crystal quality, excellent crystal quality, The effect of meeting the needs of low temperature process
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Embodiment 1
[0023] The low-temperature preparation method of a polycrystalline WC film with a high stoichiometric ratio of the present invention, the specific process is: adopt the DC magnetron sputtering method, use the Si sheet as the substrate, and bombard it with Ar plasma before use; select high-purity W metal target and graphite target, using double target co-sputtering method, W target sputtering power 100W, graphite target sputtering power 120W; high-purity Ar-CH 4 The mixed gas is the working gas, when the reaction chamber is evacuated to a background vacuum higher than 1×10 –4 After Pa, pass into Ar-CH 4 Mixed gas, Ar:CH 4 Partial pressure ratio 1:1, gas pressure 1.5Pa; WC thin film in Ar-CH 4 grown in a plasma atmosphere at a growth temperature of 300 °C.
[0024] The obtained polycrystalline WC thin film is subjected to a performance test, and the test results are as follows: figure 1 In the XRD pattern of the WC film prepared in this example, three diffraction peaks appea...
Embodiment 2
[0026] The low-temperature preparation method of a polycrystalline WC film with a high stoichiometric ratio of the present invention, the specific process is: adopt the DC magnetron sputtering method, use the Si sheet as the substrate, and bombard it with Ar plasma before use; select high-purity W metal target and Takamura graphite target, using double-target co-sputtering method, W target sputtering power 100W, graphite target sputtering power 120W; high-purity Ar-CH 4 The mixed gas is the working gas, when the reaction chamber is evacuated to a background vacuum higher than 1×10 –4 After Pa, pass into Ar-CH 4 Mixed gas, Ar:CH 4 Partial pressure ratio 1:1, gas pressure 1.5Pa; WC thin film in Ar-CH 4 grown in a plasma atmosphere at a growth temperature of 400 °C.
[0027]The prepared polycrystalline WC film was tested for performance, and the test results were as follows: the WC film is polycrystalline, the strongest X-ray diffraction peak is (100) diffraction peak, and has...
Embodiment 3
[0029] The low-temperature preparation method of a polycrystalline WC film with a high stoichiometric ratio of the present invention, the specific process is: adopt the DC magnetron sputtering method, use the Si sheet as the substrate, and bombard it with Ar plasma before use; select high-purity W metal target and Takamura graphite target, using double-target co-sputtering method, W target sputtering power 100W, graphite target sputtering power 120W; high-purity Ar-CH 4 The mixed gas is the working gas, when the reaction chamber is evacuated to a background vacuum higher than 1×10 –4 After Pa, pass into Ar-CH 4 Mixed gas, Ar:CH 4 Partial pressure ratio 1:1, gas pressure 1.5Pa; WC thin film in Ar-CH 4 grown in a plasma atmosphere at a growth temperature of 500 °C.
[0030] The prepared polycrystalline WC film was tested for performance, and the test results were as follows: the WC film is polycrystalline, the strongest X-ray diffraction peak is (100) diffraction peak, and ha...
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