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Resist composition with good hole shielding function capable of depicting exposure images

A technology of resist and composition, applied in photosensitive materials for optomechanical equipment, optics, optomechanical equipment, etc., can solve the problem of poor film mechanical strength, poor hole-masking performance, and reduced resist thickness, etc. problems, achieve the effects of improving flexibility, excellent photosensitivity, and improving the hole-masking performance of the film layer

Active Publication Date: 2018-07-03
杭州福斯特电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the resolution, reducing the thickness of the resist layer is a way, but reducing the thickness of the resist will make the mechanical strength of the cured film worse and the hole-masking performance worse.

Method used

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  • Resist composition with good hole shielding function capable of depicting exposure images
  • Resist composition with good hole shielding function capable of depicting exposure images
  • Resist composition with good hole shielding function capable of depicting exposure images

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example

[0064] Compound shown in synthetic general formula (I):

[0065] Add 1mol of phthalic anhydride, 0.20mol of butanol, 4.44g of p-toluenesulfonic acid into the reactor, 100mL of xylene, install a thermometer, water separator and reflux condenser, stir and heat to reflux for 2.5h. Then add 1mol ethylene glycol, continue to reflux for 4h. Next, at the reflux temperature, a mixed solution of 1.05 mol of acrylic acid and 0.02 mol of thiaphenazine was added dropwise to the reactor for about 2 hours. After the dropwise addition was completed, the mixture was kept for 5 hours. Then cool down to 40°C, extract with about 150mL of 5% mass fraction of sodium hydroxide, remove the water phase, then extract and wash the organic phase with 150mL of water for 2 to 3 times, dry the organic phase with sodium carbonate, filter, and add 0.107g of p-hydroxybenzene Methyl ether, xylene was distilled off under reduced pressure, and the residue was the compound (I-1) of general structural formula (I)...

Embodiment 1-5、 comparative example 1-2

[0073] Examples 1-5 and Comparative Examples 1-2 respectively provide a resist composition, the specific formulation of which is shown in Table 1.

[0074] Table 1: Resist composition formula table of different embodiments and comparative examples

[0075]

[0076] Remark:

[0077] 1. Alkali-soluble copolymer resin A-1~A-3

[0078] A-1: Methacrylic acid / methyl methacrylate / hydroxyethyl methacrylate / styrene=17 / 72 / 6 / 5, weight average molecular weight 82,000, solid content 40%, acid value 110.1mgKOH / g dry resin. (The dry resin represents the resin after deducting the solvent, the same applies hereinafter).

[0079] A-2: Methacrylic acid / methyl methacrylate / hydroxyethyl methacrylate / styrene=23 / 59 / 6 / 12, weight average molecular weight 97,000, solid content 40%, acid value 150mgKOH / g dry resin.

[0080] A-2: Methacrylic acid / methyl methacrylate / butyl acrylate / hydroxyethyl methacrylate / styrene=30 / 34 / 10 / 6 / 20, the weight average molecular weight is 127,000, and the solid conte...

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PUM

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Abstract

The invention discloses a resist composition with a good hole shielding function capable of depicting exposure images. The resist composition comprises the following components in parts by weight: 50-65 parts of alkali soluble copolymer resin, 35-50 parts of a photopolymerized compound and 0.5-7 parts of a photoinitiator, wherein the total weight of the alkali soluble copolymer resin and the photopolymerized compound are 100 parts by weight; the photopolymerized compound is composed of a 5-30% of methacrylate compound and 70-95% of a compound with vinyl unsaturated bonds in the molecular structural formula. The resist composition for directly depicting exposure has the comprehensive performance of excellent light sensitivity, resolution ratio, hole covering property and the like, and can form fine resist shapes and manufacture a highly fine printed circuit board efficiently.

Description

technical field [0001] The invention relates to a resist for printed circuit boards, in particular to a resist composition which can be used for covering holes and can directly describe, expose and image. Background technique [0002] The manufacturing methods of printed circuit boards mainly include masking method and pattern plating method. The mask method is to use a protective layer to protect the copper through hole for mounting the connector, and then etches and removes the film to form a circuit. The graphic electroplating method electroplates copper in the through hole by electroplating, and then protects it by tinning solder, and forms a circuit after removing the film and etching. [0003] In the masking method, the through holes of the substrate or the via holes used for interlayer connection are covered with a resist composition to protect the metal in the holes from being etched. In this method, alkali development using an aqueous solution of sodium carbonate ...

Claims

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Application Information

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IPC IPC(8): G03F7/027G03F7/004
CPCG03F7/004G03F7/027
Inventor 李志强朱薛妍李伟杰周光大林建华
Owner 杭州福斯特电子材料有限公司