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A kind of preparation method of copper clad laminate

A technology for copper clad laminates and preparation steps, which is applied in the field of preparation of copper clad laminates, can solve problems such as poor mechanical properties and insulation properties, and achieve the effects of improving mechanical properties and thermal conductivity, toughness, and thermal conductivity

Active Publication Date: 2019-10-25
陕西宏欣宁电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main technical problem to be solved by the present invention is to provide a preparation method for copper clad laminates aimed at improving the shortcomings of traditional copper clad laminates, such as thermal conductivity, poor mechanical properties and poor insulation performance.

Method used

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  • A kind of preparation method of copper clad laminate

Examples

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Effect test

example 1

[0025]Mix the glass fiber and silane coupling agent in a beaker at a mass ratio of 1:5, and add water 10 times the mass of the glass fiber into the beaker, and move the beaker into a magnetic stirrer with a digital display speed measurement and constant temperature. Under the condition of 280r / min, stir and mix at a constant temperature for 3 hours, filter to obtain a filter cake, dry the filter cake at a temperature of 90°C for 40 minutes, and obtain pretreated glass fiber, and mix the pretreated glass fiber with rubber emulsion Mix at a mass ratio of 1:8, soak at a constant temperature of 55°C for 2 hours, and then filter to obtain modified glass fibers; mix the modified glass fibers and polypropylene fibers at a mass ratio of 1:3, and pour them into the modified glass Add silicon carbide fiber of 0.6 times the mass of modified glass fiber to the mixture of fiber and polypropylene fiber, stir and mix for 40min at a speed of 200r / min to obtain a mixed fiber material, which is ...

example 2

[0027] Mix glass fiber and polypropylene fiber at a mass ratio of 1:3, and add silicon carbide fiber 0.6 times the mass of glass fiber to the mixture of glass fiber and polypropylene fiber, stir and mix for 40 minutes at a speed of 200r / min to obtain a mixture Fiber material, the mixed fiber material is opened, carded, laid and needle-punched to obtain a semi-finished glass fiber board. Graphite oxide and paraffin wax are mixed in the ball mill according to the mass ratio of 1:3, and zirconia ball milling beads with 5 times the mass of graphite oxide are added to the ball mill, and after ball milling and mixing for 40 minutes, the material is discharged to obtain pretreated graphite; Mix sepiolite and water in a flask at a mass ratio of 1:8, add silicon nitride powder 0.5 times the mass of sepiolite and aluminum nitride powder 0.4 times the mass of sepiolite to the flask, and move the flask into an ultrasonic vibration instrument, ultrasonically oscillate for 25 minutes at a f...

example 3

[0029] Mix the glass fiber and silane coupling agent in a beaker at a mass ratio of 1:5, and add water 10 times the mass of the glass fiber into the beaker, and move the beaker into a magnetic stirrer with a digital display speed measurement and constant temperature. Under the condition of 280r / min, stir and mix at a constant temperature for 3 hours, filter to obtain a filter cake, dry the filter cake at a temperature of 90°C for 40 minutes, and obtain pretreated glass fiber, and mix the pretreated glass fiber with rubber emulsion Mix at a mass ratio of 1:8, soak at a constant temperature of 55°C for 2 hours, and then filter to obtain modified glass fibers; mix the modified glass fibers and polypropylene fibers at a mass ratio of 1:3, and rotate at a speed of 200r / Stir and mix for 40 minutes under the condition of 1 min to obtain a mixed fiber material. After the mixed fiber material is opened, carded, laid and needled, a semi-finished glass fiber board is obtained. Finally, ...

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Abstract

The invention discloses a preparation method for a copper clad laminate, and belongs to the field of heat conductive materials. The method comprises the following steps: weighing 30-40 parts by weightof epoxy resin, 2-3 parts by weight of an antioxidant, 3-5 parts by weight of a flame retardant, 7-10 parts by weight of pretreated graphite and 12-18 parts by weight of modified sepiolite in sequence, moving the raw materials into a reaction kettle, and performing mixing under stirring to obtain a thermal conductive adhesive; and coating copper foil by the thermal conductive adhesive to obtain asingle sided board, drying the single sided board to obtain a pre-processed single sided board, separately attaching two pre-processed single sided boards to a modified glass fiber board in the manner that the thermal conductive adhesives are opposite to each other to obtain a blank, and performing lamination on the blank at a high temperature, so as to obtain the copper clad laminate. The copperclad laminate prepared by the method provided by the invention has excellent thermal conductivity, and the insulating performance and mechanical properties of the copper clad laminate are superior tothose of a conventional copper clad laminate.

Description

technical field [0001] The invention discloses a method for preparing a copper-clad laminate, which belongs to the field of heat-conducting materials. Background technique [0002] With the continuous development of printed circuit boards (PCBs) towards high density and multi-layers, the space for mounting and installing components on PCBs has been greatly reduced, and the power requirements of power components for complete electronic products are getting higher and higher. High power in a small space will inevitably generate more heat accumulation, resulting in degradation or even damage to the electrical performance of components. In addition, the application market of PCBs that need to work in a high heat-resistant environment for a long time, such as LED substrates, new power modules, automotive electronics, and highly integrated IC packaging substrates, is expanding rapidly. For a substrate carrying components and conducting circuits between them, the new function of h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/06B32B37/10B32B37/12B32B17/02B32B17/06B32B15/20B32B15/14B32B27/02B32B27/32B32B9/04B32B7/12B32B33/00C09J163/00C09J11/04D04H1/46D04H1/4218D04H1/4209D04H1/4291C03C25/54
CPCB32B5/022B32B5/08B32B7/12B32B15/14B32B15/20B32B33/00B32B37/06B32B37/10B32B37/1207B32B2037/1215B32B2262/0253B32B2262/10B32B2262/101B32B2262/14B32B2307/206B32B2307/302B32B2457/08C03C25/54C08K3/04C08K3/346C08K9/02C08K9/08C09J11/04C09J163/00D04H1/4209D04H1/4218D04H1/4291D04H1/46
Inventor 江黛玉徐珉陈一水
Owner 陕西宏欣宁电子科技有限公司
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